スマートカードICの世界市場2020-2024:通信、財務、政府、交通機関、その他

Technavioが発行した調査報告書(IRTNTR44718)
◆英語タイトル:Global Smart Card IC Market 2020-2024
◆商品コード:IRTNTR44718
◆発行会社(リサーチ会社):Technavio
◆発行日:2020年8月25日
◆ページ数:約120
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本調査レポートでは、スマートカードICの世界市場を調査・分析することにより、エグゼクティブサマリー、市場状況、市場規模、ファイブフォース分析、用途別(通信、財務、政府、交通機関、その他)分析、マイクロプロセッサアーキテクチャ別分析、顧客状況、地域別状況、企業状況、企業分析などを含め、今後の方向性を明らかに致します。
・エグゼクティブサマリー
・市場状況
・市場規模
・ファイブフォース分析
・スマートカードICの世界市場規模:用途別(通信、財務、政府、交通機関、その他)
・スマートカードICの世界市場規模:マイクロプロセッサアーキテクチャ別
・顧客状況
・地域別状況
・企業状況
・企業分析

【レポートの概要】

Global Smart card IC Market 2020-2024
Technavio has been monitoring the smart card IC market and it is poised to grow by $ 1.82 bn during 2020-2024 progressing at a CAGR of 8% during the forecast period. Our reports on smart card IC market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current global market scenario, the latest trends and drivers, and the overall market environment. The market is driven by the growing demand for contactless smart cards and demand for electronic ID cards.

The smart card IC market analysis includes microprocessor architecture segment and geographic landscape.
Technavio’s smart card IC market is segmented as below:

By Microprocessor Architecture
• 16-bit
• 32-bit

By Geographic Landscapes
• APAC
• Europe
• North America
• South America
• MEA

This study identifies compliance with regulatory requirements as one of the prime reasons driving the smart card IC market growth during the next few years.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our smart card IC market covers the following areas:
• Smart card IC market sizing
• Smart card IC market forecast
• Smart card IC market industry analysis

Technavio’s robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading smart card IC market vendors that include Broadcom Inc., Imatric LLC, Infineon Technologies AG, Microchip Technology Inc., NXP Semiconductors NV, ON Semiconductor Corp., Samsung Electronics Co. Ltd., STMicroelectronics NV, Tongxin Microelectronics Co. Ltd., and Toshiba Corp. Also, the smart card IC market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors. For further information on this report, please visit – https://www.technavio.com/report/report/smart-card-ic-market-size-industry-analysis
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research – both primary and secondary. Technavio’s market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.

【レポートの目次】

• Executive Summary
o Market Overview
• Market Landscape
o Market ecosystem
o Value chain analysis
• Market Sizing
o Market definition
o Market segment analysis
o Market size 2019
o Market outlook: Forecast for 2019 – 2024
• Five Forces Analysis
o Five forces summary
o Bargaining power of buyers
o Bargaining power of suppliers
o Threat of new entrants
o Threat of substitutes
o Threat of rivalry
o Market condition
• Market Segmentation by Application
o Market segments
o Comparison by Application
o Telecommunication – Market size and forecast 2019-2024
o Financial – Market size and forecast 2019-2024
o Government – Market size and forecast 2019-2024
o Transportation – Market size and forecast 2019-2024
o Others – Market size and forecast 2019-2024
o Market opportunity by Application
• Market Segmentation by microprocessor architecture
o Market segments
o Comparison by microprocessor architecture
o 16-bit – Market size and forecast 2019-2024
o 32-bit – Market size and forecast 2019-2024
o Market opportunity by microprocessor architecture
• Customer landscape
o Overview
• Geographic Landscape
o Geographic segmentation
o Geographic comparison
o APAC – Market size and forecast 2019-2024
o Europe – Market size and forecast 2019-2024
o North America – Market size and forecast 2019-2024
o South America – Market size and forecast 2019-2024
o MEA – Market size and forecast 2019-2024
o Key leading countries
o Market opportunity by geography
o Market drivers
o Market challenges
o Market trends
• Vendor Landscape
o Overview
o Landscape disruption
• Vendor Analysis
o Vendors covered
o Market positioning of vendors
o Broadcom Inc.
o Imatric LLC
o Infineon Technologies AG
o Microchip Technology Inc.
o NXP Semiconductors NV
o ON Semiconductor Corp.
o Samsung Electronics Co. Ltd.
o STMicroelectronics NV
o Tongxin Microelectronics Co. Ltd.
o Toshiba Corp.
• Appendix
o Scope of the report
o Currency conversion rates for US$
o Research methodology
o List of abbreviations
Exhibit
• 1: Key Finding 1
• 2: Key Finding 2
• 3: Key Finding 3
• 4: Key Finding 5
• 5: Key Finding 6
• 6: Key Finding 7
• 7: Key Finding 8
• 8: Key Finding 9
• 9: Parent market
• 10: Market characteristics
• 11: Offerings of vendors included in the market definition
• 12: Market segments
• 13: Global – Market size and forecast 2019 – 2024 ($ million)
• 14: Global market: Year-over-year growth 2019 – 2024 (%)
• 15: Five forces analysis 2019 & 2024
• 16: Bargaining power of buyers
• 17: Bargaining power of suppliers
• 18: Threat of new entrants
• 19: Threat of substitutes
• 20: Threat of rivalry
• 21: Market condition – Five forces 2019
• 22: Application – Market share 2019-2024 (%)
• 23: Comparison by Application
• 24: Telecommunication – Market size and forecast 2019-2024 ($ million)
• 25: Telecommunication – Year-over-year growth 2019-2024 (%)
• 26: Financial – Market size and forecast 2019-2024 ($ million)
• 27: Financial – Year-over-year growth 2019-2024 (%)
• 28: Government – Market size and forecast 2019-2024 ($ million)
• 29: Government – Year-over-year growth 2019-2024 (%)
• 30: Transportation – Market size and forecast 2019-2024 ($ million)
• 31: Transportation – Year-over-year growth 2019-2024 (%)
• 32: Others – Market size and forecast 2019-2024 ($ million)
• 33: Others – Year-over-year growth 2019-2024 (%)
• 34: Market opportunity by Application
• 35: Other1 – Market share 2019-2024 (%)
• 36: Comparison by Other1
• 37: 16-bit – Market size and forecast 2019-2024 ($ million)
• 38: 16-bit – Year-over-year growth 2019-2024 (%)
• 39: 32-bit – Market size and forecast 2019-2024 ($ million)
• 40: 32-bit – Year-over-year growth 2019-2024 (%)
• 41: Market opportunity by Other1
• 42: Customer landscape
• 43: Market share by geography 2019-2024 (%)
• 44: Geographic comparison
• 45: APAC – Market size and forecast 2019-2024 ($ million)
• 46: APAC – Year-over-year growth 2019-2024 (%)
• 47: Europe – Market size and forecast 2019-2024 ($ million)
• 48: Europe – Year-over-year growth 2019-2024 (%)
• 49: North America – Market size and forecast 2019-2024 ($ million)
• 50: North America – Year-over-year growth 2019-2024 (%)
• 51: South America – Market size and forecast 2019-2024 ($ million)
• 52: South America – Year-over-year growth 2019-2024 (%)
• 53: MEA – Market size and forecast 2019-2024 ($ million)
• 54: MEA – Year-over-year growth 2019-2024 (%)
• 55: Key leading countries
• 56: Market opportunity by geography ($ million)
• 57: Impact of drivers and challenges
• 58: Vendor landscape
• 59: Landscape disruption
• 60: Industry risks
• 61: Vendors covered
• 62: Market positioning of vendors
• 63: Broadcom Inc. – Overview
• 64: Broadcom Inc. – Business segments
• 65: Broadcom Inc. – Key offerings
• 66: Broadcom Inc. – Key customers
• 67: Broadcom Inc. – Segment focus
• 68: Imatric LLC – Overview
• 69: Imatric LLC – Product and service
• 70: Imatric LLC – Key offerings
• 71: Imatric LLC – Key customers
• 72: Imatric LLC – Segment focus
• 73: Infineon Technologies AG – Overview
• 74: Infineon Technologies AG – Business segments
• 75: Infineon Technologies AG – Key offerings
• 76: Infineon Technologies AG – Key customers
• 77: Infineon Technologies AG – Segment focus
• 78: Microchip Technology Inc. – Overview
• 79: Microchip Technology Inc. – Business segments
• 80: Microchip Technology Inc. – Key offerings
• 81: Microchip Technology Inc. – Key customers
• 82: Microchip Technology Inc. – Segment focus
• 83: NXP Semiconductors NV – Overview
• 84: NXP Semiconductors NV – Business segments
• 85: NXP Semiconductors NV – Key offerings
• 86: NXP Semiconductors NV – Key customers
• 87: NXP Semiconductors NV – Segment focus
• 88: ON Semiconductor Corp. – Overview
• 89: ON Semiconductor Corp. – Business segments
• 90: ON Semiconductor Corp. – Key offerings
• 91: ON Semiconductor Corp. – Key customers
• 92: ON Semiconductor Corp. – Segment focus
• 93: Samsung Electronics Co. Ltd. – Overview
• 94: Samsung Electronics Co. Ltd. – Business segments
• 95: Samsung Electronics Co. Ltd. – Key offerings
• 96: Samsung Electronics Co. Ltd. – Key customers
• 97: Samsung Electronics Co. Ltd. – Segment focus
• 98: STMicroelectronics NV – Overview
• 99: STMicroelectronics NV – Business segments
• 100: STMicroelectronics NV – Key offerings
• 101: STMicroelectronics NV – Key customers
• 102: STMicroelectronics NV – Segment focus
• 103: Tongxin Microelectronics Co. Ltd. – Overview
• 104: Tongxin Microelectronics Co. Ltd. – Product and service
• 105: Tongxin Microelectronics Co. Ltd. – Key offerings
• 106: Tongxin Microelectronics Co. Ltd. – Key customers
• 107: Tongxin Microelectronics Co. Ltd. – Segment focus
• 108: Toshiba Corp. – Overview
• 109: Toshiba Corp. – Business segments
• 110: Toshiba Corp. – Key offerings
• 111: Toshiba Corp. – Key customers
• 112: Toshiba Corp. – Segment focus
• 113: Currency conversion rates for US$
• 114: Research Methodology
• 115: Validation techniques employed for market sizing
• 116: Information sources
• 117: List of abbreviations



【掲載企業】

Broadcom Inc., Imatric LLC  , Infineon Technologies AG, Microchip Technology Inc., NXP Semiconductors NV, ON Semiconductor Corp., Samsung Electronics Co. Ltd., STMicroelectronics NV, Tongxin Microelectronics Co. Ltd., Toshiba Corp.

【免責事項】
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