半導体製造装置の世界市場予測(~2023年):フロントエンド装置、バックエンド装置

◆英語タイトル:Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, and Geography - Global Forecast to 2023
◆商品コード:MAM-SE5344
◆発行会社(リサーチ会社):MarketsandMarkets
◆発行日:2017年6月13日
◆ページ数:162
◆レポート形式:英語 / PDF
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◆産業分野:産業装置
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当調査レポートでは、半導体製造装置の世界市場について調査・分析し、エグゼクティブサマリー、市場インサイト、市場概観/市場動向、バリューチェーン分析、市場シェア分析、フロントエンド装置別分析、バックエンド装置別分析、地域別分析、半導体製造装置の世界市場規模及び予測、市場動向、競争状況、関連企業分析などの情報をお届けいたします。

・イントロダクション
・エグゼクティブサマリー
・半導体製造装置の世界市場:市場インサイト
・半導体製造装置の世界市場:市場概観/市場動向
・半導体製造装置の世界市場:バリューチェーン分析
・半導体製造装置の世界市場:市場シェア分析
・半導体製造装置の世界市場:フロントエンド装置別分析/市場規模
・半導体製造装置の世界市場:バックエンド装置別分析/市場規模
・半導体製造装置の世界市場:地域別分析/市場規模
・半導体製造装置のアジア市場規模予測
・半導体製造装置のヨーロッパ市場規模予測
・半導体製造装置のアメリカ市場規模予測
・半導体製造装置の世界市場動向
・半導体製造装置の世界市場:競争状況
・半導体製造装置の世界市場:関連企業分析
...

※上記の和訳は最新内容ではない場合があります。
【レポートの概要】

“Semiconductor manufacturing equipment market to exhibit a high growth between 2017 and 2023”The semiconductor manufacturing equipment market is projected to reach USD 62.56 billion by 2023 and is likely to grow at a CAGR of 6.86% between 2017 and 2023. The key factors driving the growth of the market include progress in research and development (R&D) facilities, increasing demand for electrical and hybrid vehicles, growing consumer electronic market, and increase in the number of foundries. However, the high cost and maintenance of the equipment and complexity of pattern and functional defects in manufacturing processes are inhibiting the growth of this market.

“3D ICs market to grow at a high rate in the coming years”
The semiconductor industry is driven to develop more innovative and advanced and miniature technologies because of the growing demand for new and more advanced electronic products with a smaller form factor, higher functionality, and high performance with a lower cost. The need for improved electrical performance has introduced 3D technology, which can replace the long interconnects used in 2D by short vertical interconnects.

“Semiconductor manufacturing equipment market in APAC to grow at a high rate in the coming years”
The APAC region accounts for the largest share in the overall semiconductor manufacturing equipment market. The presence of local players such as Nikon (Japan) and Canon (Japan) are also contributing toward the growth of the market in the region. The semiconductor manufacturing equipment market in APAC held the largest share owing to low-cost labors in China, Taiwanese innovation and advancement in fabrication plants, and Japanese semiconductor equipment manufacturing capabilities, which are some of the cutting-edge advantages for the Asian semiconductor industry. Also, other factors such as increasing raw material suppliers, low labor cost, and increasing investment by global business giants are driving the market growth.

Breakdown of the profile of the primary participants:
• By Company Type: Tier 1—40%, Tier 2—35%, and Tier 3—25%
• By Designation: C-Level Executives—35%, Directors—25%, and Others—40%
• By Region: North America—45%, Europe—30%, APAC—20%, and RoW—5%

The major key players operating in the semiconductor manufacturing equipment market includes Applied Material, Lam Research, ASML, Tokyo Electronics, KLA-Tencor, Screen Semiconductor Solutions, Nikon, Hitachi, and ASML International.

Research Coverage:
In this report, various segments such as front-end, backend, dimensions, fab facility, and geography of the semiconductor manufacturing equipment market have been covered. It also discusses the key drivers, restraints, opportunities, and challenges pertaining to the market. The report gives a detailed view of the market across 3 main regions: North America, Europe, and APAC.

Reasons to Buy the Report:
• This report includes the market statistics pertaining to front-end, backend, dimensions, fab facility, and geography.
• The major drivers, restraints, challenges, and opportunities for the semiconductor manufacturing equipment market have been detailed in this report.
• Illustrative segmentation, analysis, and forecast for markets based on front-end, backend, dimensions, fab facility, and geography have been conducted to give an overall view of the market.
• A detailed competitive landscape has been provided that includes key players, revenue of key players, and strategic developments, among others.

【レポートの目次】

1 Introduction (Page No. – 14)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Scope of the Study
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Package and Size
1.6 Limitations
1.7 Stakeholders

2 Research Methodology (Page No. – 17)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Executive Summary (Page No. – 25)

4 Premium Insights (Page No. – 30)
4.1 Attractive Growth Opportunities in the Semiconductor Manufacturing Equipment Market
4.2 Semiconductor Manufacturing Equipment Market, By Front-End
4.3 Semiconductor Manufacturing Equipment Market in APAC
4.4 Growth Rate of the Leading Countries in Semiconductor Manufacturing Equipment, 2016
4.5 Semiconductor Manufacturing Equipment Market, By Dimension

5 Market Overview (Page No. – 34)
5.1 Value Chain Analysis
5.1.1 Value Chain Analysis (Front-End Manufacturing Equipment)
5.1.2 Value Chain Analysis (Back-End Manufacturing Equipment)
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Progress in Research and Development Facilities
5.2.1.2 Increasing Demand for Electric and Hybrid Vehicles
5.2.1.3 Growing Consumer Electronics Market and Increase in the Number of Foundries
5.2.2 Restraints
5.2.2.1 High Costs and Maintenance of the Equipment
5.2.2.2 Complexity of Pattern and Functional Defects in Manufacturing Process
5.2.3 Opportunities
5.2.3.1 Rise in Demand for Silicon-Based Sensors in Iot
5.2.3.2 Expanding Chip Industry in China
5.2.3.3 Growing Number of Data Centers and Servers
5.2.4 Challenges
5.2.4.1 Technical Problems Faced During Fabrication Process
5.2.4.2 Increased Complexities Related to Miniaturized Structures of Circuit

6 Semiconductor Manufacturing Market, By Front-End Equipment (Page No. – 44)
6.1 Introduction
6.2 Lithography
6.2.1 DUV
6.2.2 EUV
6.3 Wafer Surface Conditioning Equipment
6.3.1 Etching
6.3.2 Chemical Mechanical Planarization
6.4 Cleaning Process
6.4.1 Single-Wafer Spray System
6.4.2 Single-Wafer Cryogenic System
6.4.3 Batch Immersion Cleaning System
6.4.4 Batch Spray Cleaning System
6.4.5 Scrubber
6.5 Others
6.5.1 CVD

7 Semiconductor Manufacturing Equipment Market, By Back-End (Page No. – 57)
7.1 Introduction
7.2 Back-End Processes
7.2.1 Assembly and Packaging
7.2.1.1 Assembly
7.2.1.2 Packaging Equipment
7.2.2 Dicing Equipment
7.2.3 Bonding Equipment
7.2.4 Metrology Equipment
7.2.5 Test Equipment

8 Semiconductor Manufacturing Equipment Market, By Fab Facility (Page No. – 65)
8.1 Introduction
8.2 Automation
8.3 Chemical Control Equipment
8.4 Gas Control Equipment
8.5 Others

9 Semiconductor Manufacturing Equipment Market, By Dimension (Page No. – 68)
9.1 Introduction
9.2 2D
9.3 2.5D
9.4 3D

10 Semiconductor Manufacturing Equipment Market, By Geography (Page No. – 72)
10.1 Introduction
10.2 North America
10.2.1 US
10.2.1.1 Some of the Major Semiconductor Device Manufacturers Belong to the US 83
10.2.2 Canada
10.2.3 Mexico
10.3 Europe
10.3.1 Uk
10.3.1.1 Effort to Increase the Growth of Semiconductor Manufacturing Equipment
10.3.2 Italy
10.3.2.1 One of the Leading Countries of Europe
10.3.3 Ireland
10.3.3.1 High Experience in Semiconductor Market
10.3.4 France
10.3.4.1 One of the Largest Electronic Market in Europe
10.3.5 Rest of Europe
10.4 Asia Pacific
10.4.1 China
10.4.1.1 Semiconductor Manufacturing Equipment Market for China in APAC is Expected to Grow at A High Rate
10.4.2 Japan
10.4.2.1 Presence of Major Players in Japan
10.4.3 Taiwan
10.4.3.1 Taiwan Being A Major Semiconductor Manufacturer Hub is Expected to Boost the Demand for Semiconductor Manufacturing Equipment
10.4.4 South Korea
10.4.4.1 Second Largest Semiconductor Industry in the World
10.4.5 Rest of APAC

11 Competitive Landscape (Page No. – 105)
11.1 Overview
11.2 Market Ranking Analysis for Semiconductor Manufacturing Equipment Market
11.3 Semiconductor Manufacturing Equipment Market Dive Chart
11.3.1 Vanguards
11.3.2 Dynamic
11.3.3 Innovators
11.3.4 Emerging
11.3.5 Micro Quadrant
11.3.5.1 Product Offering Parameters
11.3.5.2 Business Strategy Parameters
11.4 Competitive Situations and Trends
11.4.1 Product Launches
11.4.2 Contracts, Partnership, Agreements, and Collaborations
11.4.3 Merger & Acquisition
11.4.4 Expansions and Awards

*Top 25 Companies Analyzed for This Study are -Asml Holdings N.V., Nikon, Canon, Jeol, Nuflare Technology, Ultratech, Rudolph Technology, Ev Group, Screen Semiconductor Solutions Co., Ltd, Toshiba, Tokyo Ohka Kogyo Co., Ltd, Adams Lithographing , Am Lithography Corporation, Vistec Electron Beam GmbH, Qoniac GmbH, S-Cubed, Inc., Inpria, Zeiss, Mapper Lithography, Raith GmbH, Gigaphoton Inc, Energetiq Technology, Inc, Suss Microtech Ag, Nil Technology

12 Company Profile (Page No. – 116)
(Overview, Products and Services, Financials, Strategy & Development)*
12.1 Introduction
12.2 Tokyo Electron Limited
12.3 Lam Research Corporation
12.4 Asml Holdings N.V.
12.5 Applied Materials Inc.
12.6 KLA-Tencor Corporation.
12.7 Screen Holdings Co., Ltd.
12.8 Teradyne Inc.
12.9 Advantest Corporation
12.10 Hitachi High-Technologies Corporation.
12.11 Plasma-Therm.
12.12 Rudolph Technologies, Inc
12.13 Startup Ecosystem

*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. – 152)
13.1 Insights of Industry Experts
13.2 Discussion Guide:
13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
13.4 Introducing RT: Real-Time Market Intelligence
13.5 Available Customization
13.6 Related Reports
13.7 Author Details

List of Tables (66 Tables)

Table 1 Front-End Equipment Shipment Unit, 2014-2023
Table 2 Presence of Domestic Companies in Different Semiconductor Manufacturing Equipment
Table 3 Front-End Semiconductor Manufacturing Equipment Market, By Type, 2014–2023 (USD Billion)
Table 4 Front-End By Market, By Geography 2014–2023 (USD Billion)
Table 5 Front-End Lithography Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 6 Front-End Wafer Surface Conditioning Equipment Market, By Type, 2014–2023 (USD Billion)
Table 7 Front-End Wafer Conditioning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 8 Etching Wafer Conditioning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 9 CMP Wafer Conditioning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 10 Wafer Cleaning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 11 Other Wafer Processing Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 12 Back-End By Market, By Type, 2014–2023 (USD Billion)
Table 13 Back-End By Market, By Geography, 2014–2023 (USD Billion)
Table 14 Back-End Assembly and Packaging Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 15 Back-End Dicing Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 16 Back-End Bonding Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 17 Back-End Metrology Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 18 Back-End Wafer Testing Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 19 By Market, By Fab Facility, 2014–2023 (USD Billion)
Table 20 By Market, By Dimension, 2014–2023, (USD Billion)
Table 21 Comparison Between 2D, 2.5D, and 3D IC Technology
Table 22 Semiconductor Manufacturing Equipment Market, By Geography 2014–2023 (USD Billion)
Table 23 North America By Market, By Country, 2014–2023 (USD Billion)
Table 24 North America By Market, By Type, 2014–2023 (USD Billion)
Table 25 Lithography Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 26 Etching Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 27 CMP Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 28 Wafer Cleaning Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 29 Other Wafer Processing Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 30 Assembly and Packaging Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 31 Dicing Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 32 Bonding Equipment Market in North America By Country, 2014–2023, (USD Billion)
Table 33 Metrology Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 34 Wafer Testing Equipment Market in North America, By Country, 2014–2023, (USD Billion)
Table 35 By Market in North America, By Dimension, 2014–2023, (USD Billion)
Table 36 By Market in Europe, By Country, 2014–2023, (USD Billion)
Table 37 Europe By Market, By Type, 2014–2023 (USD Billion)
Table 38 Lithography Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 39 Etching Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 40 Europe: CMP Equipment Market in Europe, By Country, 2014–2023, (USD Billion)
Table 41 Wafer Cleaning Equipment Market in Europe, By Country, 2014–2023, (USD Billion)
Table 42 Europe: Other Wafer Processing Equipment Market in Europe, By Country, 2014–2023, (USD Billion)
Table 43 Assembly and Packaging Equipment Market in Europe, By Country, 2014–2023, (USD Billion)
Table 44 Wafer Dicing Equipment Market in Europe, By Country, 2014–2023, (USD Million)
Table 45 Bonding Equipment Market in Europe, By Country, 2014–2023, (USD Million)
Table 46 Metrology Equipment Market in Europe, By Country, 2014–2023, (USD Billion)
Table 47 Wafer Testing Equipment Market in Europe, By Country, 2014–2023, (USD Billion)
Table 48 Semiconductor Manufacturing Equipment Market in Europe, By Dimension, 2014–2023, (USD Billion)
Table 49 Semiconductor Manufacturing Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 50 APAC Semiconductor Manufacturing Equipment Market, By Type, 2014–2023 (USD Billion)
Table 51 Lithography Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 52 Etching Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 53 CMP Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 54 Wafer Cleaning Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 55 Other Wafer Processing Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 56 Assembly and Packaging Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 57 Wafer Dicing Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 58 Wafer Bonding Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 59 Metrology Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 60 Wafer Testing Equipment Market in APAC, By Country, 2014–2023, (USD Billion)
Table 61 By Market in APAC, By Dimension, 2014–2023, (USD Billion)
Table 62 Ranking of Top 5 Players: Power Bank Market, 2016
Table 63 Product Launches, 2015–2017
Table 64 Contracts, Agreements, and Collaborations, 2015-2017
Table 65 Merger and Acquisition, 2015-2017
Table 66 Expansions and Awards, 2015-2017

List of Figures (48 Figures)

Figure 1 Markets Covered
Figure 2 Research Design
Figure 3 Market Size Estimation Methodology: Bottom-Up Approach
Figure 4 Market Size Estimation Methodology: Top-Down Approach
Figure 5 Data Triangulation
Figure 6 Assumptions of the Research Study
Figure 7 in North America 3D Segment is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 8 APAC to Grow at the Highest Rate in the Semiconductor Manufacturing Equipment Market During the Forecast Period
Figure 9 Lithography Equipment to Hold Large Demand in the Semiconductor Manufacturing Equipment Market During the Forecast Period
Figure 10 Bonding Equipment is Expected to Witness the Highest Growth Between 2017 and 2023
Figure 11 APAC Held the Largest Market Share in 2016
Figure 12 Growing Consumer Electronics Market and Increase in the Number of Foundries are Driving the Semiconductor Manufacturing Equipment Market
Figure 13 Lithography Equipment is Expected to Hold the Largest Market Share for Semiconductor Manufacturing Equipment During the Forecast Period
Figure 14 Taiwan Held the Largest Share of the Semiconductor Manufacturing Equipment Market in APAC in 2016
Figure 15 APAC is Expected to Grow at A Highest CAGR During the Forecast Period
Figure 16 3D is Expected to Hold the Highest Share Between 2017 and 2023
Figure 17 Value Chain Analysis: Semiconductor Manufacturing Equipment
Figure 18 Growing Demand for Consumer Electronics and Electric-Based Automobiles are the Major Drivers for the Semiconductor Manufacturing Equipment Market
Figure 19 Increasing Sales of Electric Vehicles Between 2011 and 2014
Figure 20 Lithography Equipment Accounts for the Largest Market Share Among All Equipment Types in 2017
Figure 21 CMP Market is Expected to Grow With the Highest CAGR During the Forecast Period
Figure 22 APAC Market is Expected to Grow With the Highest CAGR During the Forecast Period
Figure 23 Semiconductor Manufacturing Equipment Market, By Geography
Figure 24 China Expected to Register the Highest Growth Rate in the Semiconductor Manufacturing Equipment Market During the Forecast Period
Figure 25 APAC Holds the Largest Market in Semiconductor Manufacturing Equipment Market in 2017
Figure 26 North America, Geographic Snapshot, 2016
Figure 27 Semiconductor Manufacturing Equipment Market in the US is Expected to Grow With the Highest CAGR During the Forecast Period
Figure 28 3D Market is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 29 Germany is Expected to Grow With the Highest CAGR Between 2017 and 2023
Figure 30 Germany Accounts for Largest Market in Assembly and Packaging Market in 2017
Figure 31 Among All Dimensions 3D Market in Europe is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 32 APAC, Geographic Snapshot, 2016
Figure 33 Taiwan Holds Largest Market Share Among All APAC Countries in 2017
Figure 34 Taiwan Holds Largest Market for APAC Wafer Cleaning Equipment Market
Figure 35 3D Market is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 36 Companies Adopted Product Launches as Key Growth Strategy Between 2014 and 2017
Figure 37 Dive Chart
Figure 38 Battle for Market Share: Product Launches Was the Key Strategy Between 2014 and 2017
Figure 39 Tokyo Electron Limited: Company Snapshot
Figure 40 Lam Research Corporation: Company Snapshot
Figure 41 Asml Holdings N.V.: Company Snapshot
Figure 42 Applied Materials Inc.: Company Snapshot
Figure 43 KLA-Tencore Corporation: Company Snapshot
Figure 44 Screen Holdings Co., Ltd.: Company Snapshot
Figure 45 Teradyne Inc.: Company Snapshot
Figure 46 Advantest Corporation: Company Snapshot
Figure 47 Hitachi High-Technologies Corporation: Company Snapshot
Figure 48 Rudolph Technologies, Inc: Company Snapshot



【レポートのキーワード】

半導体製造装置、フロントエンド装置、バックエンド装置、半導体生産

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