カテゴリー： Market Monitor Global, 世界, 産業機械/建設

半導体圧縮成形装置の世界市場見通し2023年-2029年

◆英語タイトル：Semiconductor Compression Molding Equipment Market, Global Outlook and Forecast 2023-2029
	◆商品コード：MMG23LY5997 ◆発行会社（リサーチ会社）：Market Monitor Global ◆発行日：2023年7月（※2025年版があります。お問い合わせください。） ◆ページ数：74 ◆レポート形式：英語 / PDF ◆納品方法：Eメール（受注後2-3営業日） ◆調査対象地域：グローバル ◆産業分野：機械&装置

◆販売価格オプション（消費税別）

Single User（1名様閲覧用）	USD3,250 ⇒換算￥468,000	見積依頼/購入/質問フォーム
Multi User（20名様閲覧用）	USD4,225 ⇒換算￥608,400	見積依頼/購入/質問フォーム
Enterprise User（閲覧人数制限なし）	USD4,875 ⇒換算￥702,000	見積依頼/購入/質問フォーム

★Market Monitor Globalに受託調査の見積を依頼する

※販売価格オプションの説明はこちらで、ご利用ガイドはこちらでご確認いただけます。
※お支払金額は「換算金額（日本円）＋消費税＋配送料（Eメール納品は無料）」です。
※Eメールによる納品の場合、通常ご注文当日～2日以内に納品致します。
※レポート納品後、納品日＋5日以内に請求書を発行・送付致します。（請求書発行日より2ヶ月以内の銀行振込条件、カード払いに変更可）
※上記の日本語題名はH&Iグローバルリサーチが翻訳したものです。英語版原本には日本語表記はありません。
※為替レートは適宜修正・更新しております。リアルタイム更新ではありません。

❖ レポートの概要 ❖

Global Semiconductor Compression Molding Equipment Market 調査レポートは次の情報を含め、グローバルにおけるの半導体圧縮成形装置市場規模と予測を収録しています。・世界の半導体圧縮成形装置市場：売上、2018年-2023年、2024年-2029年
・世界の半導体圧縮成形装置市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界の半導体圧縮成形装置市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。アメリカ市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「80トン」セグメントは今後6年間、000%の年平均成長率で2029年までに000Mドルに成長すると予測されています。

半導体圧縮成形装置のグローバル主要企業は、TOWA Corporation、 Hanmi Semiconductor、 ASMPT、 Yamaha Motor Robotics Holdings、 Kitagawa Seikiなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

マーケットモニターグローバル社は、半導体圧縮成形装置のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別マーケット分析】

世界の半導体圧縮成形装置市場：タイプ別、2018年-2023年、2024年-2029年
世界の半導体圧縮成形装置市場：タイプ別市場シェア、2022年
・80トン、120トン、160トン、その他

世界の半導体圧縮成形装置市場：用途別、2018年-2023年、2024年-2029年
世界の半導体圧縮成形装置市場：用途別市場シェア、2022年
・ウエハ、パネル、その他

世界の半導体圧縮成形装置市場：地域・国別、2018年-2023年、2024年-2029年
世界の半導体圧縮成形装置市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競争分析】

また、当レポートは主要な参入企業の分析を提供します。
・主要企業における半導体圧縮成形装置のグローバル売上、2018年-2023年
・主要企業における半導体圧縮成形装置のグローバル売上シェア、2022年
・主要企業における半導体圧縮成形装置のグローバル販売量、2018年-2023年
・主要企業における半導体圧縮成形装置のグローバル販売量シェア、2022年

さらに、当レポートは主要企業の情報を提示します。
TOWA Corporation、 Hanmi Semiconductor、 ASMPT、 Yamaha Motor Robotics Holdings、 Kitagawa Seiki

*************************************************************

・調査・分析レポートの概要
半導体圧縮成形装置市場の定義
市場セグメント
世界の半導体圧縮成形装置市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界の半導体圧縮成形装置市場規模
世界の半導体圧縮成形装置市場規模：2022年 VS 2029年
世界の半導体圧縮成形装置市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでの半導体圧縮成形装置の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業の半導体圧縮成形装置製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：80トン、120トン、160トン、その他
半導体圧縮成形装置のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：ウエハ、パネル、その他
半導体圧縮成形装置の用途別グローバル売上・予測

・地域別市場分析
地域別半導体圧縮成形装置市場規模 2022年と2029年
地域別半導体圧縮成形装置売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業の情報（企業概要、事業概要、主要製品、売上、ニュースなど）
TOWA Corporation、 Hanmi Semiconductor、 ASMPT、 Yamaha Motor Robotics Holdings、 Kitagawa Seiki
...

This report aims to provide a comprehensive presentation of the global market for Semiconductor Compression Molding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Compression Molding Equipment. This report contains market size and forecasts of Semiconductor Compression Molding Equipment in global, including the following market information:
Global Semiconductor Compression Molding Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Semiconductor Compression Molding Equipment Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Semiconductor Compression Molding Equipment companies in 2022 (%)
The global Semiconductor Compression Molding Equipment market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
80 Tons Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Compression Molding Equipment include TOWA Corporation, Hanmi Semiconductor, ASMPT, Yamaha Motor Robotics Holdings and Kitagawa Seiki, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Compression Molding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Compression Molding Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Compression Molding Equipment Market Segment Percentages, by Type, 2022 (%)
80 Tons
120 Tons
160 Tons
Others
Global Semiconductor Compression Molding Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Compression Molding Equipment Market Segment Percentages, by Application, 2022 (%)
Wafers
Panels
Others
Global Semiconductor Compression Molding Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Compression Molding Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Compression Molding Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Compression Molding Equipment revenues share in global market, 2022 (%)
Key companies Semiconductor Compression Molding Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Semiconductor Compression Molding Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
TOWA Corporation
Hanmi Semiconductor
ASMPT
Yamaha Motor Robotics Holdings
Kitagawa Seiki
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Compression Molding Equipment, market overview.
Chapter 2: Global Semiconductor Compression Molding Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Compression Molding Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Compression Molding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Compression Molding Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 Semiconductor Compression Molding Equipment Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Semiconductor Compression Molding Equipment Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Semiconductor Compression Molding Equipment Overall Market Size
2.1 Global Semiconductor Compression Molding Equipment Market Size: 2022 VS 2029
2.2 Global Semiconductor Compression Molding Equipment Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Semiconductor Compression Molding Equipment Sales: 2018-2029
3 Company Landscape
3.1 Top Semiconductor Compression Molding Equipment Players in Global Market
3.2 Top Global Semiconductor Compression Molding Equipment Companies Ranked by Revenue
3.3 Global Semiconductor Compression Molding Equipment Revenue by Companies
3.4 Global Semiconductor Compression Molding Equipment Sales by Companies
3.5 Global Semiconductor Compression Molding Equipment Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Semiconductor Compression Molding Equipment Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Semiconductor Compression Molding Equipment Product Type
3.8 Tier 1, Tier 2 and Tier 3 Semiconductor Compression Molding Equipment Players in Global Market
3.8.1 List of Global Tier 1 Semiconductor Compression Molding Equipment Companies
3.8.2 List of Global Tier 2 and Tier 3 Semiconductor Compression Molding Equipment Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Semiconductor Compression Molding Equipment Market Size Markets, 2022 & 2029
4.1.2 80 Tons
4.1.3 120 Tons
4.1.4 160 Tons
4.1.5 Others
4.2 By Type – Global Semiconductor Compression Molding Equipment Revenue & Forecasts
4.2.1 By Type – Global Semiconductor Compression Molding Equipment Revenue, 2018-2023
4.2.2 By Type – Global Semiconductor Compression Molding Equipment Revenue, 2024-2029
4.2.3 By Type – Global Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
4.3 By Type – Global Semiconductor Compression Molding Equipment Sales & Forecasts
4.3.1 By Type – Global Semiconductor Compression Molding Equipment Sales, 2018-2023
4.3.2 By Type – Global Semiconductor Compression Molding Equipment Sales, 2024-2029
4.3.3 By Type – Global Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
4.4 By Type – Global Semiconductor Compression Molding Equipment Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Semiconductor Compression Molding Equipment Market Size, 2022 & 2029
5.1.2 Wafers
5.1.3 Panels
5.1.4 Others
5.2 By Application – Global Semiconductor Compression Molding Equipment Revenue & Forecasts
5.2.1 By Application – Global Semiconductor Compression Molding Equipment Revenue, 2018-2023
5.2.2 By Application – Global Semiconductor Compression Molding Equipment Revenue, 2024-2029
5.2.3 By Application – Global Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
5.3 By Application – Global Semiconductor Compression Molding Equipment Sales & Forecasts
5.3.1 By Application – Global Semiconductor Compression Molding Equipment Sales, 2018-2023
5.3.2 By Application – Global Semiconductor Compression Molding Equipment Sales, 2024-2029
5.3.3 By Application – Global Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
5.4 By Application – Global Semiconductor Compression Molding Equipment Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Semiconductor Compression Molding Equipment Market Size, 2022 & 2029
6.2 By Region – Global Semiconductor Compression Molding Equipment Revenue & Forecasts
6.2.1 By Region – Global Semiconductor Compression Molding Equipment Revenue, 2018-2023
6.2.2 By Region – Global Semiconductor Compression Molding Equipment Revenue, 2024-2029
6.2.3 By Region – Global Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
6.3 By Region – Global Semiconductor Compression Molding Equipment Sales & Forecasts
6.3.1 By Region – Global Semiconductor Compression Molding Equipment Sales, 2018-2023
6.3.2 By Region – Global Semiconductor Compression Molding Equipment Sales, 2024-2029
6.3.3 By Region – Global Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Semiconductor Compression Molding Equipment Revenue, 2018-2029
6.4.2 By Country – North America Semiconductor Compression Molding Equipment Sales, 2018-2029
6.4.3 US Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.4.4 Canada Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.4.5 Mexico Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Semiconductor Compression Molding Equipment Revenue, 2018-2029
6.5.2 By Country – Europe Semiconductor Compression Molding Equipment Sales, 2018-2029
6.5.3 Germany Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.5.4 France Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.5.5 U.K. Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.5.6 Italy Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.5.7 Russia Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.5.8 Nordic Countries Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.5.9 Benelux Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Semiconductor Compression Molding Equipment Revenue, 2018-2029
6.6.2 By Region – Asia Semiconductor Compression Molding Equipment Sales, 2018-2029
6.6.3 China Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.6.4 Japan Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.6.5 South Korea Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.6.6 Southeast Asia Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.6.7 India Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Semiconductor Compression Molding Equipment Revenue, 2018-2029
6.7.2 By Country – South America Semiconductor Compression Molding Equipment Sales, 2018-2029
6.7.3 Brazil Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.7.4 Argentina Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Semiconductor Compression Molding Equipment Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Semiconductor Compression Molding Equipment Sales, 2018-2029
6.8.3 Turkey Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.8.4 Israel Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.8.5 Saudi Arabia Semiconductor Compression Molding Equipment Market Size, 2018-2029
6.8.6 UAE Semiconductor Compression Molding Equipment Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 TOWA Corporation
7.1.1 TOWA Corporation Company Summary
7.1.2 TOWA Corporation Business Overview
7.1.3 TOWA Corporation Semiconductor Compression Molding Equipment Major Product Offerings
7.1.4 TOWA Corporation Semiconductor Compression Molding Equipment Sales and Revenue in Global (2018-2023)
7.1.5 TOWA Corporation Key News & Latest Developments
7.2 Hanmi Semiconductor
7.2.1 Hanmi Semiconductor Company Summary
7.2.2 Hanmi Semiconductor Business Overview
7.2.3 Hanmi Semiconductor Semiconductor Compression Molding Equipment Major Product Offerings
7.2.4 Hanmi Semiconductor Semiconductor Compression Molding Equipment Sales and Revenue in Global (2018-2023)
7.2.5 Hanmi Semiconductor Key News & Latest Developments
7.3 ASMPT
7.3.1 ASMPT Company Summary
7.3.2 ASMPT Business Overview
7.3.3 ASMPT Semiconductor Compression Molding Equipment Major Product Offerings
7.3.4 ASMPT Semiconductor Compression Molding Equipment Sales and Revenue in Global (2018-2023)
7.3.5 ASMPT Key News & Latest Developments
7.4 Yamaha Motor Robotics Holdings
7.4.1 Yamaha Motor Robotics Holdings Company Summary
7.4.2 Yamaha Motor Robotics Holdings Business Overview
7.4.3 Yamaha Motor Robotics Holdings Semiconductor Compression Molding Equipment Major Product Offerings
7.4.4 Yamaha Motor Robotics Holdings Semiconductor Compression Molding Equipment Sales and Revenue in Global (2018-2023)
7.4.5 Yamaha Motor Robotics Holdings Key News & Latest Developments
7.5 Kitagawa Seiki
7.5.1 Kitagawa Seiki Company Summary
7.5.2 Kitagawa Seiki Business Overview
7.5.3 Kitagawa Seiki Semiconductor Compression Molding Equipment Major Product Offerings
7.5.4 Kitagawa Seiki Semiconductor Compression Molding Equipment Sales and Revenue in Global (2018-2023)
7.5.5 Kitagawa Seiki Key News & Latest Developments
8 Global Semiconductor Compression Molding Equipment Production Capacity, Analysis
8.1 Global Semiconductor Compression Molding Equipment Production Capacity, 2018-2029
8.2 Semiconductor Compression Molding Equipment Production Capacity of Key Manufacturers in Global Market
8.3 Global Semiconductor Compression Molding Equipment Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Semiconductor Compression Molding Equipment Supply Chain Analysis
10.1 Semiconductor Compression Molding Equipment Industry Value Chain
10.2 Semiconductor Compression Molding Equipment Upstream Market
10.3 Semiconductor Compression Molding Equipment Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Semiconductor Compression Molding Equipment Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

List of Tables
Table 1. Key Players of Semiconductor Compression Molding Equipment in Global Market
Table 2. Top Semiconductor Compression Molding Equipment Players in Global Market, Ranking by Revenue (2022)
Table 3. Global Semiconductor Compression Molding Equipment Revenue by Companies, (US$, Mn), 2018-2023
Table 4. Global Semiconductor Compression Molding Equipment Revenue Share by Companies, 2018-2023
Table 5. Global Semiconductor Compression Molding Equipment Sales by Companies, (Units), 2018-2023
Table 6. Global Semiconductor Compression Molding Equipment Sales Share by Companies, 2018-2023
Table 7. Key Manufacturers Semiconductor Compression Molding Equipment Price (2018-2023) & (US$/Unit)
Table 8. Global Manufacturers Semiconductor Compression Molding Equipment Product Type
Table 9. List of Global Tier 1 Semiconductor Compression Molding Equipment Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Semiconductor Compression Molding Equipment Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type – Global Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Global Semiconductor Compression Molding Equipment Revenue (US$, Mn), 2018-2023
Table 13. By Type - Global Semiconductor Compression Molding Equipment Revenue (US$, Mn), 2024-2029
Table 14. By Type - Global Semiconductor Compression Molding Equipment Sales (Units), 2018-2023
Table 15. By Type - Global Semiconductor Compression Molding Equipment Sales (Units), 2024-2029
Table 16. By Application – Global Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2022 & 2029
Table 17. By Application - Global Semiconductor Compression Molding Equipment Revenue (US$, Mn), 2018-2023
Table 18. By Application - Global Semiconductor Compression Molding Equipment Revenue (US$, Mn), 2024-2029
Table 19. By Application - Global Semiconductor Compression Molding Equipment Sales (Units), 2018-2023
Table 20. By Application - Global Semiconductor Compression Molding Equipment Sales (Units), 2024-2029
Table 21. By Region – Global Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2022 VS 2029
Table 22. By Region - Global Semiconductor Compression Molding Equipment Revenue (US$, Mn), 2018-2023
Table 23. By Region - Global Semiconductor Compression Molding Equipment Revenue (US$, Mn), 2024-2029
Table 24. By Region - Global Semiconductor Compression Molding Equipment Sales (Units), 2018-2023
Table 25. By Region - Global Semiconductor Compression Molding Equipment Sales (Units), 2024-2029
Table 26. By Country - North America Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2023
Table 27. By Country - North America Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2024-2029
Table 28. By Country - North America Semiconductor Compression Molding Equipment Sales, (Units), 2018-2023
Table 29. By Country - North America Semiconductor Compression Molding Equipment Sales, (Units), 2024-2029
Table 30. By Country - Europe Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2023
Table 31. By Country - Europe Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2024-2029
Table 32. By Country - Europe Semiconductor Compression Molding Equipment Sales, (Units), 2018-2023
Table 33. By Country - Europe Semiconductor Compression Molding Equipment Sales, (Units), 2024-2029
Table 34. By Region - Asia Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2023
Table 35. By Region - Asia Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2024-2029
Table 36. By Region - Asia Semiconductor Compression Molding Equipment Sales, (Units), 2018-2023
Table 37. By Region - Asia Semiconductor Compression Molding Equipment Sales, (Units), 2024-2029
Table 38. By Country - South America Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2023
Table 39. By Country - South America Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2024-2029
Table 40. By Country - South America Semiconductor Compression Molding Equipment Sales, (Units), 2018-2023
Table 41. By Country - South America Semiconductor Compression Molding Equipment Sales, (Units), 2024-2029
Table 42. By Country - Middle East & Africa Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2023
Table 43. By Country - Middle East & Africa Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2024-2029
Table 44. By Country - Middle East & Africa Semiconductor Compression Molding Equipment Sales, (Units), 2018-2023
Table 45. By Country - Middle East & Africa Semiconductor Compression Molding Equipment Sales, (Units), 2024-2029
Table 46. TOWA Corporation Company Summary
Table 47. TOWA Corporation Semiconductor Compression Molding Equipment Product Offerings
Table 48. TOWA Corporation Semiconductor Compression Molding Equipment Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 49. TOWA Corporation Key News & Latest Developments
Table 50. Hanmi Semiconductor Company Summary
Table 51. Hanmi Semiconductor Semiconductor Compression Molding Equipment Product Offerings
Table 52. Hanmi Semiconductor Semiconductor Compression Molding Equipment Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 53. Hanmi Semiconductor Key News & Latest Developments
Table 54. ASMPT Company Summary
Table 55. ASMPT Semiconductor Compression Molding Equipment Product Offerings
Table 56. ASMPT Semiconductor Compression Molding Equipment Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 57. ASMPT Key News & Latest Developments
Table 58. Yamaha Motor Robotics Holdings Company Summary
Table 59. Yamaha Motor Robotics Holdings Semiconductor Compression Molding Equipment Product Offerings
Table 60. Yamaha Motor Robotics Holdings Semiconductor Compression Molding Equipment Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 61. Yamaha Motor Robotics Holdings Key News & Latest Developments
Table 62. Kitagawa Seiki Company Summary
Table 63. Kitagawa Seiki Semiconductor Compression Molding Equipment Product Offerings
Table 64. Kitagawa Seiki Semiconductor Compression Molding Equipment Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 65. Kitagawa Seiki Key News & Latest Developments
Table 66. Semiconductor Compression Molding Equipment Production Capacity (Units) of Key Manufacturers in Global Market, 2021-2023 (Units)
Table 67. Global Semiconductor Compression Molding Equipment Capacity Market Share of Key Manufacturers, 2021-2023
Table 68. Global Semiconductor Compression Molding Equipment Production by Region, 2018-2023 (Units)
Table 69. Global Semiconductor Compression Molding Equipment Production by Region, 2024-2029 (Units)
Table 70. Semiconductor Compression Molding Equipment Market Opportunities & Trends in Global Market
Table 71. Semiconductor Compression Molding Equipment Market Drivers in Global Market
Table 72. Semiconductor Compression Molding Equipment Market Restraints in Global Market
Table 73. Semiconductor Compression Molding Equipment Raw Materials
Table 74. Semiconductor Compression Molding Equipment Raw Materials Suppliers in Global Market
Table 75. Typical Semiconductor Compression Molding Equipment Downstream
Table 76. Semiconductor Compression Molding Equipment Downstream Clients in Global Market
Table 77. Semiconductor Compression Molding Equipment Distributors and Sales Agents in Global Market
List of Figures
Figure 1. Semiconductor Compression Molding Equipment Segment by Type in 2022
Figure 2. Semiconductor Compression Molding Equipment Segment by Application in 2022
Figure 3. Global Semiconductor Compression Molding Equipment Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Semiconductor Compression Molding Equipment Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Semiconductor Compression Molding Equipment Revenue, 2018-2029 (US$, Mn)
Figure 7. Semiconductor Compression Molding Equipment Sales in Global Market: 2018-2029 (Units)
Figure 8. The Top 3 and 5 Players Market Share by Semiconductor Compression Molding Equipment Revenue in 2022
Figure 9. By Type - Global Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2022 & 2029
Figure 10. By Type - Global Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 11. By Type - Global Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 12. By Type - Global Semiconductor Compression Molding Equipment Price (US$/Unit), 2018-2029
Figure 13. By Application - Global Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2022 & 2029
Figure 14. By Application - Global Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 15. By Application - Global Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 16. By Application - Global Semiconductor Compression Molding Equipment Price (US$/Unit), 2018-2029
Figure 17. By Region - Global Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2022 & 2029
Figure 18. By Region - Global Semiconductor Compression Molding Equipment Revenue Market Share, 2018 VS 2022 VS 2029
Figure 19. By Region - Global Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 20. By Region - Global Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 21. By Country - North America Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 22. By Country - North America Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 23. US Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 24. Canada Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 25. Mexico Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 26. By Country - Europe Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 27. By Country - Europe Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 28. Germany Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 29. France Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 30. U.K. Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 31. Italy Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 32. Russia Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 33. Nordic Countries Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 34. Benelux Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 35. By Region - Asia Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 36. By Region - Asia Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 37. China Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 38. Japan Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 39. South Korea Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 40. Southeast Asia Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 41. India Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 42. By Country - South America Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 43. By Country - South America Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 44. Brazil Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 45. Argentina Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 46. By Country - Middle East & Africa Semiconductor Compression Molding Equipment Revenue Market Share, 2018-2029
Figure 47. By Country - Middle East & Africa Semiconductor Compression Molding Equipment Sales Market Share, 2018-2029
Figure 48. Turkey Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 49. Israel Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 50. Saudi Arabia Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 51. UAE Semiconductor Compression Molding Equipment Revenue, (US$, Mn), 2018-2029
Figure 52. Global Semiconductor Compression Molding Equipment Production Capacity (Units), 2018-2029
Figure 53. The Percentage of Production Semiconductor Compression Molding Equipment by Region, 2022 VS 2029
Figure 54. Semiconductor Compression Molding Equipment Industry Value Chain
Figure 55. Marketing Channels

※参考情報

半導体圧縮成形装置は、半導体デバイスの製造過程において重要な役割を果たす機器です。この装置は、主に樹脂材料を用いて半導体チップをパッケージングするために使用されます。圧縮成形技術は、特に複雑な形状や高い精度が要求される部品を作成するために優れた手法とされています。

圧縮成形とは、予め成形された材料を型に充填し、高温・高圧下で加熱しながら固化させるプロセスです。このプロセスは、樹脂材料を使用する際に特に有効で、流動性が高く、熱可塑性樹脂や熱硬化性樹脂のいずれでも使用できます。樹脂が加熱されると、粘度が低下し、型の中に均等に広がります。その後、冷却することで樹脂は固まります。この一連の作業によって、期待される機能や形状を持つ半導体パッケージが完成します。

半導体圧縮成形装置の特徴にはいくつかの要素があります。まず、成形精度が高く、微細なパターンを持つ半導体チップでも再現可能です。次に、成形サイクルが比較的短いため、大量生産に適した生産ラインに組み込むことができます。さらに、材料のコストが低くなる可能性があり、経済的な利点を提供します。そして、様々なサイズや形状のチップに対応できる柔軟性も評価されています。

さまざまな種類の半導体圧縮成形装置がありますが、主にその動作方式に基づいて分類されます。代表的なものには、手動式、半自動式、全自動式があります。手動式は、小規模な試作や研究開発に適しており、オペレーターが操作を行います。半自動式は、生産効率を向上させるために、一部の自動化が導入されたモデルです。全自動式は、製品の投入から成形、冷却、取り出しまでの全プロセスを自動で行うことができ、最新の製造ラインに導入されています。

圧縮成形の過程で使用される材料には、エポキシ樹脂、ポリイミド、シリコンなどが含まれます。これらの材料は、半導体デバイスの特性に応じて適切に選択されます。例えば、高熱伝導性が要求される場合には特定の材料が使用され、環境耐性が求められる際には別の材料が選ばれることがあります。

用途としては、マイクロプロセッサ、メモリチップ、伝導性材料としてのセンサーなど、さまざまな半導体デバイスのパッケージングに広く用いられています。また、モバイルデバイスや自動車電子機器、IoTデバイスなど、現代の多様な電子機器においてその重要性は増しています。

半導体圧縮成形装置に関連する技術としては、材料工学、熱管理技術、工程制御技術などが挙げられます。材料工学では、新しい樹脂材料の開発や、従来材料の改良が行われています。例えば、特定の条件下での強度や耐熱性を向上させるための合金化などが進められています。

熱管理技術においては、圧縮過程での温度管理が製品の品質に大きく影響するため、正確な温度制御システムの導入が求められます。生産プロセス中の温度変動を最小限に抑え、一貫した品質を確保するために、センサー技術や制御技術が活用されています。

さらに、工程制御技術により生産効率の向上が図られています。製造過程におけるデータ収集と解析により、装置の運転状態や品質管理をリアルタイムで監視し、最適化することが可能です。また、IoT技術の導入によって、遠隔での監視や操作が行えるようになり、稼働時間の延長やトラブルシューティングが容易になります。

このように、半導体圧縮成形装置は高い精度と生産性を誇る重要な機器であり、今後も電子機器の小型化、高機能化へのニーズに応えるため進化していくことが期待されています。技術の進歩により、より多様化した用途へと展開されていくことでしょう。半導体業界において中心的な役割を果たすこの装置は、今や現代の情報社会の根幹を支える重要なテクノロジーの一つとして、ますます注目されることになるでしょう。

❖ 免責事項 ❖
http://www.globalresearch.jp/disclaimer

★リサーチレポート[ 半導体圧縮成形装置の世界市場見通し2023年-2029年(Semiconductor Compression Molding Equipment Market, Global Outlook and Forecast 2023-2029)]についてメールでお問い合わせはこちらでお願いします。

GlobalResearch.jp

半導体圧縮成形装置の世界市場見通し2023年-2029年

グローバル市場調査/マーケットリサーチ会社：レポート販売と委託調査サービス提供 www.GlobalResearch.jp