カテゴリー： Market Monitor Global, 世界, 部品/材料

半導体パッケージングにおけるエポキシ成形材料の世界市場見通し2023年-2029年

◆英語タイトル：Epoxy Molding Compound in Semiconductor Packaging Market, Global Outlook and Forecast 2023-2029

Market Monitor Globalが発行した調査報告書（MMG23JU0676）◆商品コード：MMG23JU0676
◆発行会社（リサーチ会社）：Market Monitor Global
◆発行日：2023年6月（※2025年版があります。お問い合わせください。）
◆ページ数：79
◆レポート形式：英語 / PDF
◆納品方法：Eメール（受注後2-3営業日）
◆調査対象地域：グローバル、北米、アメリカ、ヨーロッパ、アジア、日本、中国、東南アジア、インド、南米、中東・アフリカなど
◆産業分野：化学＆材料
◆販売価格オプション（消費税別）
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Enterprise User（閲覧人数制限なし）USD4,875 ⇒換算￥702,000見積依頼/購入/質問フォーム
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❖ レポートの概要 ❖

Global Epoxy Molding Compound in Semiconductor Packaging Market 調査レポートは次の情報を含め、グローバルにおけるの半導体パッケージングにおけるエポキシ成形材料市場規模と予測を収録しています。・世界の半導体パッケージングにおけるエポキシ成形材料市場：売上、2018年-2023年、2024年-2029年
・世界の半導体パッケージングにおけるエポキシ成形材料市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界の半導体パッケージングにおけるエポキシ成形材料市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。アメリカ市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「一般エポキシモールディングコンパウンド」セグメントは今後6年間、000%の年平均成長率で2029年までに000Mドルに成長すると予測されています。

半導体パッケージングにおけるエポキシ成形材料のグローバル主要企業は、Samsung SDI、 Sumitomo Bakelite、 Showa Denko、 Eternal Materials、 Chang Chun Group、 KCC、 Duresco、 Hysol Huawei Electronics、 Jiangsu Huahai Chengkexin Material、 Beijing Kehua New Materialsなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

マーケットモニターグローバル社は、半導体パッケージングにおけるエポキシ成形材料のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別マーケット分析】

世界の半導体パッケージングにおけるエポキシ成形材料市場：タイプ別、2018年-2023年、2024年-2029年
世界の半導体パッケージングにおけるエポキシ成形材料市場：タイプ別市場シェア、2022年
・一般エポキシモールディングコンパウンド、グリーンエポキシモールディングコンパウンド

世界の半導体パッケージングにおけるエポキシ成形材料市場：用途別、2018年-2023年、2024年-2029年
世界の半導体パッケージングにおけるエポキシ成形材料市場：用途別市場シェア、2022年
・IC、ダイオード、トランジスタ、フォトカプラ、その他

世界の半導体パッケージングにおけるエポキシ成形材料市場：地域・国別、2018年-2023年、2024年-2029年
世界の半導体パッケージングにおけるエポキシ成形材料市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競争分析】

また、当レポートは主要な参入企業の分析を提供します。
・主要企業における半導体パッケージングにおけるエポキシ成形材料のグローバル売上、2018年-2023年
・主要企業における半導体パッケージングにおけるエポキシ成形材料のグローバル売上シェア、2022年
・主要企業における半導体パッケージングにおけるエポキシ成形材料のグローバル販売量、2018年-2023年
・主要企業における半導体パッケージングにおけるエポキシ成形材料のグローバル販売量シェア、2022年

さらに、当レポートは主要企業の情報を提示します。
Samsung SDI、 Sumitomo Bakelite、 Showa Denko、 Eternal Materials、 Chang Chun Group、 KCC、 Duresco、 Hysol Huawei Electronics、 Jiangsu Huahai Chengkexin Material、 Beijing Kehua New Materials

*************************************************************

・調査・分析レポートの概要
半導体パッケージングにおけるエポキシ成形材料市場の定義
市場セグメント
世界の半導体パッケージングにおけるエポキシ成形材料市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界の半導体パッケージングにおけるエポキシ成形材料市場規模
世界の半導体パッケージングにおけるエポキシ成形材料市場規模：2022年 VS 2029年
世界の半導体パッケージングにおけるエポキシ成形材料市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでの半導体パッケージングにおけるエポキシ成形材料の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業の半導体パッケージングにおけるエポキシ成形材料製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：一般エポキシモールディングコンパウンド、グリーンエポキシモールディングコンパウンド
半導体パッケージングにおけるエポキシ成形材料のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：IC、ダイオード、トランジスタ、フォトカプラ、その他
半導体パッケージングにおけるエポキシ成形材料の用途別グローバル売上・予測

・地域別市場分析
地域別半導体パッケージングにおけるエポキシ成形材料市場規模 2022年と2029年
地域別半導体パッケージングにおけるエポキシ成形材料売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業の情報（企業概要、事業概要、主要製品、売上、ニュースなど）
Samsung SDI、 Sumitomo Bakelite、 Showa Denko、 Eternal Materials、 Chang Chun Group、 KCC、 Duresco、 Hysol Huawei Electronics、 Jiangsu Huahai Chengkexin Material、 Beijing Kehua New Materials
...

This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound in Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound in Semiconductor Packaging. This report contains market size and forecasts of Epoxy Molding Compound in Semiconductor Packaging in global, including the following market information:
Global Epoxy Molding Compound in Semiconductor Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Epoxy Molding Compound in Semiconductor Packaging Market Sales, 2018-2023, 2024-2029, (Tons)
Global top five Epoxy Molding Compound in Semiconductor Packaging companies in 2022 (%)
The global Epoxy Molding Compound in Semiconductor Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Normal Epoxy Molding Compound Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Epoxy Molding Compound in Semiconductor Packaging include Samsung SDI, Sumitomo Bakelite, Showa Denko, Eternal Materials, Chang Chun Group, KCC, Duresco, Hysol Huawei Electronics and Jiangsu Huahai Chengkexin Material, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Epoxy Molding Compound in Semiconductor Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Epoxy Molding Compound in Semiconductor Packaging Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global Epoxy Molding Compound in Semiconductor Packaging Market Segment Percentages, by Type, 2022 (%)
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Global Epoxy Molding Compound in Semiconductor Packaging Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global Epoxy Molding Compound in Semiconductor Packaging Market Segment Percentages, by Application, 2022 (%)
IC
Diode
Transistor
Photocoupler
Others
Global Epoxy Molding Compound in Semiconductor Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global Epoxy Molding Compound in Semiconductor Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Epoxy Molding Compound in Semiconductor Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Epoxy Molding Compound in Semiconductor Packaging revenues share in global market, 2022 (%)
Key companies Epoxy Molding Compound in Semiconductor Packaging sales in global market, 2018-2023 (Estimated), (Tons)
Key companies Epoxy Molding Compound in Semiconductor Packaging sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Samsung SDI
Sumitomo Bakelite
Showa Denko
Eternal Materials
Chang Chun Group
KCC
Duresco
Hysol Huawei Electronics
Jiangsu Huahai Chengkexin Material
Beijing Kehua New Materials
Outline of Major Chapters:
Chapter 1: Introduces the definition of Epoxy Molding Compound in Semiconductor Packaging, market overview.
Chapter 2: Global Epoxy Molding Compound in Semiconductor Packaging market size in revenue and volume.
Chapter 3: Detailed analysis of Epoxy Molding Compound in Semiconductor Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Epoxy Molding Compound in Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Epoxy Molding Compound in Semiconductor Packaging capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 Epoxy Molding Compound in Semiconductor Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Epoxy Molding Compound in Semiconductor Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Epoxy Molding Compound in Semiconductor Packaging Overall Market Size
2.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Size: 2022 VS 2029
2.2 Global Epoxy Molding Compound in Semiconductor Packaging Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Epoxy Molding Compound in Semiconductor Packaging Sales: 2018-2029
3 Company Landscape
3.1 Top Epoxy Molding Compound in Semiconductor Packaging Players in Global Market
3.2 Top Global Epoxy Molding Compound in Semiconductor Packaging Companies Ranked by Revenue
3.3 Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Companies
3.4 Global Epoxy Molding Compound in Semiconductor Packaging Sales by Companies
3.5 Global Epoxy Molding Compound in Semiconductor Packaging Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Epoxy Molding Compound in Semiconductor Packaging Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Epoxy Molding Compound in Semiconductor Packaging Product Type
3.8 Tier 1, Tier 2 and Tier 3 Epoxy Molding Compound in Semiconductor Packaging Players in Global Market
3.8.1 List of Global Tier 1 Epoxy Molding Compound in Semiconductor Packaging Companies
3.8.2 List of Global Tier 2 and Tier 3 Epoxy Molding Compound in Semiconductor Packaging Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Market Size Markets, 2022 & 2029
4.1.2 Normal Epoxy Molding Compound
4.1.3 Green Epoxy Molding Compound
4.2 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Revenue & Forecasts
4.2.1 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2023
4.2.2 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, 2024-2029
4.2.3 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
4.3 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Sales & Forecasts
4.3.1 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2023
4.3.2 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Sales, 2024-2029
4.3.3 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
4.4 By Type – Global Epoxy Molding Compound in Semiconductor Packaging Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Market Size, 2022 & 2029
5.1.2 IC
5.1.3 Diode
5.1.4 Transistor
5.1.5 Photocoupler
5.1.6 Others
5.2 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Revenue & Forecasts
5.2.1 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2023
5.2.2 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, 2024-2029
5.2.3 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
5.3 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Sales & Forecasts
5.3.1 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2023
5.3.2 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Sales, 2024-2029
5.3.3 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
5.4 By Application – Global Epoxy Molding Compound in Semiconductor Packaging Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Market Size, 2022 & 2029
6.2 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Revenue & Forecasts
6.2.1 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2023
6.2.2 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, 2024-2029
6.2.3 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
6.3 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Sales & Forecasts
6.3.1 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2023
6.3.2 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Sales, 2024-2029
6.3.3 By Region – Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2029
6.4.2 By Country – North America Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2029
6.4.3 US Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.4.4 Canada Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.4.5 Mexico Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2029
6.5.2 By Country – Europe Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2029
6.5.3 Germany Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.5.4 France Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.5.5 U.K. Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.5.6 Italy Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.5.7 Russia Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.5.8 Nordic Countries Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.5.9 Benelux Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2029
6.6.2 By Region – Asia Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2029
6.6.3 China Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.6.4 Japan Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.6.5 South Korea Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.6.6 Southeast Asia Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.6.7 India Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2029
6.7.2 By Country – South America Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2029
6.7.3 Brazil Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.7.4 Argentina Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Sales, 2018-2029
6.8.3 Turkey Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.8.4 Israel Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.8.5 Saudi Arabia Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
6.8.6 UAE Epoxy Molding Compound in Semiconductor Packaging Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 Samsung SDI
7.1.1 Samsung SDI Company Summary
7.1.2 Samsung SDI Business Overview
7.1.3 Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.1.4 Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.1.5 Samsung SDI Key News & Latest Developments
7.2 Sumitomo Bakelite
7.2.1 Sumitomo Bakelite Company Summary
7.2.2 Sumitomo Bakelite Business Overview
7.2.3 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.2.4 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.2.5 Sumitomo Bakelite Key News & Latest Developments
7.3 Showa Denko
7.3.1 Showa Denko Company Summary
7.3.2 Showa Denko Business Overview
7.3.3 Showa Denko Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.3.4 Showa Denko Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.3.5 Showa Denko Key News & Latest Developments
7.4 Eternal Materials
7.4.1 Eternal Materials Company Summary
7.4.2 Eternal Materials Business Overview
7.4.3 Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.4.4 Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.4.5 Eternal Materials Key News & Latest Developments
7.5 Chang Chun Group
7.5.1 Chang Chun Group Company Summary
7.5.2 Chang Chun Group Business Overview
7.5.3 Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.5.4 Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.5.5 Chang Chun Group Key News & Latest Developments
7.6 KCC
7.6.1 KCC Company Summary
7.6.2 KCC Business Overview
7.6.3 KCC Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.6.4 KCC Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.6.5 KCC Key News & Latest Developments
7.7 Duresco
7.7.1 Duresco Company Summary
7.7.2 Duresco Business Overview
7.7.3 Duresco Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.7.4 Duresco Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.7.5 Duresco Key News & Latest Developments
7.8 Hysol Huawei Electronics
7.8.1 Hysol Huawei Electronics Company Summary
7.8.2 Hysol Huawei Electronics Business Overview
7.8.3 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.8.4 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.8.5 Hysol Huawei Electronics Key News & Latest Developments
7.9 Jiangsu Huahai Chengkexin Material
7.9.1 Jiangsu Huahai Chengkexin Material Company Summary
7.9.2 Jiangsu Huahai Chengkexin Material Business Overview
7.9.3 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.9.4 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.9.5 Jiangsu Huahai Chengkexin Material Key News & Latest Developments
7.10 Beijing Kehua New Materials
7.10.1 Beijing Kehua New Materials Company Summary
7.10.2 Beijing Kehua New Materials Business Overview
7.10.3 Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Major Product Offerings
7.10.4 Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Sales and Revenue in Global (2018-2023)
7.10.5 Beijing Kehua New Materials Key News & Latest Developments
8 Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity, Analysis
8.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity, 2018-2029
8.2 Epoxy Molding Compound in Semiconductor Packaging Production Capacity of Key Manufacturers in Global Market
8.3 Global Epoxy Molding Compound in Semiconductor Packaging Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Epoxy Molding Compound in Semiconductor Packaging Supply Chain Analysis
10.1 Epoxy Molding Compound in Semiconductor Packaging Industry Value Chain
10.2 Epoxy Molding Compound in Semiconductor Packaging Upstream Market
10.3 Epoxy Molding Compound in Semiconductor Packaging Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Epoxy Molding Compound in Semiconductor Packaging Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

List of Tables
Table 1. Key Players of Epoxy Molding Compound in Semiconductor Packaging in Global Market
Table 2. Top Epoxy Molding Compound in Semiconductor Packaging Players in Global Market, Ranking by Revenue (2022)
Table 3. Global Epoxy Molding Compound in Semiconductor Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 4. Global Epoxy Molding Compound in Semiconductor Packaging Revenue Share by Companies, 2018-2023
Table 5. Global Epoxy Molding Compound in Semiconductor Packaging Sales by Companies, (Tons), 2018-2023
Table 6. Global Epoxy Molding Compound in Semiconductor Packaging Sales Share by Companies, 2018-2023
Table 7. Key Manufacturers Epoxy Molding Compound in Semiconductor Packaging Price (2018-2023) & (US$/Ton)
Table 8. Global Manufacturers Epoxy Molding Compound in Semiconductor Packaging Product Type
Table 9. List of Global Tier 1 Epoxy Molding Compound in Semiconductor Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Epoxy Molding Compound in Semiconductor Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Revenue (US$, Mn), 2018-2023
Table 13. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Revenue (US$, Mn), 2024-2029
Table 14. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), 2018-2023
Table 15. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), 2024-2029
Table 16. By Application – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2022 & 2029
Table 17. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Revenue (US$, Mn), 2018-2023
Table 18. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Revenue (US$, Mn), 2024-2029
Table 19. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), 2018-2023
Table 20. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), 2024-2029
Table 21. By Region – Global Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2022 VS 2029
Table 22. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Revenue (US$, Mn), 2018-2023
Table 23. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Revenue (US$, Mn), 2024-2029
Table 24. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), 2018-2023
Table 25. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), 2024-2029
Table 26. By Country - North America Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country - North America Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2024-2029
Table 28. By Country - North America Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2018-2023
Table 29. By Country - North America Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2024-2029
Table 30. By Country - Europe Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2023
Table 31. By Country - Europe Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2024-2029
Table 32. By Country - Europe Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2018-2023
Table 33. By Country - Europe Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2024-2029
Table 34. By Region - Asia Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2023
Table 35. By Region - Asia Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2024-2029
Table 36. By Region - Asia Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2018-2023
Table 37. By Region - Asia Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2024-2029
Table 38. By Country - South America Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2023
Table 39. By Country - South America Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2024-2029
Table 40. By Country - South America Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2018-2023
Table 41. By Country - South America Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2024-2029
Table 42. By Country - Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2023
Table 43. By Country - Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2024-2029
Table 44. By Country - Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2018-2023
Table 45. By Country - Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Sales, (Tons), 2024-2029
Table 46. Samsung SDI Company Summary
Table 47. Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 48. Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 49. Samsung SDI Key News & Latest Developments
Table 50. Sumitomo Bakelite Company Summary
Table 51. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 52. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 53. Sumitomo Bakelite Key News & Latest Developments
Table 54. Showa Denko Company Summary
Table 55. Showa Denko Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 56. Showa Denko Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 57. Showa Denko Key News & Latest Developments
Table 58. Eternal Materials Company Summary
Table 59. Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 60. Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 61. Eternal Materials Key News & Latest Developments
Table 62. Chang Chun Group Company Summary
Table 63. Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 64. Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 65. Chang Chun Group Key News & Latest Developments
Table 66. KCC Company Summary
Table 67. KCC Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 68. KCC Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 69. KCC Key News & Latest Developments
Table 70. Duresco Company Summary
Table 71. Duresco Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 72. Duresco Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 73. Duresco Key News & Latest Developments
Table 74. Hysol Huawei Electronics Company Summary
Table 75. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 76. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 77. Hysol Huawei Electronics Key News & Latest Developments
Table 78. Jiangsu Huahai Chengkexin Material Company Summary
Table 79. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 80. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 81. Jiangsu Huahai Chengkexin Material Key News & Latest Developments
Table 82. Beijing Kehua New Materials Company Summary
Table 83. Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Product Offerings
Table 84. Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Sales (Tons), Revenue (US$, Mn) and Average Price (US$/Ton) (2018-2023)
Table 85. Beijing Kehua New Materials Key News & Latest Developments
Table 86. Epoxy Molding Compound in Semiconductor Packaging Production Capacity (Tons) of Key Manufacturers in Global Market, 2021-2023 (Tons)
Table 87. Global Epoxy Molding Compound in Semiconductor Packaging Capacity Market Share of Key Manufacturers, 2021-2023
Table 88. Global Epoxy Molding Compound in Semiconductor Packaging Production by Region, 2018-2023 (Tons)
Table 89. Global Epoxy Molding Compound in Semiconductor Packaging Production by Region, 2024-2029 (Tons)
Table 90. Epoxy Molding Compound in Semiconductor Packaging Market Opportunities & Trends in Global Market
Table 91. Epoxy Molding Compound in Semiconductor Packaging Market Drivers in Global Market
Table 92. Epoxy Molding Compound in Semiconductor Packaging Market Restraints in Global Market
Table 93. Epoxy Molding Compound in Semiconductor Packaging Raw Materials
Table 94. Epoxy Molding Compound in Semiconductor Packaging Raw Materials Suppliers in Global Market
Table 95. Typical Epoxy Molding Compound in Semiconductor Packaging Downstream
Table 96. Epoxy Molding Compound in Semiconductor Packaging Downstream Clients in Global Market
Table 97. Epoxy Molding Compound in Semiconductor Packaging Distributors and Sales Agents in Global Market
List of Figures
Figure 1. Epoxy Molding Compound in Semiconductor Packaging Segment by Type in 2022
Figure 2. Epoxy Molding Compound in Semiconductor Packaging Segment by Application in 2022
Figure 3. Global Epoxy Molding Compound in Semiconductor Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Epoxy Molding Compound in Semiconductor Packaging Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Epoxy Molding Compound in Semiconductor Packaging Revenue, 2018-2029 (US$, Mn)
Figure 7. Epoxy Molding Compound in Semiconductor Packaging Sales in Global Market: 2018-2029 (Tons)
Figure 8. The Top 3 and 5 Players Market Share by Epoxy Molding Compound in Semiconductor Packaging Revenue in 2022
Figure 9. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 10. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 11. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 12. By Type - Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton), 2018-2029
Figure 13. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 14. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 15. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 16. By Application - Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton), 2018-2029
Figure 17. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 18. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018 VS 2022 VS 2029
Figure 19. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 20. By Region - Global Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 21. By Country - North America Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 22. By Country - North America Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 23. US Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 24. Canada Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 25. Mexico Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 26. By Country - Europe Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 27. By Country - Europe Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 28. Germany Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 29. France Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 30. U.K. Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 31. Italy Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 32. Russia Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 33. Nordic Countries Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 34. Benelux Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 35. By Region - Asia Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 36. By Region - Asia Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 37. China Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 38. Japan Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 39. South Korea Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 40. Southeast Asia Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 41. India Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 42. By Country - South America Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 43. By Country - South America Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 44. Brazil Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 45. Argentina Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 46. By Country - Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Revenue Market Share, 2018-2029
Figure 47. By Country - Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Sales Market Share, 2018-2029
Figure 48. Turkey Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 49. Israel Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 50. Saudi Arabia Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 51. UAE Epoxy Molding Compound in Semiconductor Packaging Revenue, (US$, Mn), 2018-2029
Figure 52. Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity (Tons), 2018-2029
Figure 53. The Percentage of Production Epoxy Molding Compound in Semiconductor Packaging by Region, 2022 VS 2029
Figure 54. Epoxy Molding Compound in Semiconductor Packaging Industry Value Chain
Figure 55. Marketing Channels

※参考情報

半導体パッケージングにおいて、エポキシ成形材料（Epoxy Molding Compound、EMC）は重要な役割を果たします。これらの材料は、半導体チップを保護し、その信頼性と性能を向上させるために使用されます。エポキシ成形材料の概念は、さまざまな特徴、種類、用途、関連技術を含む広範なものであり、以下に詳述します。

まず、エポキシ成形材料の定義について説明します。エポキシ成形材料とは、主にエポキシ樹脂を基にした高分子材料であり、硬化剤や充填剤などと共に混合されて形成されます。これらの材料は、通常、熱硬化性であり、加熱により化学反応を引き起こして硬化します。EMCは、主に半導体デバイスの外部パッケージとして機能し、その内部にある半導体チップを物理的、化学的な環境から保護するために使用されます。

次に、エポキシ成形材料の特徴について述べます。まず、エポキシ成形材料は優れた機械的特性を持っています。硬化後は、非常に高い強度を持つため、半導体チップをしっかりと固定し、外部からの衝撃やストレスから保護します。また、耐熱性も高く、高温環境下での性能ポリシーにも耐えられます。さらに、エポキシ成形材料は低い吸湿性と優れた絶縁性を持ち、高い電気絶縁強度を保持します。これにより、電子回路のノイズを低減し、デバイスの信頼性を向上させる役割も果たします。

エポキシ成形材料には、いくつかの種類があります。主な種類としては、通常エポキシ樹脂と硬化剤の組み合わせによるタイプが挙げられます。ハロゲンフリーエポキシ材料は、環境に配慮した選択肢として注目されています。これらの材料は、環境保護の観点から有害なハロゲン元素を含まないため、リサイクルや廃棄時の安全性を向上させます。また、特定の用途に向けて調整された特殊なエポキシ材料（例えば、導電性や耐熱性が強化された材料）も存在します。

エポキシ成形材料の用途は多岐にわたります。主に、半導体パッケージングに使用されるため、集積回路（IC）やディスクリートデバイスの保護に欠かせない材料です。さらに、これらの材料は自動車、通信機器、コンシューマエレクトロニクス、医療機器など、多くの産業分野でも活躍しています。特に、エレクトロニクス業界では、デバイスの小型化や軽量化の進展に伴い、エポキシ成形材料の需要が高まっています。

関連技術としては、エポキシ成形材料の成形プロセスが重要です。主に射出成形や圧縮成形などの手法が用いられます。射出成形は、材料を高温で融解させ、型に注入して成形する方法で、効率的な生産が可能です。一方、圧縮成形では、成形材料を型の中に配置し、圧力をかけて成形します。これらのプロセスは、生産性やコストに大きく影響を与えるため、技術の進歩や工夫が求められています。また、温度管理や硬化プロセスも重要であり、適切な条件が保証されることで、材料の性能が最大限に引き出されます。

エポキシ成形材料は、今後の技術革新によりさらに進化が期待されます。例えば、ナノ材料やコンポジット材料との組み合わせにより、より高性能な成形材料の開発が進められており、信頼性の向上や環境への配慮が同時に達成される可能性があります。また、半導体デバイスの微細化が進む中、エポキシ成形材料の機能性や性能がますます重要になっています。これにより、業界全体が持続可能性を意識した素材開発に向けて取り組むことが求められています。

このように、エポキシ成形材料は半導体パッケージングにおいて欠かせない要素であり、その定義や特徴、種類、用途、関連技術に至るまで、幅広い知識が必要とされます。今後も、新たな技術の導入や材料の改良が進む中で、エポキシ成形材料がどのように進化していくのか、非常に興味深いテーマとなっています。エポキシ成形材料の理解を深めることは、半導体産業の発展に寄与する重要な要素であり、さまざまな場面での応用可能性を広げるための鍵となります。


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