カテゴリー： Transparency Market Research, IT/電子, 世界

世界のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場2022年-2031年：構成部品別（マザーボード、コネクター、ハードディスク、メモリーカード、RAM、ディスプレイ、ケーブル、その他）

◆英語タイトル：E-scrap and Printed Circuit Board (PCB) E-scrap Market (Component: Motherboards, Connectors, Hard Drives, Memory Cards, RAM, Displays, Cables, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2022-2031

Transparency Market Researchが発行した調査報告書（TMR23JN064）◆商品コード：TMR23JN064
◆発行会社（リサーチ会社）：Transparency Market Research
◆発行日：2022年10月17日
◆ページ数：127
◆レポート形式：英語 / PDF
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❖ レポートの概要 ❖

Transparency Market Research社の市場調査レポートでは、世界のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場について調査・分析し、序論、エグゼクティブサマリー、市場動向、関連産業・主要指標分析、構成部品別（マザーボード、コネクター、ハードディスク、メモリーカード、その他）分析、材料別（プラスチック、ガラス、金属（銅、アルミニウム、錫）、鉄（鋼、鉄、ニッケル）、その他）分析、ソース別（家電、IT・通信機器、スマートフォン・タブレット、コンピューター・ノートパソコン、その他）分析、工程別（E-waste回収、E-waste管理、E-wasteリサイクル）分析、地域別（北米、ヨーロッパ、アジア太平洋、中東・アフリカ、南米）分析、競争評価、企業情報などの項目を掲載しています。また、企業情報として、Aurubis AG、Boliden Group、DOWA ECO-SYSTEM Co., Ltd.、ERI、E-scrap, Inc.、Quantum Lifecycle Partners、Sims Limited、Spas Recycling Pvt. Ltd.、Umicore、Zolopik E-Waste Recycling Trivendent Technologies Pvt. Ltdなどがあります。
・序論
・エグゼクティブサマリー
・市場動向
・関連産業・主要指標分析
・世界のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模：構成部品別
- マザーボードの市場規模
- コネクターの市場規模
- ハードディスクの市場規模
- メモリーカードの市場規模
- その他E-スクラップ・プリント回路基板（PCB）E-スクラップの市場規模
・世界のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模：材料別
- プラスチック製E-スクラップ・プリント回路基板（PCB）E-スクラップの市場規模
- ガラス製E-スクラップ・プリント回路基板（PCB）E-スクラップの市場規模
- 金属（銅、アルミニウム、錫）製E-スクラップ・プリント回路基板（PCB）E-スクラップの市場規模
- 鉄（鋼、鉄、ニッケル）製E-スクラップ・プリント回路基板（PCB）E-スクラップの市場規模
- その他E-スクラップ・プリント回路基板（PCB）E-スクラップの市場規模
・世界のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模：ソース別
- 家電における市場規模
- IT・通信機器における市場規模
- スマートフォン・タブレットにおける市場規模
- コンピューター・ノートパソコンにおける市場規模
- その他ソースにおける市場規模
・世界のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模：工程別
- E-waste回収における市場規模
- E-waste管理における市場規模
- E-wasteリサイクルにおける市場規模
・世界のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模：地域別
- 北米のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模
- ヨーロッパのE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模
- アジア太平洋のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模
- 中東・アフリカのE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模
- 南米のE-スクラップ・プリント回路基板（PCB）E-スクラップ市場規模
・競争評価
・企業情報

E-scrap and Printed Circuit Board (PCB) E-scrap Market – Scope of Report
TMR’s report on the global e-scrap and printed circuit board (PCB) e-scrap market studies the past as well as the current growth trends and opportunities to gain valuable insights of the indicators of the market during the forecast period from 2022 to 2031. The report provides revenue of the global e-scrap and printed circuit board (PCB) e-scrap market for the period 2017–2031, considering 2021 as the base year and 2031 as the forecast year. The report also provides the compound annual growth rate (CAGR %) of the global e-scrap and printed circuit board (PCB) e-scrap market from 2022 to 2031.

The report has been prepared after an extensive research. Primary research involved bulk of the research efforts, wherein analysts carried out interviews with key opinion leaders, industry leaders, and opinion makers. Secondary research involved referring to key players’ product literature, annual reports, press releases, and relevant documents to understand the e-scrap and printed circuit board (PCB) e-scrap market.

Secondary research also included Internet sources, statistical data from government agencies, websites, and trade associations. Analysts employed a combination of top-down and bottom-up approaches to study various attributes of the global e-scrap and printed circuit board (PCB) e-scrap market.

The report includes an elaborate executive summary, along with a snapshot of the growth behavior of various segments included in the scope of the study. Moreover, the report sheds light on the changing competitive dynamics in the global e-scrap and printed circuit board (PCB) e-scrap market. These serve as valuable tools for existing market players as well as for entities interested in participating in the global e-scrap and printed circuit board (PCB) e-scrap market.

The report delves into the competitive landscape of the global e-scrap and printed circuit board (PCB) e-scrap market. Key players operating in the global e-scrap and printed circuit board (PCB) e-scrap market have been identified and each one of these has been profiled, in terms of various attributes. Company overview, financial standings, recent developments, and SWOT are attributes of players in the global e-scrap and printed circuit board (PCB) e-scrap market profiled in this report.

RESEARCH METHODOLOGY

The research methodology will be a combination of exhaustive primary and secondary research to analyze the market e-scrap and printed circuit board (PCB) e-scrap.

Secondary Research

Secondary research includes a search of company literature, technical writing, patent data, Internet sources, and statistical data from government websites, trade associations, and agencies. This has proven to be the most reliable, effective, and successful approach for obtaining precise data, capturing industry participants’ insights, and recognizing business opportunities.

Secondary research sources that we typically refer, but are not limited to:

Company websites, presentations, annual reports, white papers, technical paper, product brochure
Internal and external proprietary databases and relevant patents
National government documents, statistical databases, and market reports
News articles, press releases, and webcasts specific to companies operating in the market

Specific Secondary Sources:

Industry Sources:
WorldWideScience.org
Elsevier, Inc.
National Institutes of Health (NIH)
PubMed
NCBI
Department of Health Care Service
Trade Data Sources
Trade Map
UN Comtrade
Trade Atlas
Company Information
OneSource Business Browser
Hoover’s
Factiva
Bloomberg
Mergers & Acquisitions
Thomson Mergers & Acquisitions
MergerStat
Profound

Primary Research

During the course of research, we conduct in-depth interviews and discussions with a wide range of key industry participants and opinion leaders. Primary research represents bulk of research efforts, supplemented by extensive secondary research.

We conduct primary interviews on the ongoing basis with industry participants and commentators to validate data and analysis. A typical research interview fulfills the following functions:

Provides first-hand information on market size, market trends, growth trends, competitive landscape, outlook, etc.
Helps in validating and strengthening secondary research findings
Further develops the analysis team’s expertise and market understanding
Primary research involves e-mail interactions, telephonic interviews, as well as face-to-face interviews for each market, category, segment, and sub-segment across geographies

Participants who typically take part in such a process include, but are not limited to:

Industry participants: Marketing/product managers, market intelligence managers, and regional sales managers
Purchasing/Sourcing managers, technical personnel, distributors
Outside experts: Investment bankers, valuation experts, and research analysts specializing in specific markets
Key opinion leaders specializing in different areas corresponding to different industry verticals

List of primary participants, but not limited to:

Advanced Oncotherapy PLC
Danfysik A/S
Hitachi, Ltd.
IBA Worldwide
Mevion Medical Systems, Inc.

Data Triangulation: Information culled from “Secondary & Primary Sources” is cross-checked with “TMR Knowledge Repository”, which is updated every quarter.

Market Estimation: Market size estimations involved in-depth study of product features, technology updates, geographic presence, product demand, sales data (value or volume), historical year-on-year growth, and others. Other approaches were also utilized to derive market size and forecasts. Where no hard data was available, we employed modeling techniques in order to produce comprehensive datasets. A rigorous methodology has been adopted, wherein the available hard data are cross-referenced with the following data types to produce estimates:

Demographic Data: Healthcare expenditure, inflation rates, and others
Industry Indicators: R&D investment, technology stage, and infrastructure, sector growth, and facilities

Market Forecasting: Market forecasts for various segments are derived taking into account drivers, restraints/challenges, and opportunities prevailing in the market and considering advantages/disadvantages of segments/sub-segments over other segments/sub-segments. Business environment, historical sales pattern, unmet needs, competitive intensity, and country-wise surgery data are some of the other pivotal factors, which are considered to derive market forecasts.

❖ レポートの目次 ❖

1. Preface
1.1. Market Introduction
1.2. Market and Segments Definition
1.3. Market Taxonomy
1.4. Research Methodology
1.5. Assumption and Acronyms
2. Executive Summary
2.1. Global E-scrap and Printed Circuit Board (PCB) E-scrap Market Overview
2.2. Regional Outline
2.3. Industry Outline
2.4. Market Dynamics Snapshot
2.5. Competition Blueprint
3. Market Dynamics
3.1. Macro-economic Factors
3.2. Drivers
3.3. Restraints
3.4. Opportunities
3.5. Key Trends
3.6. Regulatory Scenario
4. Associated Industry and Key Indicator Assessment
4.1. Parent Industry Overview – Global Waste Recycling Industry Overview
4.2. Supply Chain Analysis
4.3. Pricing Trend Analysis
4.4. Technology Roadmap Analysis
4.5. Industry SWOT Analysis
4.6. Porter Five Forces Analysis
4.7. COVID-19 Impact and Recovery Analysis
5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Component
5.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017–2031
5.1.1. Motherboards
5.1.2. Connectors
5.1.3. Hard Drives
5.1.4. Memory Cards
5.1.5. RAM
5.1.6. Displays
5.1.7. Cables
5.1.8. Others
5.2. Market Attractiveness Analysis, by Component
6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Material
6.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017–2031
6.1.1. Plastics
6.1.2. Glass
6.1.3. Metals (Copper, Aluminum, Tin)
6.1.4. Ferrous Components (Steel, Iron, Nickel)
6.1.5. Precious Metals (Gold, Silver, Palladium, etc.)
6.1.6. Rare Metals
6.2. Market Attractiveness Analysis, by Material
7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Source
7.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017–2031
7.1.1. Household Appliances
7.1.2. IT & Telecommunication Hardware
7.1.3. Smartphones & Tablets
7.1.4. Computers & Laptops
7.1.5. Industrial Electronics
7.1.6. Printers & Scanners
7.1.7. Entertainment Devices (TVs, Speakers, etc.)
7.1.8. Others
7.2. Market Attractiveness Analysis, by Source
8. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Process
8.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017–2031
8.1.1. E-waste Collection
8.1.2. E-waste Management
8.1.3. E-waste Recycling
8.2. Market Attractiveness Analysis, by Process
9. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast, by Region
9.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Region, 2017–2031
9.1.1. North America
9.1.2. Europe
9.1.3. Asia Pacific
9.1.4. Middle East & Africa
9.1.5. South America
9.2. Market Attractiveness Analysis, by Region
10. North America E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
10.1. Market Snapshot
10.2. Drivers and Restraints: Impact Analysis
10.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017–2031
10.3.1. Motherboards
10.3.2. Connectors
10.3.3. Hard Drives
10.3.4. Memory Cards
10.3.5. RAM
10.3.6. Displays
10.3.7. Cables
10.3.8. Others
10.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017–2031
10.4.1. Plastics
10.4.2. Glass
10.4.3. Metals (Copper, Aluminum, Tin)
10.4.4. Ferrous Components (Steel, Iron, Nickel)
10.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
10.4.6. Rare Metals
10.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017–2031
10.5.1. Household Appliances
10.5.2. IT & Telecommunication Hardware
10.5.3. Smartphones & Tablets
10.5.4. Computers & Laptops
10.5.5. Industrial Electronics
10.5.6. Printers & Scanners
10.5.7. Entertainment Devices (TVs, Speakers, etc.)
10.5.8. Others
10.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017–2031
10.6.1. E-waste Collection
10.6.2. E-waste Management
10.6.3. E-waste Recycling
10.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017–2031
10.7.1. The U.S.
10.7.2. Canada
10.7.3. Rest of North America
10.8. Market Attractiveness Analysis
10.8.1. By Component
10.8.2. By Material
10.8.3. By Source
10.8.4. By Process
10.8.5. By Country/Sub-region
11. Europe E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
11.1. Market Snapshot
11.2. Drivers and Restraints: Impact Analysis
11.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017–2031
11.3.1. Motherboards
11.3.2. Connectors
11.3.3. Hard Drives
11.3.4. Memory Cards
11.3.5. RAM
11.3.6. Displays
11.3.7. Cables
11.3.8. Others
11.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017–2031
11.4.1. Plastics
11.4.2. Glass
11.4.3. Metals (Copper, Aluminum, Tin)
11.4.4. Ferrous Components (Steel, Iron, Nickel)
11.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
11.4.6. Rare Metals
11.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017–2031
11.5.1. Household Appliances
11.5.2. IT & Telecommunication Hardware
11.5.3. Smartphones & Tablets
11.5.4. Computers & Laptops
11.5.5. Industrial Electronics
11.5.6. Printers & Scanners
11.5.7. Entertainment Devices (TVs, Speakers, etc.)
11.5.8. Others
11.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017–2031
11.6.1. E-waste Collection
11.6.2. E-waste Management
11.6.3. E-waste Recycling
11.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017–2031
11.7.1. The U.K.
11.7.2. Germany
11.7.3. France
11.7.4. Rest of Europe
11.8. Market Attractiveness Analysis
11.8.1. By Component
11.8.2. By Material
11.8.3. By Source
11.8.4. By Process
11.8.5. By Country/Sub-region
12. Asia Pacific E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
12.1. Market Snapshot
12.2. Drivers and Restraints: Impact Analysis
12.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017–2031
12.3.1. Motherboards
12.3.2. Connectors
12.3.3. Hard Drives
12.3.4. Memory Cards
12.3.5. RAM
12.3.6. Displays
12.3.7. Cables
12.3.8. Others
12.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017–2031
12.4.1. Plastics
12.4.2. Glass
12.4.3. Metals (Copper, Aluminum, Tin)
12.4.4. Ferrous Components (Steel, Iron, Nickel)
12.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
12.4.6. Rare Metals
12.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017–2031
12.5.1. Household Appliances
12.5.2. IT & Telecommunication Hardware
12.5.3. Smartphones & Tablets
12.5.4. Computers & Laptops
12.5.5. Industrial Electronics
12.5.6. Printers & Scanners
12.5.7. Entertainment Devices (TVs, Speakers, etc.)
12.5.8. Others
12.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017–2031
12.6.1. E-waste Collection
12.6.2. E-waste Management
12.6.3. E-waste Recycling
12.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017–2031
12.7.1. China
12.7.2. Japan
12.7.3. India
12.7.4. South Korea
12.7.5. ASEAN
12.7.6. Rest of Asia Pacific
12.8. Market Attractiveness Analysis
12.8.1. By Component
12.8.2. By Material
12.8.3. By Source
12.8.4. By Process
12.8.5. By Country/Sub-region
13. Middle East & Africa E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
13.1. Market Snapshot
13.2. Drivers and Restraints: Impact Analysis
13.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017–2031
13.3.1. Motherboards
13.3.2. Connectors
13.3.3. Hard Drives
13.3.4. Memory Cards
13.3.5. RAM
13.3.6. Displays
13.3.7. Cables
13.3.8. Others
13.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017–2031
13.4.1. Plastics
13.4.2. Glass
13.4.3. Metals (Copper, Aluminum, Tin)
13.4.4. Ferrous Components (Steel, Iron, Nickel)
13.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
13.4.6. Rare Metals
13.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017–2031
13.5.1. Household Appliances
13.5.2. IT & Telecommunication Hardware
13.5.3. Smartphones & Tablets
13.5.4. Computers & Laptops
13.5.5. Industrial Electronics
13.5.6. Printers & Scanners
13.5.7. Entertainment Devices (TVs, Speakers, etc.)
13.5.8. Others
13.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017–2031
13.6.1. E-waste Collection
13.6.2. E-waste Management
13.6.3. E-waste Recycling
13.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017–2031
13.7.1. GCC
13.7.2. South Africa
13.7.3. Rest of Middle East & Africa
13.8. Market Attractiveness Analysis
13.8.1. By Component
13.8.2. By Material
13.8.3. By Source
13.8.4. By Process
13.8.5. By Country/Sub-region
14. South America E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
14.1. Market Snapshot
14.2. Drivers and Restraints: Impact Analysis
14.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017–2031
14.3.1. Motherboards
14.3.2. Connectors
14.3.3. Hard Drives
14.3.4. Memory Cards
14.3.5. RAM
14.3.6. Displays
14.3.7. Cables
14.3.8. Others
14.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017–2031
14.4.1. Plastics
14.4.2. Glass
14.4.3. Metals (Copper, Aluminum, Tin)
14.4.4. Ferrous Components (Steel, Iron, Nickel)
14.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
14.4.6. Rare Metals
14.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017–2031
14.5.1. Household Appliances
14.5.2. IT & Telecommunication Hardware
14.5.3. Smartphones & Tablets
14.5.4. Computers & Laptops
14.5.5. Industrial Electronics
14.5.6. Printers & Scanners
14.5.7. Entertainment Devices (TVs, Speakers, etc.)
14.5.8. Others
14.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017–2031
14.6.1. E-waste Collection
14.6.2. E-waste Management
14.6.3. E-waste Recycling
14.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017–2031
14.7.1. Brazil
14.7.2. Rest of South America
14.8. Market Attractiveness Analysis
14.8.1. By Component
14.8.2. By Material
14.8.3. By Source
14.8.4. By Process
14.8.5. By Country/Sub-region
15. Competition Assessment
15.1. Global E-scrap and Printed Circuit Board (PCB) E-scrap Market Competition Matrix – a Dashboard View
15.1.1. Global E-scrap and Printed Circuit Board (PCB) E-scrap Market Company Share Analysis, by Value (2021)
15.1.2. Technological Differentiator
16. Company Profiles (Global Manufacturers/Suppliers)
16.1. Aurubis AG
16.1.1. Overview
16.1.2. Product Portfolio
16.1.3. Sales Footprint
16.1.4. Key Subsidiaries or Distributors
16.1.5. Strategy and Recent Developments
16.1.6. Key Financials
16.2. Boliden Group
16.2.1. Overview
16.2.2. Product Portfolio
16.2.3. Sales Footprint
16.2.4. Key Subsidiaries or Distributors
16.2.5. Strategy and Recent Developments
16.2.6. Key Financials
16.3. DOWA ECO-SYSTEM Co., Ltd.
16.3.1. Overview
16.3.2. Product Portfolio
16.3.3. Sales Footprint
16.3.4. Key Subsidiaries or Distributors
16.3.5. Strategy and Recent Developments
16.3.6. Key Financials
16.4. ERI
16.4.1. Overview
16.4.2. Product Portfolio
16.4.3. Sales Footprint
16.4.4. Key Subsidiaries or Distributors
16.4.5. Strategy and Recent Developments
16.4.6. Key Financials
16.5. E-scrap, Inc.
16.5.1. Overview
16.5.2. Product Portfolio
16.5.3. Sales Footprint
16.5.4. Key Subsidiaries or Distributors
16.5.5. Strategy and Recent Developments
16.5.6. Key Financials
16.6. Quantum Lifecycle Partners
16.6.1. Overview
16.6.2. Product Portfolio
16.6.3. Sales Footprint
16.6.4. Key Subsidiaries or Distributors
16.6.5. Strategy and Recent Developments
16.6.6. Key Financials
16.7. Sims Limited
16.7.1. Overview
16.7.2. Product Portfolio
16.7.3. Sales Footprint
16.7.4. Key Subsidiaries or Distributors
16.7.5. Strategy and Recent Developments
16.7.6. Key Financials
16.8. Spas Recycling Pvt. Ltd.
16.8.1. Overview
16.8.2. Product Portfolio
16.8.3. Sales Footprint
16.8.4. Key Subsidiaries or Distributors
16.8.5. Strategy and Recent Developments
16.8.6. Key Financials
16.9. Umicore
16.9.1. Overview
16.9.2. Product Portfolio
16.9.3. Sales Footprint
16.9.4. Key Subsidiaries or Distributors
16.9.5. Strategy and Recent Developments
16.9.6. Key Financials
16.10. Zolopik E-Waste Recycling Trivendent Technologies Pvt. Ltd.
16.10.1. Overview
16.10.2. Product Portfolio
16.10.3. Sales Footprint
16.10.4. Key Subsidiaries or Distributors
16.10.5. Strategy and Recent Developments
16.10.6. Key Financials
17. Recommendation
17.1. Opportunity Assessment
17.1.1. By Component
17.1.2. By Material
17.1.3. By Source
17.1.4. By Process
17.1.5. By Region



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