電子パッケージングの世界市場:RFID、電子式商品監視(EAS)

◆英語タイトル:Global Electronic Packaging Market 2015-2019
◆商品コード:IRTNTR5421
◆発行会社(リサーチ会社):Technavio
◆発行日:2015年3月4日
◆ページ数:61
◆レポート形式:英語 / pdf
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当調査レポートでは、電子パッケージングの世界市場について調査・分析し、エグゼクティブサマリー、市場概観、業界の構造分析、電子パッケージングの世界市場規模及び予測、技術別分析、地域別分析、購買基準、市場成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。

・エグゼクティブサマリー
・市場概観
・業界の構造分析
・電子パッケージングの世界市場:市場規模及び予測
・電子パッケージングの世界市場:技術別分析
・電子パッケージングの世界市場:地域別分析
・購買基準
・市場成長要因
・市場の課題
・市場動向
・競争状況
・主要企業(ベンダー)分析
...

※上記の和訳は最新内容ではない場合があります。
【レポートの概要】

About Electronic Packaging
Electronic packaging involves the use of engineering and other technologies to incorporate in-built security and protective features in the packaging of products. The use of electronics in packaging is gaining importance as it reduces wastage and enhances safety and security, product differentiation, convenience, brand enhancement, and quality assurance. Printed electronics is the primary technology used, which is expected to reduce the cost of electronic packaging dramatically. Overall, the popularity of electronic packaging is increasing with growing awareness among manufacturers.

TechNavio’s analysts forecast the revenue and volume of the Global Electronic Packaging market to grow at a CAGR of 47.02 percent and 46.26 percent, respectively, over the period 2014-2019.

[Covered in this Report]
This report covers the present scenario and the growth prospects of the Global Electronic Packaging market for the period 2015-2019. To calculate the market size, the report has taken into consideration the revenue generated by electronic packaging used in the packaging of a number of products. The report includes market segmentation based on type of function and technology used.

The primary functional categories of electronic packaging are:
• Audio/Timer
• Health
• Other CPG
• Scroll/Page Turn
• Status
• Wink/Decal

The Global Electronic Packaging market can also be segmented based on the following technologies:
• EAS
• RFID

This report also presents the vendor landscape and a corresponding detailed analysis of the top five vendors in the market. The vendors include both suppliers and distributors of electronic packaging devices and technologies, primarily those dealing in printed technologies. In addition, the report discusses the major drivers that influence the growth of the market. It also outlines the challenges faced by vendors and the market at large, as well as the key trends that are emerging in the market.
TechNavio’s report, Global Electronic Packaging Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, and the APAC and EMEA regions; it also covers the Global Electronic Packaging market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key Regions]
• Americas
• APAC
• EMEA

[Key Vendors]
• BASF
• Enfucell
• MeadWestvaco
• Soligie
• T-Ink

[Other Prominent Vendors]
• Blue Spark Technologies
• Canatu
• Cap-XX
• Cymbet
• Excellatron Solid State
• Fraunhofer Institute for Electronic Nano Systems
• Front Edge Technology
• Holst Centre
• Infinite Power Solutions
• Infratab
• Kovio
• NEC
• Novalia
• Plastic Logic
• PragmatIC Printing
• Printechnologics
• PST Sensors
• Solarmer Energy
• Thin Film Electronics ASA

[Market Driver]
• Influence of Consumer Demand on Packaging
• For a full, detailed list, view our report

[Market Challenge]
• High Cost of Electronic Packaging
• For a full, detailed list, view our report

[Market Trend]
• Technological Advancements in Printed Electronics
• For a full, detailed list, view our report

[Key Questions Answered in this Report]
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

【レポートの目次】

01. Executive Summary

02.List of Abbreviations

03.Scope of the Report
03.1 Market Overview
03.2 Product Offerings

04.Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology

05.Introduction

06.Market Landscape
06.1 Global Electronic Packaging Market Overview
06.1.1 Segmentation of Global Electronic Packaging Market by Function
06.1.2 Segmentation of Global Electronic Packaging Market by Technology
06.1.3 Segmentation of Global Electronic Packaging Market by Geography

07.Global Electronic Packaging Market
07.1 Market Size and Forecast by Revenue
07.2 Market Size and Forecast by Volume
07.3 Five Forces Analysis

08.Market Segmentation by Function
08.1 Global Electronic Packaging Market by Function 2014
08.1.1 Wink/Decal
08.1.2 Audio/Timer
08.1.3 Status
08.1.4 Health
08.1.5 Scroll/Page Turn and Other CPG Segment
08.1.6 Others

09.Market Segmentation by Technology
09.1 Global Electronic Packaging Market by Technology 2014 and 2019
09.1.1 RFID
09.1.2 EAS
09.1.3 Others

10.Geographical Segmentation
10.1 Global Electronic Packaging Market by Geographical Segmentation 2014

11.Buying Criteria

12.Market Growth Drivers

13.Drivers and their Impact

14.Market Challenges

15.Impact of Drivers and Challenges

16.Market Trends

17.Trends and their Impact

18.Vendor Landscape
18.1 Competitive Scenario
18.2 Key Vendor Ranking 2014
18.3 Other Prominent Vendors

19.Key Vendor Analysis
19.1 BASF
19.1.1 Key Facts
19.1.2 Business Overview
19.1.3 Business/Product Segmentation
19.1.4 Business Segmentation by Revenue 2012 and 2013
19.1.5 Geographical Segmentation by Revenue 2013
19.1.6 Business Strategy
19.1.7 Recent Developments
19.1.8 SWOT Analysis
19.2 Enfucell
19.2.1 Key Facts
19.2.2 Business Overview
19.2.3 Recent Developments
19.2.4 SWOT Analysis
19.3 MeadWestvaco
19.3.1 Key Facts
19.3.2 Business Overview
19.3.3 Business Segmentation by Revenue 2013
19.3.4 Business Segmentation by Revenue 2012 and 2013
19.3.5 Geographical Segmentation by Revenue 2013
19.3.6 Recent Developments
19.3.7 SWOT Analysis
19.4 Soligie
19.4.1 Key Facts
19.4.2 Business Overview
19.4.3 Key End Markets
19.4.4 Business Strategy
19.4.5 Recent Developments
19.4.6 SWOT Analysis
19.5 T-Ink
19.5.1 Key Facts
19.5.2 Business Overview
19.5.3 Recent Developments
19.5.4 SWOT Analysis

20.Other Reports in this Series

[List of Exhibits]

Exhibit 1: Market Research Methodology
Exhibit 2: Segmentation of Global Electronic Packaging Market
Exhibit 3: Segmentation of Global Electronic Packaging Market by Function
Exhibit 4: Segmentation of Global Electronic Packaging Market by Technology
Exhibit 5: Segmentation of Global Electronic Packaging Market by Geography
Exhibit 6: Global Electronic Packaging Market 2014-2019 (US$ million)
Exhibit 7: Global Electronic Packaging Market 2014-2019 (billion units)
Exhibit 8: Global Electronic Packaging Market by Function 2014
Exhibit 9: Global Electronic Packaging Market by Technology 2014 and 2019
Exhibit 10: Global Electronic Packaging Market by Geographical Segmentation 2014
Exhibit 11: BASF: Business Segmentation 2013
Exhibit 12: BASF: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 13: BASF: Geographical Segmentation by Revenue 2013
Exhibit 14: MeadWestvaco: Business Segmentation by Revenue 2013
Exhibit 15: MeadWestvaco: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 16: MeadWestvaco: Geographical Segmentation by Revenue 2013
Exhibit 17: Soligie: Key End Markets



【掲載企業】

BASF, Enfucell, MeadWestvaco, Soligie, T-Ink, Blue Spark Technologies, Canatu, Cap-XX, Cymbet, Excellatron Solid State, Fraunhofer Institute for Electronic Nano Systems, Front Edge Technology, Holst Centre , Infinite Power Solutions, Infratab,Kovio, NEC, Novalia, Plastic Logic, PragmatIC Printing, Printechnologics, PST Sensors, Solarmer Energy, Thin Film Electronics ASA  

【レポートのキーワード】

電子パッケージング、包装、パッケージ、RFID、電子式商品監視(EAS)

【リサーチ方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

【免責事項】
http://www.globalresearch.jp/disclaimer

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