電子回路基板レベルアンダーフィル材料の世界市場

Future Market Insightsが発行した調査報告書(FUMI803072)
◆英語タイトル:Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis (2012 - 2016) and Opportunity Assessment (2017 - 2027)
◆商品コード:FUMI803072
◆発行会社(リサーチ会社):Future Market Insights
◆発行日:2017年12月7日
◆ページ数:242
◆レポート形式:英語 / PDF
◆納品方法:Eメール
◆調査対象地域:グローバル
◆産業分野:化学・材料
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※本調査レポートでは、電子回路基板レベルアンダーフィル材料の世界市場の世界市場について調査・分析し、以下の構成でお届けいたします。
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場概観
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場規模
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場予測
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場:地域別市場分析
・電子回路基板レベルアンダーフィル材料の世界市場のアメリカ市場規模
・電子回路基板レベルアンダーフィル材料の世界市場のヨーロッパ市場規模
・電子回路基板レベルアンダーフィル材料の世界市場のアジア市場規模
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場:セグメント別市場分析
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場:競争状況
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場:市場動向
・電子回路基板レベルアンダーフィル材料の世界市場の世界市場:関連企業分析
【レポートの概要】

Owing to increasing number and use of electronics products, the demand for board level underfill material is expected to increase in the coming years

The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy, silica, alumina, urethane and many others.

Future Market Insights has covered a detailed analysis on the electronic circuit board level underfill material market. This analysis includes segment wise intelligence, regional intelligence, competitive intelligence as well as weightage on trends, opportunities, drivers and restraints that have influence on the growth of the global market for electronic circuit board level underfill material. According to the acumen gleaned by Future Market Insights, the global electronic circuit board level underfill material is anticipated to grow at a high rate during the assessment period. During the 2012-2016 timeline, the global electronic circuit board level underfill material market reflected a comparatively slow growth rate, but it is projected to grow at a CAGR of 5.7% throughout the 2017-2027 timeline. In 2017, it is valued at around US$ 255 Mn and is estimated to reach a value of more than US$ 440 Mn by the end of the year of assessment. The main aspects contributing to the growth of the global electronic circuit board level underfill material market include increasing demand for smartphones, growth in consumer electronics sector, growing investments in electronics sector and increasing focus on electronics miniaturization.

Underfill segment to maintain status quo throughout the period of assessment

The underfill segment in the product type category is anticipated to grow at a significant pace in the coming years. This segment reflected a higher market share since past years and dominated the global market during the 2012-2016 timeline. It is likely to continue with this trend in the coming years and maintain its status quo. In 2017, this segment reflected a value of around US$ 147 Mn thus leading the global market. By the end of the year of assessment, this segment is poised to slate a value of more than US$ 260 Mn. The underfill segment is projected to grow at a high value CAGR throughout the forecast period as it is a preferred technology and has a high demand in the flip chips board type. This is the most lucrative segment from both revenue share ad growth perspectives.

electronic circuit board level underfill material market
Edge bonds to significantly contribute to the growth of the underfill segment

Underfill segment is further categorized into edge bonds and capillary fills sub segments. Of these, the edge bonds sub segment is expected to largely contribute to the market share of the parent segment. This sub segment is estimated to reach valuation of about US$ 165 Mn growing at a high value CAGR of 6.9% during the forecast period. Edge bonds technology is expected to be growing at this high CAGR owing to their low cost, fast processing and better rework ability. Edge/Corner bonding improves the mechanical reliability performance of the board. The capillary fills sub segment is projected to grow at a relatively slow value CAGR of 4.4% during the said period.

【レポートの目次】

Table Of Content
1. Executive Summary

1.1. Market Overview

1.2. Market Analysis

1.3. FMI Analysis and Recommendations

1.4. Wheel of Fortune

2. Market Introduction

2.1. Market Definition

2.2. Market Taxonomy

3. Market Viewpoint

3.1. Macro-Economic Factors

3.1.1. Electronics Industry

3.1.2. Global Semi-Conductor Sales

3.1.3. Global ICT Spending on Telecom Services

3.1.4. World GDP Growth Outlook

3.2. Opportunity Analysis

3.3. Parent Market Overview

4. Global Board Level Underfill Material Market Analysis and Forecast

4.1. Global Board Level Underfill Material Market: Market Size and Forecast Analysis

4.2. Supply Chain

5. Forecast Assumptions

6. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027, By Product Type

6.1. Introduction / Key Findings

6.2. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis by Product Type, 2012–2016

6.3. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Product Type, 2017–2027

6.3.1. Underfills

6.3.1.1. Capillary fills

6.3.1.2. Edgebonds

6.3.2. Glob Top Encapsulations

6.4. Key Trends / Developments

6.5. Market Attractiveness Analysis By Product Type

7. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027, By Board Type

7.1. Introduction / Key Findings

7.2. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Board Type , 2012–2016

7.3. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Board Type , 2017–2027

7.3.1. CSP (Chip Scale Package)

7.3.2. BGA (Ball Grid Array)

7.3.3. Flip Chip

7.4. Key Trends / Developments

7.5. Market Attractiveness Analysis By Board Type

8. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027, By Material

8.1. Introduction / Key Findings

8.2. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Material , 2012–2016

8.3. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Material, 2017–2027

8.3.1. Quartz/Silicon Based

8.3.2. Alumina Based

8.3.3. Epoxy Based

8.3.4. Urethane Based

8.3.5. Acrylic Based

8.3.6. Other

8.4. Key Trends / Developments

8.5. Market Attractiveness Analysis By Material

9. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027 By Region

9.1. Introduction / Key Findings

9.2. Historical Market Size (US$ Mn) and Volume Analysis By Region, 2012 – 2016

9.3. Current Market Size (US$ Mn) and Volume Forecast By Region, 2017 – 2027

9.3.1. North America

9.3.2. Western Europe

9.3.3. Asia Pacific Excl. Japan (APEJ)

9.3.4. Latin America

9.3.5. Eastern Europe

9.3.6. Middle East and Africa (MEA)

9.3.7. Japan

9.4. Market Attractiveness Analysis By Region

10. North America Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027

10.1. Introduction

10.2. Pricing Analysis

10.3. Regional Market Dynamics

10.3.1. Drivers

10.3.2. Restraints

10.3.3. Trends

10.4. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Taxonomy, 2012-2016

10.4.1. By Country

10.4.2. By Product Type

10.4.3. By Board Type

10.4.4. By Material

10.5. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Country, 2017–2027

10.5.1. U.S.

10.5.2. Canada

10.6. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Product Type, 2017–2027

10.6.1. Underfills

10.6.1.1. Capillary fills

10.6.1.2. Edgebonds

10.6.2. Glob Top Encapsulations

10.7. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Board Type , 2017–2027

10.7.1. CSP (Chip Scale Package)

10.7.2. BGA (Ball Grid Array)

10.7.3. Flip Chip

10.8. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Material, 2017–2027

10.8.1. Quartz/Silicon Based

10.8.2. Alumina Based

10.8.3. Epoxy Based

10.8.4. Urethane Based

10.8.5. Acrylic Based

10.8.6. Other

10.9. Drivers and Restraints: Impact Analysis

10.10. Market Attractiveness Analysis

10.10.1. By Country

10.10.2. By Product Type

10.10.3. By Board Type

10.10.4. By Material

10.11. Key Representative Market Participants

10.12. Market Presence (Intensity Map)

11. Western Europe Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027

11.1. Introduction

11.2. Pricing Analysis

11.3. Regional Market Dynamics

11.3.1. Drivers

11.3.2. Restraints

11.3.3. Trends

11.4. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Taxonomy, 2012-2016

11.4.1. By Country

11.4.2. By Product Type

11.4.3. By Board Type

11.4.4. By Material

11.5. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Country, 2017–2027

11.5.1. Germany

11.5.2. Italy

11.5.3. France

11.5.4. U.K.

11.5.5. Spain

11.5.6. BENELUX

11.5.7. Rest of Western Europe

11.6. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Product Type, 2017–2027

11.6.1. Underfills

11.6.1.1. Capillary fills

11.6.1.2. Edgebonds

11.6.2. Glob Top Encapsulations

11.7. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Board Type , 2017–2027

11.7.1. CSP (Chip Scale Package)

11.7.2. BGA (Ball Grid Array)

11.7.3. Flip Chip

11.8. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Material, 2017–2027

11.8.1. Quartz/Silicon Based

11.8.2. Alumina Based

11.8.3. Epoxy Based

11.8.4. Urethane Based

11.8.5. Acrylic Based

11.8.6. Other

11.9. Drivers and Restraints: Impact Analysis

11.10. Market Attractiveness Analysis

11.10.1. By Country

11.10.2. By Product Type

11.10.3. By Board Type

11.10.4. By Material

11.11. Key Representative Market Participants

11.12. Market Presence (Intensity Map)

12. Asia Pacific Excl. Japan (APEJ) Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027

12.1. Introduction

12.2. Pricing Analysis

12.3. Regional Market Dynamics

12.3.1. Drivers

12.3.2. Restraints

12.3.3. Trends

12.4. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Taxonomy, 2012-2016

12.4.1. By Country

12.4.2. By Product Type

12.4.3. By Board Type

12.4.4. By Material

12.5. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Country, 2017–2027

12.5.1. Mainland China

12.5.2. India

12.5.3. ASEAN

12.5.4. Australia and New Zealand

12.5.5. South Korea

12.5.6. Taiwan



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