スマートカードICの世界市場2019-2023

Technavioが発行した調査報告書(IRTNTR31881)
◆英語タイトル:Smart Card IC Market by Application, Microprocessor Architecture, and Geography - Global Forecast and Analysis 2019-2023
◆商品コード:IRTNTR31881
◆発行会社(リサーチ会社):Technavio
◆発行日:2019年8月14日
◆ページ数:143
◆レポート形式:英語 / PDF
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル、アジア太平洋、ヨーロッパ、中東・アフリカ(MEA)、北米、南米
◆産業分野:IT
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Technavio社の本調査レポートでは、スマートカードICの世界市場について調べ、スマートカードICの市場状況、市場規模、市場予測、市場環境、顧客状況、市場動向、関連企業情報などをまとめました。また、スマートカードICの市場規模をセグメンテーション別(用途別(テレコミュニケーション、財務、政府、交通手段、その他)、マイクロプロセッサアーキテクチャ別(16ビット、32ビット)、)と地域別(グローバル、アジア太平洋、ヨーロッパ、中東・アフリカ(MEA)、北米、南米)に分けて算出しました。Technavio社はスマートカードICの世界市場規模が2019-2023期間中に年平均8%成長すると予測しています。
・サマリー
・レポートの範囲
・スマートカードICの市場状況
・スマートカードICの市場規模
・スマートカードICの市場予測
・スマートカードICの世界環境:ファイブフォース分析
・市場セグメンテーション:用途別(テレコミュニケーション、財務、政府、交通手段、その他)
・市場セグメンテーション:マイクロプロセッサアーキテクチャ別(16ビット、32ビット)
・スマートカードICの顧客状況
・主要地域別市場規模:グローバル、アジア太平洋、ヨーロッパ、中東・アフリカ(MEA)、北米、南米
・意思決定フレームワーク
・市場動向・成長要因・課題
・関連企業状況・企業分析
 ...
【レポートの概要】

Global Smart Card IC Market: About this market
Technavio’s smart card IC market analysis considers sales from 16-bit and 32-bit microprocessor architecture. Our analysis also considers the sales of smart card IC in APAC, Europe, North America, South America, and MEA. In 2018, the 16-bit segment had a significant market share, and this trend is expected to continue over the forecast period. Factors such as low cost and the significant adoption of 16-bit microprocessor smart cards in telecommunication and transportation sectors will play a significant role in the telecommunication segment to maintain its market position. Also, our global smart card IC market report looks at factors such as growing demand for electronic ID cards, growing demand for contactless smartcards, and compliance with regulatory requirements. However, uncertainties in the growing use of mobile wallets, the threat to data security, and price wars due to increase in competition may hamper the growth of the smart card IC industry over the forecast period.

Global Smart Card IC Market: Overview

Growing demand for contactless smart cards
Contactless smart cards consist of a chip and an antenna which are composed of sensors that are packaged in standard PVC cards. The demand for contactless cards is increasing due to its speed, ease of use, and versatility. It is mostly used in applications such as public transport for payments, cashless vending and e-passports, and other secure travel documents. This growing demand for contactless smart cards will lead to the expansion of the global smart card IC market at a CAGR of over 8% during the forecast period.

Integration of smart cards with blockchain
Blockchain technology is a digital ledger, which is connected by a list of blocks that store data on a cryptographically secured and decentralized distributed network. The integration of the blockchain with smartcards helps in embedding standard security requirements for storing, generating, and managing the user cryptographic keys in smart card ICs. This development is expected to have a positive impact on the overall market growth.
For the detailed list of factors that will drive the global smart card IC market during the forecast period 2019-2023, click here.

Competitive Landscape
With the presence of several major players, the global smart card IC market is fragmented. Technavio’s robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading smart card IC manufacturers, that include Infineon Technologies AG, NXP Semiconductors NV, ON Semiconductor Corp., Samsung Electronics Co. Ltd., STMicroelectronics NV.

Also, the smart card IC market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

【レポートの目次】

PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
• 2.1 Preface
• 2.2 Preface
• 2.3 Currency conversion rates for US$
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY APPLICATION
• Market segmentation by application
• Comparison by application
• Telecommunication – Market size and forecast 2018-2023
• Financial – Market size and forecast 2018-2023
• Government – Market size and forecast 2018-2023
• Transportation – Market size and forecast 2018-2023
• Others – Market size and forecast 2018-2023
• Market opportunity by application
PART 07: CUSTOMER LANDSCAPE
PART 08: MARKET SEGMENTATION BY MICROPROCESSOR
ARCHITECTURE
• Market segmentation by microprocessor architecture
• Comparison by microprocessor architecture
• 16-bit – Market size and forecast 2018-2023
• 32-bit – Market size and forecast 2018-2023
• Market opportunity by microprocessor architecture
PART 09: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Europe – Market size and forecast 2018-2023
• North America – Market size and forecast 2018-2023
• South America – Market size and forecast 2018-2023
• MEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 10: DECISION FRAMEWORK
PART 11: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 12: MARKET TRENDS
• Robust demand for dual-interface cards
• Use of biometrics in smart cards
• Integration of smart cards with blockchain
PART 13: VENDOR LANDSCAPE
• Overview
• Landscape disruption
• Competitive scenario
PART 14: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Infineon Technologies AG
• NXP Semiconductors NV
• ON Semiconductor Corp.
• Samsung Electronics Co. Ltd.
• STMicroelectronics NV
PART 15: APPENDIX
• Research methodology
• List of abbreviations
• Definition of market positioning of vendors
PART 16: EXPLORE TECHNAVIO

Exhibit 01: Vendors: Key product offerings
Exhibit 02: Global semiconductor market
Exhibit 03: Segments of global semiconductor market
Exhibit 04: Market characteristics
Exhibit 05: Market segments
Exhibit 06: Market definition – Inclusions and exclusions checklist
Exhibit 07: Market size 2018
Exhibit 08: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 09: Exhibit 01: Global market: Size and forecast 2018-2023 (millions units)
Exhibit 10: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 11: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 12: Five forces analysis 2018
Exhibit 13: Five forces analysis 2023
Exhibit 14: Bargaining power of buyers
Exhibit 15: Bargaining power of suppliers
Exhibit 16: Threat of new entrants
Exhibit 17: Threat of substitutes
Exhibit 18: Threat of rivalry
Exhibit 19: Market condition – Five forces 2018
Exhibit 20: Application – Market share 2018-2023 (%)
Exhibit 21: Comparison by application
Exhibit 22: Telecommunication – Market size and forecast 2018-2023 ($ millions)
Exhibit 23: Telecommunication – Year-over-year growth 2019-2023 (%)
Exhibit 24: Financial – Market size and forecast 2018-2023 ($ millions)
Exhibit 25: Financial – Year-over-year growth 2019-2023 (%)
Exhibit 26: Government – Market size and forecast 2018-2023 ($ millions)
Exhibit 27: Government – Year-over-year growth 2019-2023 (%)
Exhibit 28: Transportation – Market size and forecast 2018-2023 ($ millions)
Exhibit 29: Transportation – Year-over-year growth 2019-2023 (%)
Exhibit 30: Others – Market size and forecast 2018-2023 ($ millions)
Exhibit 31: Others – Year-over-year growth 2019-2023 (%)
Exhibit 32: Market opportunity by application
Exhibit 33: Customer landscape
Exhibit 34: Microprocessor architecture – Market share 2018-2023 (%)
Exhibit 35: Comparison by microprocessor architecture
Exhibit 36: -bit – Market size and forecast 2018-2023 ($ millions)
Exhibit 37: -bit – Year-over-year growth 2019-2023 (%)
Exhibit 38: -bit – Market size and forecast 2018-2023 ($ millions)
Exhibit 39: -bit – Year-over-year growth 2019-2023 (%)
Exhibit 40: Market opportunity by microprocessor architecture
Exhibit 41: Market share by geography 2018-2023 (%)
Exhibit 42: Geographic comparison
Exhibit 43: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 44: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 45: Europe – Market size and forecast 2018-2023 ($ millions)
Exhibit 46: Europe – Year-over-year growth 2019-2023 (%)
Exhibit 47: North America – Market size and forecast 2018-2023 ($ millions)
Exhibit 48: North America – Year-over-year growth 2019-2023 (%)
Exhibit 49: South America – Market size and forecast 2018-2023 ($ millions)
Exhibit 50: South America – Year-over-year growth 2019-2023 (%)
Exhibit 51: MEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 52: MEA – Year-over-year growth 2019-2023 (%)
Exhibit 53: Key leading countries
Exhibit 54: Market opportunity
Exhibit 55: Impact of drivers and challenges
Exhibit 56: Vendor landscape
Exhibit 57: Landscape disruption
Exhibit 58: Vendors covered
Exhibit 59: Vendor classification
Exhibit 60: Market positioning of vendors
Exhibit 61: Infineon Technologies AG – Vendor overview
Exhibit 62: Infineon Technologies AG – Product segments
Exhibit 63: Infineon Technologies AG – Organizational developments
Exhibit 64: Infineon Technologies AG – Geographic focus
Exhibit 65: Infineon Technologies AG – Segment focus
Exhibit 66: Infineon Technologies AG – Key offerings
Exhibit 67: NXP Semiconductors NV – Vendor overview
Exhibit 68: NXP Semiconductors NV – Business segments
Exhibit 69: NXP Semiconductors NV – Organizational developments
Exhibit 70: NXP Semiconductors NV – Geographic focus
Exhibit 71: NXP Semiconductors NV – Segment focus
Exhibit 72: NXP Semiconductors NV – Key offerings
Exhibit 73: ON Semiconductor Corp. – Vendor overview
Exhibit 74: ON Semiconductor Corp. – Business segments
Exhibit 75: ON Semiconductor Corp. – Organizational developments
Exhibit 76: ON Semiconductor Corp. – Geographic focus
Exhibit 77: ON Semiconductor Corp. – Segment focus
Exhibit 78: ON Semiconductor Corp. – Key offerings
Exhibit 79: Samsung Electronics Co. Ltd. – Vendor overview
Exhibit 80: Samsung Electronics Co. Ltd. – Business segments
Exhibit 81: Samsung Electronics Co. Ltd. – Organizational developments
Exhibit 82: Samsung Electronics Co. Ltd. – Geographic focus
Exhibit 83: Samsung Electronics Co. Ltd. – Segment focus
Exhibit 84: Samsung Electronics Co. Ltd. – Key offerings
Exhibit 85: STMicroelectronics NV – Vendor overview
Exhibit 86: STMicroelectronics NV – Business segments
Exhibit 87: STMicroelectronics NV – Organizational developments
Exhibit 88: STMicroelectronics NV – Geographic focus
Exhibit 89: STMicroelectronics NV – Segment focus
Exhibit 90: STMicroelectronics NV – Key offerings
Exhibit 91: Validation techniques employed for market sizing
Exhibit 92: Definition of market positioning of vendors



【掲載企業】

Infineon Technologies AG, NXP Semiconductors NV, ON Semiconductor Corp., Samsung Electronics Co. Ltd., and STMicroelectronics NV.

【免責事項】
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