カテゴリー： QYResearch, 世界, 産業機械/建設

世界の半導体ダイシング装置市場インサイト及び予測（砥石ダイシング機、レーザーダイシング機）

◆英語タイトル：Global Semiconductor Dicing Equipment Market Insights, Forecast to 2028
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❖ レポートの概要 ❖

COVID-19のパンデミックにより、半導体ダイシング装置のグローバル市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx％で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年に半導体ダイシング装置の世界市場のxxx％を占める「砥石ダイシング機」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx％CAGRで成長すると予測されています。一方、「200mmウェーハ」セグメントは、この予測期間を通じてxxx％のCAGRに変更されます。
半導体ダイシング装置の中国市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパの市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx％であり、中国とヨーロッパはそれぞれxxx％とxxx％です。中国の割合は2028年にxxx％に達し、対象期間を通じてxxx％のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx％、xxx％、xxx％になる見通しです。ヨーロッパの半導体ダイシング装置市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx％になる見通しです。

半導体ダイシング装置のグローバル主要企業には、ULVAC、Disco、ACCRETECH、Genesem、JPSA、QMC、AMTEC、Shenzhen HiPA、Mirle Automation Corporation、LPKF SolarQuipment GmbH、GL Tech Co.,Ltd.などがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。

半導体ダイシング装置市場は、種類と用途によって区分されます。世界の半導体ダイシング装置市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。

【種類別セグメント】
砥石ダイシング機、レーザーダイシング機

【用途別セグメント】
200mmウェーハ、300mmウェーハ、その他

【掲載地域】
北米：アメリカ、カナダ
ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米：メキシコ、ブラジル、アルゼンチン
中東・アフリカ：トルコ、サウジアラビア、UAE

【目次（一部）】

・調査の範囲
- 半導体ダイシング装置製品概要
- 種類別市場（砥石ダイシング機、レーザーダイシング機）
- 用途別市場（200mmウェーハ、300mmウェーハ、その他）
- 調査の目的
・エグゼクティブサマリー
- 世界の半導体ダイシング装置販売量予測2017-2028
- 世界の半導体ダイシング装置売上予測2017-2028
- 半導体ダイシング装置の地域別販売量
- 半導体ダイシング装置の地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別半導体ダイシング装置販売量
- 主要メーカー別半導体ダイシング装置売上
- 主要メーカー別半導体ダイシング装置価格
- 競争状況の分析
- 企業M&A動向
・種類別市場規模（砥石ダイシング機、レーザーダイシング機）
- 半導体ダイシング装置の種類別販売量
- 半導体ダイシング装置の種類別売上
- 半導体ダイシング装置の種類別価格
・用途別市場規模（200mmウェーハ、300mmウェーハ、その他）
- 半導体ダイシング装置の用途別販売量
- 半導体ダイシング装置の用途別売上
- 半導体ダイシング装置の用途別価格
・北米市場
- 北米の半導体ダイシング装置市場規模（種類別、用途別）
- 主要国別の半導体ダイシング装置市場規模（アメリカ、カナダ）
・ヨーロッパ市場
- ヨーロッパの半導体ダイシング装置市場規模（種類別、用途別）
- 主要国別の半導体ダイシング装置市場規模（ドイツ、フランス、イギリス、イタリア、ロシア）
・アジア太平洋市場
- アジア太平洋の半導体ダイシング装置市場規模（種類別、用途別）
- 主要国別の半導体ダイシング装置市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア）
・中南米市場
- 中南米の半導体ダイシング装置市場規模（種類別、用途別）
- 主要国別の半導体ダイシング装置市場規模（メキシコ、ブラジル、アルゼンチン）
・中東・アフリカ市場
- 中東・アフリカの半導体ダイシング装置市場規模（種類別、用途別）
- 主要国別の半導体ダイシング装置市場規模（トルコ、サウジアラビア）
・企業情報
ULVAC、Disco、ACCRETECH、Genesem、JPSA、QMC、AMTEC、Shenzhen HiPA、Mirle Automation Corporation、LPKF SolarQuipment GmbH、GL Tech Co.,Ltd.
・産業チェーン及び販売チャネル分析
- 半導体ダイシング装置の産業チェーン分析
- 半導体ダイシング装置の原材料
- 半導体ダイシング装置の生産プロセス
- 半導体ダイシング装置の販売及びマーケティング
- 半導体ダイシング装置の主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- 半導体ダイシング装置の産業動向
- 半導体ダイシング装置のマーケットドライバー
- 半導体ダイシング装置の課題
- 半導体ダイシング装置の阻害要因
・主な調査結果

Market Analysis and Insights: Global Semiconductor Dicing Equipment Market
Due to the COVID-19 pandemic, the global Semiconductor Dicing Equipment market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Grinding Wheel Dicing Machine accounting for % of the Semiconductor Dicing Equipment global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While 200 mm Wafer segment is altered to an % CAGR throughout this forecast period.
China Semiconductor Dicing Equipment market size is valued at US$ million in 2021, while the US and Europe Semiconductor Dicing Equipment are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Semiconductor Dicing Equipment landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
The global key manufacturers of Semiconductor Dicing Equipment include ULVAC, Disco, ACCRETECH, Genesem, JPSA, QMC, AMTEC, Shenzhen HiPA and Mirle Automation Corporation, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Semiconductor Dicing Equipment capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Semiconductor Dicing Equipment by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Semiconductor Dicing Equipment Scope and Segment
Semiconductor Dicing Equipment market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Semiconductor Dicing Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Grinding Wheel Dicing Machine
Laser Dicing Machine
Segment by Application
200 mm Wafer
300 mm Wafer
Others
By Company
ULVAC
Disco
ACCRETECH
Genesem
JPSA
QMC
AMTEC
Shenzhen HiPA
Mirle Automation Corporation
LPKF SolarQuipment GmbH
GL Tech Co.,Ltd.
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

❖ レポートの目次 ❖

1 Study Coverage
1.1 Semiconductor Dicing Equipment Product Introduction
1.2 Market by Type
1.2.1 Global Semiconductor Dicing Equipment Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Grinding Wheel Dicing Machine
1.2.3 Laser Dicing Machine
1.3 Market by Application
1.3.1 Global Semiconductor Dicing Equipment Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 200 mm Wafer
1.3.3 300 mm Wafer
1.3.4 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Semiconductor Dicing Equipment Production
2.1 Global Semiconductor Dicing Equipment Production Capacity (2017-2028)
2.2 Global Semiconductor Dicing Equipment Production by Region: 2017 VS 2021 VS 2028
2.3 Global Semiconductor Dicing Equipment Production by Region
2.3.1 Global Semiconductor Dicing Equipment Historic Production by Region (2017-2022)
2.3.2 Global Semiconductor Dicing Equipment Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
3 Global Semiconductor Dicing Equipment Sales in Volume & Value Estimates and Forecasts
3.1 Global Semiconductor Dicing Equipment Sales Estimates and Forecasts 2017-2028
3.2 Global Semiconductor Dicing Equipment Revenue Estimates and Forecasts 2017-2028
3.3 Global Semiconductor Dicing Equipment Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global Semiconductor Dicing Equipment Sales by Region
3.4.1 Global Semiconductor Dicing Equipment Sales by Region (2017-2022)
3.4.2 Global Sales Semiconductor Dicing Equipment by Region (2023-2028)
3.5 Global Semiconductor Dicing Equipment Revenue by Region
3.5.1 Global Semiconductor Dicing Equipment Revenue by Region (2017-2022)
3.5.2 Global Semiconductor Dicing Equipment Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global Semiconductor Dicing Equipment Production Capacity by Manufacturers
4.2 Global Semiconductor Dicing Equipment Sales by Manufacturers
4.2.1 Global Semiconductor Dicing Equipment Sales by Manufacturers (2017-2022)
4.2.2 Global Semiconductor Dicing Equipment Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of Semiconductor Dicing Equipment in 2021
4.3 Global Semiconductor Dicing Equipment Revenue by Manufacturers
4.3.1 Global Semiconductor Dicing Equipment Revenue by Manufacturers (2017-2022)
4.3.2 Global Semiconductor Dicing Equipment Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by Semiconductor Dicing Equipment Revenue in 2021
4.4 Global Semiconductor Dicing Equipment Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Semiconductor Dicing Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global Semiconductor Dicing Equipment Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Semiconductor Dicing Equipment Sales by Type
5.1.1 Global Semiconductor Dicing Equipment Historical Sales by Type (2017-2022)
5.1.2 Global Semiconductor Dicing Equipment Forecasted Sales by Type (2023-2028)
5.1.3 Global Semiconductor Dicing Equipment Sales Market Share by Type (2017-2028)
5.2 Global Semiconductor Dicing Equipment Revenue by Type
5.2.1 Global Semiconductor Dicing Equipment Historical Revenue by Type (2017-2022)
5.2.2 Global Semiconductor Dicing Equipment Forecasted Revenue by Type (2023-2028)
5.2.3 Global Semiconductor Dicing Equipment Revenue Market Share by Type (2017-2028)
5.3 Global Semiconductor Dicing Equipment Price by Type
5.3.1 Global Semiconductor Dicing Equipment Price by Type (2017-2022)
5.3.2 Global Semiconductor Dicing Equipment Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global Semiconductor Dicing Equipment Sales by Application
6.1.1 Global Semiconductor Dicing Equipment Historical Sales by Application (2017-2022)
6.1.2 Global Semiconductor Dicing Equipment Forecasted Sales by Application (2023-2028)
6.1.3 Global Semiconductor Dicing Equipment Sales Market Share by Application (2017-2028)
6.2 Global Semiconductor Dicing Equipment Revenue by Application
6.2.1 Global Semiconductor Dicing Equipment Historical Revenue by Application (2017-2022)
6.2.2 Global Semiconductor Dicing Equipment Forecasted Revenue by Application (2023-2028)
6.2.3 Global Semiconductor Dicing Equipment Revenue Market Share by Application (2017-2028)
6.3 Global Semiconductor Dicing Equipment Price by Application
6.3.1 Global Semiconductor Dicing Equipment Price by Application (2017-2022)
6.3.2 Global Semiconductor Dicing Equipment Price Forecast by Application (2023-2028)
7 North America
7.1 North America Semiconductor Dicing Equipment Market Size by Type
7.1.1 North America Semiconductor Dicing Equipment Sales by Type (2017-2028)
7.1.2 North America Semiconductor Dicing Equipment Revenue by Type (2017-2028)
7.2 North America Semiconductor Dicing Equipment Market Size by Application
7.2.1 North America Semiconductor Dicing Equipment Sales by Application (2017-2028)
7.2.2 North America Semiconductor Dicing Equipment Revenue by Application (2017-2028)
7.3 North America Semiconductor Dicing Equipment Sales by Country
7.3.1 North America Semiconductor Dicing Equipment Sales by Country (2017-2028)
7.3.2 North America Semiconductor Dicing Equipment Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe Semiconductor Dicing Equipment Market Size by Type
8.1.1 Europe Semiconductor Dicing Equipment Sales by Type (2017-2028)
8.1.2 Europe Semiconductor Dicing Equipment Revenue by Type (2017-2028)
8.2 Europe Semiconductor Dicing Equipment Market Size by Application
8.2.1 Europe Semiconductor Dicing Equipment Sales by Application (2017-2028)
8.2.2 Europe Semiconductor Dicing Equipment Revenue by Application (2017-2028)
8.3 Europe Semiconductor Dicing Equipment Sales by Country
8.3.1 Europe Semiconductor Dicing Equipment Sales by Country (2017-2028)
8.3.2 Europe Semiconductor Dicing Equipment Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific Semiconductor Dicing Equipment Market Size by Type
9.1.1 Asia Pacific Semiconductor Dicing Equipment Sales by Type (2017-2028)
9.1.2 Asia Pacific Semiconductor Dicing Equipment Revenue by Type (2017-2028)
9.2 Asia Pacific Semiconductor Dicing Equipment Market Size by Application
9.2.1 Asia Pacific Semiconductor Dicing Equipment Sales by Application (2017-2028)
9.2.2 Asia Pacific Semiconductor Dicing Equipment Revenue by Application (2017-2028)
9.3 Asia Pacific Semiconductor Dicing Equipment Sales by Region
9.3.1 Asia Pacific Semiconductor Dicing Equipment Sales by Region (2017-2028)
9.3.2 Asia Pacific Semiconductor Dicing Equipment Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America Semiconductor Dicing Equipment Market Size by Type
10.1.1 Latin America Semiconductor Dicing Equipment Sales by Type (2017-2028)
10.1.2 Latin America Semiconductor Dicing Equipment Revenue by Type (2017-2028)
10.2 Latin America Semiconductor Dicing Equipment Market Size by Application
10.2.1 Latin America Semiconductor Dicing Equipment Sales by Application (2017-2028)
10.2.2 Latin America Semiconductor Dicing Equipment Revenue by Application (2017-2028)
10.3 Latin America Semiconductor Dicing Equipment Sales by Country
10.3.1 Latin America Semiconductor Dicing Equipment Sales by Country (2017-2028)
10.3.2 Latin America Semiconductor Dicing Equipment Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
11 Middle East and Africa
11.1 Middle East and Africa Semiconductor Dicing Equipment Market Size by Type
11.1.1 Middle East and Africa Semiconductor Dicing Equipment Sales by Type (2017-2028)
11.1.2 Middle East and Africa Semiconductor Dicing Equipment Revenue by Type (2017-2028)
11.2 Middle East and Africa Semiconductor Dicing Equipment Market Size by Application
11.2.1 Middle East and Africa Semiconductor Dicing Equipment Sales by Application (2017-2028)
11.2.2 Middle East and Africa Semiconductor Dicing Equipment Revenue by Application (2017-2028)
11.3 Middle East and Africa Semiconductor Dicing Equipment Sales by Country
11.3.1 Middle East and Africa Semiconductor Dicing Equipment Sales by Country (2017-2028)
11.3.2 Middle East and Africa Semiconductor Dicing Equipment Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 ULVAC
12.1.1 ULVAC Corporation Information
12.1.2 ULVAC Overview
12.1.3 ULVAC Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 ULVAC Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 ULVAC Recent Developments
12.2 Disco
12.2.1 Disco Corporation Information
12.2.2 Disco Overview
12.2.3 Disco Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Disco Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Disco Recent Developments
12.3 ACCRETECH
12.3.1 ACCRETECH Corporation Information
12.3.2 ACCRETECH Overview
12.3.3 ACCRETECH Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 ACCRETECH Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 ACCRETECH Recent Developments
12.4 Genesem
12.4.1 Genesem Corporation Information
12.4.2 Genesem Overview
12.4.3 Genesem Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 Genesem Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Genesem Recent Developments
12.5 JPSA
12.5.1 JPSA Corporation Information
12.5.2 JPSA Overview
12.5.3 JPSA Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 JPSA Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 JPSA Recent Developments
12.6 QMC
12.6.1 QMC Corporation Information
12.6.2 QMC Overview
12.6.3 QMC Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 QMC Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 QMC Recent Developments
12.7 AMTEC
12.7.1 AMTEC Corporation Information
12.7.2 AMTEC Overview
12.7.3 AMTEC Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 AMTEC Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 AMTEC Recent Developments
12.8 Shenzhen HiPA
12.8.1 Shenzhen HiPA Corporation Information
12.8.2 Shenzhen HiPA Overview
12.8.3 Shenzhen HiPA Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 Shenzhen HiPA Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Shenzhen HiPA Recent Developments
12.9 Mirle Automation Corporation
12.9.1 Mirle Automation Corporation Corporation Information
12.9.2 Mirle Automation Corporation Overview
12.9.3 Mirle Automation Corporation Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Mirle Automation Corporation Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Mirle Automation Corporation Recent Developments
12.10 LPKF SolarQuipment GmbH
12.10.1 LPKF SolarQuipment GmbH Corporation Information
12.10.2 LPKF SolarQuipment GmbH Overview
12.10.3 LPKF SolarQuipment GmbH Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 LPKF SolarQuipment GmbH Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 LPKF SolarQuipment GmbH Recent Developments
12.11 GL Tech Co.,Ltd.
12.11.1 GL Tech Co.,Ltd. Corporation Information
12.11.2 GL Tech Co.,Ltd. Overview
12.11.3 GL Tech Co.,Ltd. Semiconductor Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.11.4 GL Tech Co.,Ltd. Semiconductor Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 GL Tech Co.,Ltd. Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Semiconductor Dicing Equipment Industry Chain Analysis
13.2 Semiconductor Dicing Equipment Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Semiconductor Dicing Equipment Production Mode & Process
13.4 Semiconductor Dicing Equipment Sales and Marketing
13.4.1 Semiconductor Dicing Equipment Sales Channels
13.4.2 Semiconductor Dicing Equipment Distributors
13.5 Semiconductor Dicing Equipment Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 Semiconductor Dicing Equipment Industry Trends
14.2 Semiconductor Dicing Equipment Market Drivers
14.3 Semiconductor Dicing Equipment Market Challenges
14.4 Semiconductor Dicing Equipment Market Restraints
15 Key Finding in The Global Semiconductor Dicing Equipment Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer

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