世界のシステムインパッケージ(SiP)技術市場2016-2022

KBV Researchが発行した調査報告書(KBVR702012)
◆英語タイトル:Global System in Package (SiP) Technology Market (2016-2022)
◆商品コード:KBVR702012
◆発行会社(リサーチ会社):KBV Research
◆発行日:2017年1月31日
◆ページ数:308
◆レポート形式:英語 / PDF
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【レポートの概要】

The Global System in Package (SiP) Technology Market is expected to reach $29.3 billion by 2022, growing at a CAGR of 10.9% during 2016 -2022.SiP is a packaging technology, containing multiple die within a single module. It is a combination of different integrated circuits in a compact size, reducing the cost of development and assembling of a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps. Several applications such as consumer electronics, automotive, and telecommunication incorporate SiP due to superior efficiency levels and durability.
Integrating circuits and bringing together multiple package assemblies are the key strengths of the SiP technology. The System in Packaging gives faster time to market, lower research and development cost, more integration adaptability and lower research and development cost, more integration adaptability and lower product cost than system on chip (SOC). The System in Packaging has grown into a fastest growing packaging technology segment, facilitating devices such as cellular phones, laptops, cameras and commercial products.
The global system in package (SiP) technology market would witness significant growth during the forecast period due to growing demand for portable electronic devices and growing popularity of Internet of Things (IoT). Printed circuit board (PCB) based ICs were mostly used in industrial systems for data transmission. However, other industries such as consumer electronics, energy & power, inverter & UPS, and automotive, have shifted to SiP to efficiently manage data transfer.
The report highlights the adoption of System in Package (SiP) Technology, globally. Based on the Type, the Global System in Package (SiP) Technology market is segmented into 2-D IC Packaging, 2.5-D IC Packaging and 3-D IC Packaging segments. Based on the Packaging Type, the market is bifurcated into Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages and Other Packaging segments. The global System in Package (SiP) Technology market is further segmented into Wire Bond, Flip Chip segments based on the Interconnection Technology. Further, the market is segmented into Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense and Other segments based on the various applications. The geographies included in the report are North America, Europe, Asia Pacific and LAMEA (Latin America, Middle East and Africa).
Key Players profiled in the report includes Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Chipmos Technologies Inc., Powertech Technology Inc., Ase Group, Renesas Electronics Corporation, Samsung Electronics Co. Ltd. and Toshiba Corporation.

【レポートの目次】

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global System in Package (SiP) Technology Market, by Type
1.4.2 Global System in Package (SiP) Technology Market, by Packaging Type
1.4.3 Global System in Package (SiP) Technology Market, by Interconnection Technology
1.4.4 Global System in Package (SiP) Technology Market, by Application
1.4.5 Global System in Package (SiP) Technology Market, by Geography
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.2 Key Influencing Factors
2.2.1 Drivers
2.2.2 Restraints
2.2.3 Opportunities
2.3 Global System in Package (SiP) Technology Market - By Geography
2.4 Global System in Package (SiP) Technology Market - By Type
2.5 Global System in Package (SiP) Technology Market - By Packaging Type
2.6 Global System in Package (SiP) Technology Market - By Interconnection Technology
2.7 Global System in Package (SiP) Technology Market - By Application
Chapter 3. Global System in Package (SiP) Technology Market - By Type
3.1 Global 2-D IC PACKAGING Market - By Geography
3.2 Global 2.5-D IC Packaging Market - By Geography
3.3 Global 3-D IC Packaging Market - By Geography
Chapter 4. Global System in Package (SiP) Technology Market - By Packaging Type
4.1 Global Flat Packages System in Package (SiP) Technology Market - By Geography
4.2 Global Pin Grid Arrays System in Package (SiP) Technology Market - By Geography
4.3 Global Surface Mount System in Package (SiP) Technology Market - By Geography
4.4 Global Small Outline Packages System in Package (SiP) Technology Market - By Geography
4.5 Global Other Packaging System in Package (SiP) Technology Market - By Geography
Chapter 5. Global System in Package (SiP) Technology Market - By Interconnection Technology
5.1 Global Wire Bond Packaging Market - By Geography
5.2 Global Flip Chip Packaging Market - By Geography
Chapter 6. Global System in Package (SiP) Technology Market - By Application
6.1 Global Consumer Electronics Market - By Geography
6.2 Global Automotive Market - By Geography
6.3 Global Telecommunication Market - By Geography
6.4 Global Industrial System Market - By Geography
6.5 Global Aerospace & Defense Market - By Geography
6.6 Global Other Application Market - By Geography
Chapter 7. Global System in Package (SiP) Technology Market - By Geography
7.1 North America System in Package (SiP) Technology Market
7.1.1 North America System in Package (SiP) Technology Market - By Country
7.1.2 North America System in Package (SiP) Technology Market - By Type
North America 2-D IC PACKAGING Market - By Country
North America 2.5-D IC Packaging Market - By Country
North America 3-D IC Packaging Market - By Country
7.1.3 North America System in Package (SiP) Technology Market - By Packaging Type
North America Flat Packages System in Package (SiP) Technology Market - By Country
North America Pin Grid Arrays System in Package (SiP) Technology Market - By Country
North America Surface Mount System in Package (SiP) Technology Market - By Country
North America Small Outline Packages System in Package (SiP) Technology Market - By Country
North America Other Packaging System in Package (SiP) Technology Market - By Country
7.1.4 North America System in Package (SiP) Technology Market - By Interconnection Technology
North America Wire Bond Packaging Market - By Country
North America Flip Chip Packaging Market - By Country
7.1.5 North America System in Package (SiP) Technology Market - By Application
North America Consumer Electronics Market - By Country
North America Automotive Market - By Country
North America Telecommunication Market - By Country
North America Industrial System Market - By Country
North America Aerospace & Defense Market - By Country
North America Other Application Market - By Country
7.1.6 Country Level Analysis
U.S System in Package (SiP) Technology Market
U.S System in Package (SiP) Technology Market - By Type
U.S System in Package (SiP) Technology Market - By Packaging Type
U.S System in Package (SiP) Technology Market - By Interconnection Technology
U.S System in Package (SiP) Technology Market - By Application
Canada System in Package (SiP) Technology Market
Canada System in Package (SiP) Technology Market - By Type
Canada System in Package (SiP) Technology Market - By Packaging Type
Canada System in Package (SiP) Technology Market - By Interconnection Technology
Canada System in Package (SiP) Technology Market - By Application
Mexico System in Package (SiP) Technology Market
Mexico System in Package (SiP) Technology Market - By Type
Mexico System in Package (SiP) Technology Market - By Packaging Type
Mexico System in Package (SiP) Technology Market - By Interconnection Technology
Mexico System in Package (SiP) Technology Market - By Application
Rest of North America System in Package (SiP) Technology Market
Rest of North America System in Package (SiP) Technology Market - By Type
Rest of North America System in Package (SiP) Technology Market - By Packaging Type
Rest of North America System in Package (SiP) Technology Market - By Interconnection Technology
Rest of North America System in Package (SiP) Technology Market - By Application
7.2 Europe System in Package (SiP) Technology Market
7.2.1 Europe System in Package (SiP) Technology Market - By Type
Europe 2-D IC PACKAGING Market - By Country
Europe 2.5-D IC Packaging Market - By Country
Europe 3-D IC Packaging Market - By Country
7.2.2 Europe System in Package (SiP) Technology Market - By Packaging Type
Europe Flat Packages System in Package (SiP) Technology Market - By Country
Europe Pin Grid Arrays System in Package (SiP) Technology Market - By Country
Europe Surface Mount System in Package (SiP) Technology Market - By Country
Europe Small Outline Packages System in Package (SiP) Technology Market - By Country
Europe Other Packaging System in Package (SiP) Technology Market - By Country
7.2.3 Europe System in Package (SiP) Technology Market - By Interconnection Technology
Europe Wire Bond Packaging Market - By Country
Europe Flip Chip Packaging Market - By Country
7.2.4 Europe System in Package (SiP) Technology Market - By Application
Europe Consumer Electronics Market - By Country
Europe Automotive Market - By Country
Europe Telecommunication Market - By Country
Europe Industrial System Market - By Country
Europe Aerospace & Defense Market - By Country
Europe Other Application Market - By Country
7.2.5 Country Level Analysis
Germany System in Package (SiP) Technology Market
Germany System in Package (SiP) Technology Market - By Type
Germany System in Package (SiP) Technology Market - By Packaging Type
Germany System in Package (SiP) Technology Market - By Interconnection Technology
Germany System in Package (SiP) Technology Market - By Application
UK System in Package (SiP) Technology Market
UK System in Package (SiP) Technology Market - By Type
UK System in Package (SiP) Technology Market - By Packaging Type
UK System in Package (SiP) Technology Market - By Interconnection Technology
UK System in Package (SiP) Technology Market - By Application
France System in Package (SiP) Technology Market
France System in Package (SiP) Technology Market - By Type
France System in Package (SiP) Technology Market - By Packaging Type
France System in Package (SiP) Technology Market - By Interconnection Technology
France System in Package (SiP) Technology Market - By Application
Russia System in Package (SiP) Technology Market
Russia System in Package (SiP) Technology Market - By Type
Russia System in Package (SiP) Technology Market - By Packaging Type
Russia System in Package (SiP) Technology Market - By Interconnection Technology
Russia System in Package (SiP) Technology Market - By Application
Spain System in Package (SiP) Technology Market
Spain System in Package (SiP) Technology Market - By Type
Spain System in Package (SiP) Technology Market - By Packaging Type
Spain System in Package (SiP) Technology Market - By Interconnection Technology
Spain System in Package (SiP) Technology Market - By Application
Italy System in Package (SiP) Technology Market
Italy System in Package (SiP) Technology Market - By Type
Italy System in Package (SiP) Technology Market - By Packaging Type
Italy System in Package (SiP) Technology Market - By Interconnection Technology
Italy System in Package (SiP) Technology Market - By Application
Rest of Europe System in Package (SiP) Technology Market
Rest of Europe System in Package (SiP) Technology Market - By Type
Rest of Europe System in Package (SiP) Technology Market - By Packaging Type
Rest of Europe System in Package (SiP) Technology Market - By Interconnection Technology
Rest of Europe System in Package (SiP) Technology Market - By Application
7.3 Asia Pacific System in Package (SiP) Technology Market
7.3.1 Asia Pacific System in Package (SiP) Technology Market - By Type
Asia Pacific 2-D IC PACKAGING Market - By Country
Asia Pacific 2.5-D IC Packaging Market - By Country
Asia Pacific 3-D IC Packaging Market - By Country
7.3.2 Asia Pacific System in Package (SiP) Technology Market - By Packaging Type
Asia Pacific Flat Packages System in Package (SiP) Technology Market - By Country
Asia Pacific Pin Grid Arrays System in Package (SiP) Technology Market - By Country
Asia Pacific Surface Mount System in Package (SiP) Technology Market - By Country
Asia Pacific Small Outline Packages System in Package (SiP) Technology Market - By Country
Asia Pacific Other Packaging System in Package (SiP) Technology Market - By Country
7.3.3 Asia Pacific System in Package (SiP) Technology Market - By Interconnection Technology
Asia Pacific Wire Bond Packaging Market - By Country
Asia Pacific Flip Chip Packaging Market - By Country
7.3.4 Asia Pacific System in Package (SiP) Technology Market - By Application
Asia Pacific Consumer Electronics Market - By Country
Asia Pacific Automotive Market - By Country
Asia Pacific Telecommunication Market - By Country
Asia Pacific Industrial System Market - By Country
Asia Pacific Aerospace & Defense Market - By Country
Asia Pacific Other Application Market - By Country
7.3.5 Country Level Analysis
China System in Package (SiP) Technology Market
China System in Package (SiP) Technology Market - By Type
China System in Package (SiP) Technology Market - By Packaging Type
China System in Package (SiP) Technology Market - By Interconnection Technology
China System in Package (SiP) Technology Market - By Application
Japan System in Package (SiP) Technology Market
Japan System in Package (SiP) Technology Market - By Type
Japan System in Package (SiP) Technology Market - By Packaging Type
Japan System in Package (SiP) Technology Market - By Interconnection Technology
Japan System in Package (SiP) Technology Market - By Application
India System in Package (SiP) Technology Market
India System in Package (SiP) Technology Market - By Type
India System in Package (SiP) Technology Market - By Packaging Type
India System in Package (SiP) Technology Market - By Interconnection Technology
India System in Package (SiP) Technology Market - By Application
South Korea System in Package (SiP) Technology Market
South Korea System in Package (SiP) Technology Market - By Type
South Korea System in Package (SiP) Technology Market - By Packaging Type
South Korea System in Package (SiP) Technology Market - By Interconnection Technology
South Korea System in Package (SiP) Technology Market - By Application
Singapore System in Package (SiP) Technology Market
Singapore System in Package (SiP) Technology Market - By Type
Singapore System in Package (SiP) Technology Market - By Packaging Type
Singapore System in Package (SiP) Technology Market - By Interconnection Technology
Singapore System in Package (SiP) Technology Market - By Application
Malaysia System in Package (SiP) Technology Market
Malaysia System in Package (SiP) Technology Market - By Type
Malaysia System in Package (SiP) Technology Market - By Packaging Type
Malaysia System in Package (SiP) Technology Market - By Interconnection Technology
Malaysia System in Package (SiP) Technology Market - By Application
Rest of Asia Pacific System in Package (SiP) Technology Market
Rest of Asia Pacific System in Package (SiP) Technology Market - By Type
Rest of Asia Pacific System in Package (SiP) Technology Market - By Packaging Type
Rest of Asia Pacific System in Package (SiP) Technology Market - By Interconnection Technology
Rest of Asia Pacific System in Package (SiP) Technology Market - By Application
7.4 LAMEA System in Package (SiP) Technology Market
7.4.1 LAMEA System in Package (SiP) Technology Market - By Country
7.4.2 LAMEA System in Package (SiP) Technology Market - By Type
LAMEA 2-D IC PACKAGING Market - By Geography
LAMEA 2.5-D IC Packaging Market - By Country
LAMEA 3-D IC Packaging Market - By Country
7.4.3 LAMEA System in Package (SiP) Technology Market - By Packaging Type
LAMEA Flat Packages System in Package (SiP) Technology Market - By Country
LAMEA Pin Grid Arrays System in Package (SiP) Technology Market - By Country
LAMEA Surface Mount System in Package (SiP) Technology Market - By Country
LAMEA Small Outline Packages System in Package (SiP) Technology Market - By Country
LAMEA Other Packaging System in Package (SiP) Technology Market - By Country
7.4.4 LAMEA System in Package (SiP) Technology Market - By Interconnection Technology
LAMEA Wire Bond Packaging Market - By Country
LAMEA Flip Chip Packaging Market - By Country
7.4.5 LAMEA System in Package (SiP) Technology Market - By Application
LAMEA Consumer Electronics Market - By Country
LAMEA Automotive Market - By Country
LAMEA Telecommunication Market - By Country
LAMEA Industrial System Market - By Country
LAMEA Aerospace & Defense Market - By Country
LAMEA Other Application Market - By Country
7.4.6 Country Level Analysis
Brazil System in Package (SiP) Technology Market
Brazil System in Package (SiP) Technology Market - By Type
Brazil System in Package (SiP) Technology Market - By Packaging Type
Brazil System in Package (SiP) Technology Market - By Interconnection Technology
Brazil System in Package (SiP) Technology Market - By Application
Argentina System in Package (SiP) Technology Market
Argentina System in Package (SiP) Technology Market - By Type
Argentina System in Package (SiP) Technology Market - By Packaging Type
Argentina System in Package (SiP) Technology Market - By Interconnection Technology
Argentina System in Package (SiP) Technology Market - By Application
UAE System in Package (SiP) Technology Market
UAE System in Package (SiP) Technology Market - By Type
UAE System in Package (SiP) Technology Market - By Packaging Type
UAE System in Package (SiP) Technology Market - By Interconnection Technology
UAE System in Package (SiP) Technology Market - By Application
Saudi Arabia System in Package (SiP) Technology Market
Saudi Arabia System in Package (SiP) Technology Market - By Type
Saudi Arabia System in Package (SiP) Technology Market - By Packaging Type
Saudi Arabia System in Package (SiP) Technology Market - By Interconnection Technology
Saudi Arabia System in Package (SiP) Technology Market - By Application
South Africa System in Package (SiP) Technology Market
South Africa System in Package (SiP) Technology Market - By Type
South Africa System in Package (SiP) Technology Market - By Packaging Type
South Africa System in Package (SiP) Technology Market - By Interconnection Technology
South Africa System in Package (SiP) Technology Market - By Application
Nigeria System in Package (SiP) Technology Market
Nigeria System in Package (SiP) Technology Market - By Type
Nigeria System in Package (SiP) Technology Market - By Packaging Type
Nigeria System in Package (SiP) Technology Market - By Interconnection Technology
Nigeria System in Package (SiP) Technology Market - By Application
Rest of LAMEA System in Package (SiP) Technology Market
Rest of LAMEA System in Package (SiP) Technology Market - By Type
Rest of LAMEA System in Package (SiP) Technology Market - By Packaging Type
Rest of LAMEA System in Package (SiP) Technology Market - By Interconnection Technology
Rest of LAMEA System in Package (SiP) Technology Market - By Application
Chapter 8. Company Profile
8.1 Amkor Technology Inc.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Research & Development Analysis
8.2 Jiangsu Changjiang Electronics Technology Co., Ltd.
8.2.1 Company Overview
8.3 Chipmos Technologies Inc.
8.3.1 Company Overview
8.4 Powertech Technology Inc.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.5 ASE Group
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental Analysis
8.5.4 Research & Development Analysis
8.6 Renesas Electronics Corporation
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Business Segment Analysis
8.6.4 Research and Development Cost
8.7 Samsung Electronics Co. Ltd.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 Toshiba Corporation
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental Analysis


【掲載企業】

• Amkor Technology Inc.
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• Chipmos Technologies Inc.
• Powertech Technology Inc.
• Ase Group
• Renesas Electronics Corporation
• Samsung Electronics Co. Ltd.
• Toshiba Corporation


【レポートのキーワード】

システムインパッケージ(SiP)技術

【免責事項】
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