有機基板パッケージング材料の世界市場2015-2019

Technavioが発行した調査報告書(IRTNTR6945)
◆英語タイトル:Global Organic Substrate Packaging Material Market 2015-2019
◆商品コード:IRTNTR6945
◆発行会社(リサーチ会社):Technavio
◆発行日:2015年9月2日
◆ページ数:67
◆レポート形式:英語 / pdf
◆納品方法:Eメール
◆調査対象地域:グローバル
◆産業分野:材料
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当調査レポートでは、有機基板パッケージング材料の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、有機基板パッケージング材料の世界市場規模及び予測、パッケージング材料別分析、地域別分析、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。

・エグゼクティブサマリー
・市場概観
・業界の構造分析
・有機基板パッケージング材料の世界市場:市場規模及び予測
・有機基板パッケージング材料の世界市場:パッケージング材料別分析
・有機基板パッケージング材料の世界市場:地域別分析
・主要国別分析
・市場の成長要因
・市場の課題
・市場動向
・競争状況
・主要企業(ベンダー)分析
...

※上記の和訳は最新内容ではない場合があります。
【レポートの概要】

About organic substrate packaging materials
Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.

Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.

Technavio’s analysts forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.

[Covered in this report]
This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following:
• Packaging technology
• Geography

Technavio’s report, Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.

[Key regions]
• APAC
• Europe
• North America
• ROW

[Key vendors]
• AJINOMOTO
• AMKOR
• ASE Kaohsiung
• Mitsubishi Gas Chemical
• SPIL
• STATS ChipPAC

[Market driver]
• Demand for wireless devices
• For a full, detailed list, view our report

[Market challenge]
• Dependency on semiconductor equipment industry performance
• For a full, detailed list, view our report

[Market trend]
• Popularity of redistributed chip packaging
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

【レポートの目次】

PART 01: Executive summary
Highlights

PART 02: Scope of the report
Market overview
Top vendor offerings

PART 03: Market research methodology
Research methodology
Economic indicators

PART 04: Introduction
Key market highlights

PART 05: Market landscape
Market overview
Market size and forecast
Five forces analysis

PART 06: Market segmentation by packaging technology
Market segmentation by packaging technology
Global SO packaging technology overview
Global GA packaging technology overview
Global flat no-leads packaging technology overview
Global QFP packaging technology overview
Global DIP packaging technology overview
Global other packaging technologies overview

PART 07: Geographical segmentation
Geographical segmentation of global organic substrate packaging material market 2014-2019
Organic substrate packaging material market in APAC
Organic substrate packaging material market in Taiwan
Organic substrate packaging material market in Japan
Organic substrate packaging material market in South Korea
Organic substrate packaging material market in China
Organic substrate packaging material market in North America
Organic substrate packaging material market in Europe

PART 08: Key leading countries
Taiwan
South Korea
China

PART 09: Market drivers
Growth drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape
Competitive scenario
Key market vendors 2014

PART 15: Key vendor analysis
Ajinomoto
Amkor Technology
ASE Kaohsiung
Mitsubishi Gas Chemical Company
Siliconware Precision Industries
STATS ChipPAC

PART 16: Appendix
List of abbreviation

PART 17: Explore Technavio

[List of Exhibits]

Exhibit 01: Segmentation of global organic substrate packaging material market
Exhibit 02: Product offerings
Exhibit 03: Global organic substrate packaging material market
Exhibit 04: Geographical segmentation of global organic substrate packaging material market
Exhibit 05: Global organic substrate packaging material market by packaging technology
Exhibit 06: Global organic substrate packaging material market 2014-2019 ($ billions)
Exhibit 07: Five forces analysis
Exhibit 08: Geographical segmentation of global organic substrate packaging material market 2014
Exhibit 09: Organic substrate packaging material market in APAC 2014
Exhibit 10: Organic substrate packaging material market in Taiwan 2014-2019 ($ billions)
Exhibit 11: Organic substrate packaging material market in Japan 2014-2019 ($ billions)
Exhibit 12: Organic substrate packaging material market in South Korea 2014-2019 ($ billions)
Exhibit 13: Organic substrate packaging material market in China 2014-2019 ($ billions)
Exhibit 14: Organic substrate packaging material market in North America 2014-2019 ($ billions)
Exhibit 15: Organic substrate packaging material market in Europe 2014-2019 ($ billions)
Exhibit 16: Impact of drivers
Exhibit 17: Impact of drivers and challenges
Exhibit 18: Key market vendors 2014
Exhibit 19: Ajinomoto: Business segmentation by revenue 2014
Exhibit 20: Ajinomoto: Geographical segmentation 2014
Exhibit 21: Amkor Technology: Product segmentation by revenue 2014
Exhibit 22: Amkor Technology: Product segmentation comparison by revenue 2013 and 2014 ($ billions)
Exhibit 23: Amkor Technology: Geographical segmentation by revenue 2014
Exhibit 24: Mitsubishi Gas Chemical Company: Business segmentation 2014
Exhibit 25: Mitsubishi Gas Chemical Company: Product segmentation by revenue 2014
Exhibit 26: Mitsubishi Gas Chemical Company: Geographical segmentation by revenue 2014
Exhibit 27: Siliconware Precision Industries: Business segmentation by revenue 2014
Exhibit 28: Siliconware Precision Industries: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 29: Siliconware Precision Industries: Geographical segmentation by revenue 2014
Exhibit 30: STATS ChipPAC: Product segmentation by revenue 2014
Exhibit 31: STATS ChipPAC: Geographical segmentation by revenue 2013



【掲載企業】

ASE Kaohsiung, AMKOR, SPIL, STATS ChipPAC, Mitsubishi, AJINOMOTO

【レポートのキーワード】

有機基板パッケージング材料、半導体パッケージング技術、SO、GA、QFP、DIP

【リサーチ方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

【免責事項】
http://www.globalresearch.jp/disclaimer

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