BGAパッケージ基板の世界市場見通し2023年-2029年

◆英語タイトル：BGA Package Substrate Market, Global Outlook and Forecast 2023-2029

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❖ レポートの概要 ❖

Global BGA Package Substrate Market 調査レポートは次の情報を含め、グローバルにおけるのBGAパッケージ基板市場規模と予測を収録しています。・世界のBGAパッケージ基板市場：売上、2018年-2023年、2024年-2029年
・世界のBGAパッケージ基板市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界のBGAパッケージ基板市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。アメリカ市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「WBBGA」セグメントは今後6年間、000%の年平均成長率で2029年までに000Mドルに成長すると予測されています。

BGAパッケージ基板のグローバル主要企業は、IBIDEN、 SHINKO、 SimmTech、 Korea Circuit、 SAMSUNG ELECTRO-MECHANICS、 SEP Co ., Ltd、 Nan Ya PCB Corporation、 Siliconware Precision Industries、 LG Innotek、 TOPPAN INC、 Kyocera、 QP Technologies、 FICT Limited、 Shenzhen Hemeijingyi、 Zhen Ding Technology、 AT&S、 KINSUS、 Daeduck Electronics、 ASE Technology、 ACCESSなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

マーケットモニターグローバル社は、BGAパッケージ基板のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別マーケット分析】

世界のBGAパッケージ基板市場：タイプ別、2018年-2023年、2024年-2029年
世界のBGAパッケージ基板市場：タイプ別市場シェア、2022年
・WBBGA、FC-BGA

世界のBGAパッケージ基板市場：用途別、2018年-2023年、2024年-2029年
世界のBGAパッケージ基板市場：用途別市場シェア、2022年
・MPU/CPU/チップセット、GPU&CPU、ASIC/DSPチップ/FPGA、その他

世界のBGAパッケージ基板市場：地域・国別、2018年-2023年、2024年-2029年
世界のBGAパッケージ基板市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競争分析】

また、当レポートは主要な参入企業の分析を提供します。
・主要企業におけるBGAパッケージ基板のグローバル売上、2018年-2023年
・主要企業におけるBGAパッケージ基板のグローバル売上シェア、2022年
・主要企業におけるBGAパッケージ基板のグローバル販売量、2018年-2023年
・主要企業におけるBGAパッケージ基板のグローバル販売量シェア、2022年

さらに、当レポートは主要企業の情報を提示します。
IBIDEN、 SHINKO、 SimmTech、 Korea Circuit、 SAMSUNG ELECTRO-MECHANICS、 SEP Co ., Ltd、 Nan Ya PCB Corporation、 Siliconware Precision Industries、 LG Innotek、 TOPPAN INC、 Kyocera、 QP Technologies、 FICT Limited、 Shenzhen Hemeijingyi、 Zhen Ding Technology、 AT&S、 KINSUS、 Daeduck Electronics、 ASE Technology、 ACCESS

*************************************************************

・調査・分析レポートの概要
BGAパッケージ基板市場の定義
市場セグメント
世界のBGAパッケージ基板市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界のBGAパッケージ基板市場規模
世界のBGAパッケージ基板市場規模：2022年 VS 2029年
世界のBGAパッケージ基板市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでのBGAパッケージ基板の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業のBGAパッケージ基板製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：WBBGA、FC-BGA
BGAパッケージ基板のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：MPU/CPU/チップセット、GPU&CPU、ASIC/DSPチップ/FPGA、その他
BGAパッケージ基板の用途別グローバル売上・予測

・地域別市場分析
地域別BGAパッケージ基板市場規模 2022年と2029年
地域別BGAパッケージ基板売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業の情報（企業概要、事業概要、主要製品、売上、ニュースなど）
IBIDEN、 SHINKO、 SimmTech、 Korea Circuit、 SAMSUNG ELECTRO-MECHANICS、 SEP Co ., Ltd、 Nan Ya PCB Corporation、 Siliconware Precision Industries、 LG Innotek、 TOPPAN INC、 Kyocera、 QP Technologies、 FICT Limited、 Shenzhen Hemeijingyi、 Zhen Ding Technology、 AT&S、 KINSUS、 Daeduck Electronics、 ASE Technology、 ACCESS
...

This report aims to provide a comprehensive presentation of the global market for BGA Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Package Substrate. This report contains market size and forecasts of BGA Package Substrate in global, including the following market information:
Global BGA Package Substrate Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global BGA Package Substrate Market Sales, 2018-2023, 2024-2029, (K Sqm)
Global top five BGA Package Substrate companies in 2022 (%)
The global BGA Package Substrate market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
WB BGA Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of BGA Package Substrate include IBIDEN, SHINKO, SimmTech, Korea Circuit, SAMSUNG ELECTRO-MECHANICS, SEP Co ., Ltd, Nan Ya PCB Corporation, Siliconware Precision Industries and LG Innotek, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the BGA Package Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global BGA Package Substrate Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global BGA Package Substrate Market Segment Percentages, by Type, 2022 (%)
WB BGA
FC-BGA
Global BGA Package Substrate Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global BGA Package Substrate Market Segment Percentages, by Application, 2022 (%)
MPU/CPU/Chipset
GPU and CPU
ASIC/DSP Chip/FPGA
Others
Global BGA Package Substrate Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global BGA Package Substrate Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies BGA Package Substrate revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies BGA Package Substrate revenues share in global market, 2022 (%)
Key companies BGA Package Substrate sales in global market, 2018-2023 (Estimated), (K Sqm)
Key companies BGA Package Substrate sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
IBIDEN
SHINKO
SimmTech
Korea Circuit
SAMSUNG ELECTRO-MECHANICS
SEP Co ., Ltd
Nan Ya PCB Corporation
Siliconware Precision Industries
LG Innotek
TOPPAN INC
Kyocera
QP Technologies
FICT Limited
Shenzhen Hemeijingyi
Zhen Ding Technology
AT&S
KINSUS
Daeduck Electronics
ASE Technology
ACCESS
Outline of Major Chapters:
Chapter 1: Introduces the definition of BGA Package Substrate, market overview.
Chapter 2: Global BGA Package Substrate market size in revenue and volume.
Chapter 3: Detailed analysis of BGA Package Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of BGA Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global BGA Package Substrate capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 BGA Package Substrate Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global BGA Package Substrate Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global BGA Package Substrate Overall Market Size
2.1 Global BGA Package Substrate Market Size: 2022 VS 2029
2.2 Global BGA Package Substrate Revenue, Prospects & Forecasts: 2018-2029
2.3 Global BGA Package Substrate Sales: 2018-2029
3 Company Landscape
3.1 Top BGA Package Substrate Players in Global Market
3.2 Top Global BGA Package Substrate Companies Ranked by Revenue
3.3 Global BGA Package Substrate Revenue by Companies
3.4 Global BGA Package Substrate Sales by Companies
3.5 Global BGA Package Substrate Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 BGA Package Substrate Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers BGA Package Substrate Product Type
3.8 Tier 1, Tier 2 and Tier 3 BGA Package Substrate Players in Global Market
3.8.1 List of Global Tier 1 BGA Package Substrate Companies
3.8.2 List of Global Tier 2 and Tier 3 BGA Package Substrate Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global BGA Package Substrate Market Size Markets, 2022 & 2029
4.1.2 WB BGA
4.1.3 FC-BGA
4.2 By Type – Global BGA Package Substrate Revenue & Forecasts
4.2.1 By Type – Global BGA Package Substrate Revenue, 2018-2023
4.2.2 By Type – Global BGA Package Substrate Revenue, 2024-2029
4.2.3 By Type – Global BGA Package Substrate Revenue Market Share, 2018-2029
4.3 By Type – Global BGA Package Substrate Sales & Forecasts
4.3.1 By Type – Global BGA Package Substrate Sales, 2018-2023
4.3.2 By Type – Global BGA Package Substrate Sales, 2024-2029
4.3.3 By Type – Global BGA Package Substrate Sales Market Share, 2018-2029
4.4 By Type – Global BGA Package Substrate Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global BGA Package Substrate Market Size, 2022 & 2029
5.1.2 MPU/CPU/Chipset
5.1.3 GPU and CPU
5.1.4 ASIC/DSP Chip/FPGA
5.1.5 Others
5.2 By Application – Global BGA Package Substrate Revenue & Forecasts
5.2.1 By Application – Global BGA Package Substrate Revenue, 2018-2023
5.2.2 By Application – Global BGA Package Substrate Revenue, 2024-2029
5.2.3 By Application – Global BGA Package Substrate Revenue Market Share, 2018-2029
5.3 By Application – Global BGA Package Substrate Sales & Forecasts
5.3.1 By Application – Global BGA Package Substrate Sales, 2018-2023
5.3.2 By Application – Global BGA Package Substrate Sales, 2024-2029
5.3.3 By Application – Global BGA Package Substrate Sales Market Share, 2018-2029
5.4 By Application – Global BGA Package Substrate Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global BGA Package Substrate Market Size, 2022 & 2029
6.2 By Region – Global BGA Package Substrate Revenue & Forecasts
6.2.1 By Region – Global BGA Package Substrate Revenue, 2018-2023
6.2.2 By Region – Global BGA Package Substrate Revenue, 2024-2029
6.2.3 By Region – Global BGA Package Substrate Revenue Market Share, 2018-2029
6.3 By Region – Global BGA Package Substrate Sales & Forecasts
6.3.1 By Region – Global BGA Package Substrate Sales, 2018-2023
6.3.2 By Region – Global BGA Package Substrate Sales, 2024-2029
6.3.3 By Region – Global BGA Package Substrate Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America BGA Package Substrate Revenue, 2018-2029
6.4.2 By Country – North America BGA Package Substrate Sales, 2018-2029
6.4.3 US BGA Package Substrate Market Size, 2018-2029
6.4.4 Canada BGA Package Substrate Market Size, 2018-2029
6.4.5 Mexico BGA Package Substrate Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe BGA Package Substrate Revenue, 2018-2029
6.5.2 By Country – Europe BGA Package Substrate Sales, 2018-2029
6.5.3 Germany BGA Package Substrate Market Size, 2018-2029
6.5.4 France BGA Package Substrate Market Size, 2018-2029
6.5.5 U.K. BGA Package Substrate Market Size, 2018-2029
6.5.6 Italy BGA Package Substrate Market Size, 2018-2029
6.5.7 Russia BGA Package Substrate Market Size, 2018-2029
6.5.8 Nordic Countries BGA Package Substrate Market Size, 2018-2029
6.5.9 Benelux BGA Package Substrate Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia BGA Package Substrate Revenue, 2018-2029
6.6.2 By Region – Asia BGA Package Substrate Sales, 2018-2029
6.6.3 China BGA Package Substrate Market Size, 2018-2029
6.6.4 Japan BGA Package Substrate Market Size, 2018-2029
6.6.5 South Korea BGA Package Substrate Market Size, 2018-2029
6.6.6 Southeast Asia BGA Package Substrate Market Size, 2018-2029
6.6.7 India BGA Package Substrate Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America BGA Package Substrate Revenue, 2018-2029
6.7.2 By Country – South America BGA Package Substrate Sales, 2018-2029
6.7.3 Brazil BGA Package Substrate Market Size, 2018-2029
6.7.4 Argentina BGA Package Substrate Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa BGA Package Substrate Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa BGA Package Substrate Sales, 2018-2029
6.8.3 Turkey BGA Package Substrate Market Size, 2018-2029
6.8.4 Israel BGA Package Substrate Market Size, 2018-2029
6.8.5 Saudi Arabia BGA Package Substrate Market Size, 2018-2029
6.8.6 UAE BGA Package Substrate Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 IBIDEN
7.1.1 IBIDEN Company Summary
7.1.2 IBIDEN Business Overview
7.1.3 IBIDEN BGA Package Substrate Major Product Offerings
7.1.4 IBIDEN BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.1.5 IBIDEN Key News & Latest Developments
7.2 SHINKO
7.2.1 SHINKO Company Summary
7.2.2 SHINKO Business Overview
7.2.3 SHINKO BGA Package Substrate Major Product Offerings
7.2.4 SHINKO BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.2.5 SHINKO Key News & Latest Developments
7.3 SimmTech
7.3.1 SimmTech Company Summary
7.3.2 SimmTech Business Overview
7.3.3 SimmTech BGA Package Substrate Major Product Offerings
7.3.4 SimmTech BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.3.5 SimmTech Key News & Latest Developments
7.4 Korea Circuit
7.4.1 Korea Circuit Company Summary
7.4.2 Korea Circuit Business Overview
7.4.3 Korea Circuit BGA Package Substrate Major Product Offerings
7.4.4 Korea Circuit BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.4.5 Korea Circuit Key News & Latest Developments
7.5 SAMSUNG ELECTRO-MECHANICS
7.5.1 SAMSUNG ELECTRO-MECHANICS Company Summary
7.5.2 SAMSUNG ELECTRO-MECHANICS Business Overview
7.5.3 SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Major Product Offerings
7.5.4 SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.5.5 SAMSUNG ELECTRO-MECHANICS Key News & Latest Developments
7.6 SEP Co ., Ltd
7.6.1 SEP Co ., Ltd Company Summary
7.6.2 SEP Co ., Ltd Business Overview
7.6.3 SEP Co ., Ltd BGA Package Substrate Major Product Offerings
7.6.4 SEP Co ., Ltd BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.6.5 SEP Co ., Ltd Key News & Latest Developments
7.7 Nan Ya PCB Corporation
7.7.1 Nan Ya PCB Corporation Company Summary
7.7.2 Nan Ya PCB Corporation Business Overview
7.7.3 Nan Ya PCB Corporation BGA Package Substrate Major Product Offerings
7.7.4 Nan Ya PCB Corporation BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.7.5 Nan Ya PCB Corporation Key News & Latest Developments
7.8 Siliconware Precision Industries
7.8.1 Siliconware Precision Industries Company Summary
7.8.2 Siliconware Precision Industries Business Overview
7.8.3 Siliconware Precision Industries BGA Package Substrate Major Product Offerings
7.8.4 Siliconware Precision Industries BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.8.5 Siliconware Precision Industries Key News & Latest Developments
7.9 LG Innotek
7.9.1 LG Innotek Company Summary
7.9.2 LG Innotek Business Overview
7.9.3 LG Innotek BGA Package Substrate Major Product Offerings
7.9.4 LG Innotek BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.9.5 LG Innotek Key News & Latest Developments
7.10 TOPPAN INC
7.10.1 TOPPAN INC Company Summary
7.10.2 TOPPAN INC Business Overview
7.10.3 TOPPAN INC BGA Package Substrate Major Product Offerings
7.10.4 TOPPAN INC BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.10.5 TOPPAN INC Key News & Latest Developments
7.11 Kyocera
7.11.1 Kyocera Company Summary
7.11.2 Kyocera BGA Package Substrate Business Overview
7.11.3 Kyocera BGA Package Substrate Major Product Offerings
7.11.4 Kyocera BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.11.5 Kyocera Key News & Latest Developments
7.12 QP Technologies
7.12.1 QP Technologies Company Summary
7.12.2 QP Technologies BGA Package Substrate Business Overview
7.12.3 QP Technologies BGA Package Substrate Major Product Offerings
7.12.4 QP Technologies BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.12.5 QP Technologies Key News & Latest Developments
7.13 FICT Limited
7.13.1 FICT Limited Company Summary
7.13.2 FICT Limited BGA Package Substrate Business Overview
7.13.3 FICT Limited BGA Package Substrate Major Product Offerings
7.13.4 FICT Limited BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.13.5 FICT Limited Key News & Latest Developments
7.14 Shenzhen Hemeijingyi
7.14.1 Shenzhen Hemeijingyi Company Summary
7.14.2 Shenzhen Hemeijingyi Business Overview
7.14.3 Shenzhen Hemeijingyi BGA Package Substrate Major Product Offerings
7.14.4 Shenzhen Hemeijingyi BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.14.5 Shenzhen Hemeijingyi Key News & Latest Developments
7.15 Zhen Ding Technology
7.15.1 Zhen Ding Technology Company Summary
7.15.2 Zhen Ding Technology Business Overview
7.15.3 Zhen Ding Technology BGA Package Substrate Major Product Offerings
7.15.4 Zhen Ding Technology BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.15.5 Zhen Ding Technology Key News & Latest Developments
7.16 AT&S
7.16.1 AT&S Company Summary
7.16.2 AT&S Business Overview
7.16.3 AT&S BGA Package Substrate Major Product Offerings
7.16.4 AT&S BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.16.5 AT&S Key News & Latest Developments
7.17 KINSUS
7.17.1 KINSUS Company Summary
7.17.2 KINSUS Business Overview
7.17.3 KINSUS BGA Package Substrate Major Product Offerings
7.17.4 KINSUS BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.17.5 KINSUS Key News & Latest Developments
7.18 Daeduck Electronics
7.18.1 Daeduck Electronics Company Summary
7.18.2 Daeduck Electronics Business Overview
7.18.3 Daeduck Electronics BGA Package Substrate Major Product Offerings
7.18.4 Daeduck Electronics BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.18.5 Daeduck Electronics Key News & Latest Developments
7.19 ASE Technology
7.19.1 ASE Technology Company Summary
7.19.2 ASE Technology Business Overview
7.19.3 ASE Technology BGA Package Substrate Major Product Offerings
7.19.4 ASE Technology BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.19.5 ASE Technology Key News & Latest Developments
7.20 ACCESS
7.20.1 ACCESS Company Summary
7.20.2 ACCESS Business Overview
7.20.3 ACCESS BGA Package Substrate Major Product Offerings
7.20.4 ACCESS BGA Package Substrate Sales and Revenue in Global (2018-2023)
7.20.5 ACCESS Key News & Latest Developments
8 Global BGA Package Substrate Production Capacity, Analysis
8.1 Global BGA Package Substrate Production Capacity, 2018-2029
8.2 BGA Package Substrate Production Capacity of Key Manufacturers in Global Market
8.3 Global BGA Package Substrate Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 BGA Package Substrate Supply Chain Analysis
10.1 BGA Package Substrate Industry Value Chain
10.2 BGA Package Substrate Upstream Market
10.3 BGA Package Substrate Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 BGA Package Substrate Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

List of Tables
Table 1. Key Players of BGA Package Substrate in Global Market
Table 2. Top BGA Package Substrate Players in Global Market, Ranking by Revenue (2022)
Table 3. Global BGA Package Substrate Revenue by Companies, (US$, Mn), 2018-2023
Table 4. Global BGA Package Substrate Revenue Share by Companies, 2018-2023
Table 5. Global BGA Package Substrate Sales by Companies, (K Sqm), 2018-2023
Table 6. Global BGA Package Substrate Sales Share by Companies, 2018-2023
Table 7. Key Manufacturers BGA Package Substrate Price (2018-2023) & (US$/Sqm)
Table 8. Global Manufacturers BGA Package Substrate Product Type
Table 9. List of Global Tier 1 BGA Package Substrate Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 BGA Package Substrate Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type – Global BGA Package Substrate Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Global BGA Package Substrate Revenue (US$, Mn), 2018-2023
Table 13. By Type - Global BGA Package Substrate Revenue (US$, Mn), 2024-2029
Table 14. By Type - Global BGA Package Substrate Sales (K Sqm), 2018-2023
Table 15. By Type - Global BGA Package Substrate Sales (K Sqm), 2024-2029
Table 16. By Application – Global BGA Package Substrate Revenue, (US$, Mn), 2022 & 2029
Table 17. By Application - Global BGA Package Substrate Revenue (US$, Mn), 2018-2023
Table 18. By Application - Global BGA Package Substrate Revenue (US$, Mn), 2024-2029
Table 19. By Application - Global BGA Package Substrate Sales (K Sqm), 2018-2023
Table 20. By Application - Global BGA Package Substrate Sales (K Sqm), 2024-2029
Table 21. By Region – Global BGA Package Substrate Revenue, (US$, Mn), 2022 VS 2029
Table 22. By Region - Global BGA Package Substrate Revenue (US$, Mn), 2018-2023
Table 23. By Region - Global BGA Package Substrate Revenue (US$, Mn), 2024-2029
Table 24. By Region - Global BGA Package Substrate Sales (K Sqm), 2018-2023
Table 25. By Region - Global BGA Package Substrate Sales (K Sqm), 2024-2029
Table 26. By Country - North America BGA Package Substrate Revenue, (US$, Mn), 2018-2023
Table 27. By Country - North America BGA Package Substrate Revenue, (US$, Mn), 2024-2029
Table 28. By Country - North America BGA Package Substrate Sales, (K Sqm), 2018-2023
Table 29. By Country - North America BGA Package Substrate Sales, (K Sqm), 2024-2029
Table 30. By Country - Europe BGA Package Substrate Revenue, (US$, Mn), 2018-2023
Table 31. By Country - Europe BGA Package Substrate Revenue, (US$, Mn), 2024-2029
Table 32. By Country - Europe BGA Package Substrate Sales, (K Sqm), 2018-2023
Table 33. By Country - Europe BGA Package Substrate Sales, (K Sqm), 2024-2029
Table 34. By Region - Asia BGA Package Substrate Revenue, (US$, Mn), 2018-2023
Table 35. By Region - Asia BGA Package Substrate Revenue, (US$, Mn), 2024-2029
Table 36. By Region - Asia BGA Package Substrate Sales, (K Sqm), 2018-2023
Table 37. By Region - Asia BGA Package Substrate Sales, (K Sqm), 2024-2029
Table 38. By Country - South America BGA Package Substrate Revenue, (US$, Mn), 2018-2023
Table 39. By Country - South America BGA Package Substrate Revenue, (US$, Mn), 2024-2029
Table 40. By Country - South America BGA Package Substrate Sales, (K Sqm), 2018-2023
Table 41. By Country - South America BGA Package Substrate Sales, (K Sqm), 2024-2029
Table 42. By Country - Middle East & Africa BGA Package Substrate Revenue, (US$, Mn), 2018-2023
Table 43. By Country - Middle East & Africa BGA Package Substrate Revenue, (US$, Mn), 2024-2029
Table 44. By Country - Middle East & Africa BGA Package Substrate Sales, (K Sqm), 2018-2023
Table 45. By Country - Middle East & Africa BGA Package Substrate Sales, (K Sqm), 2024-2029
Table 46. IBIDEN Company Summary
Table 47. IBIDEN BGA Package Substrate Product Offerings
Table 48. IBIDEN BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 49. IBIDEN Key News & Latest Developments
Table 50. SHINKO Company Summary
Table 51. SHINKO BGA Package Substrate Product Offerings
Table 52. SHINKO BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 53. SHINKO Key News & Latest Developments
Table 54. SimmTech Company Summary
Table 55. SimmTech BGA Package Substrate Product Offerings
Table 56. SimmTech BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 57. SimmTech Key News & Latest Developments
Table 58. Korea Circuit Company Summary
Table 59. Korea Circuit BGA Package Substrate Product Offerings
Table 60. Korea Circuit BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 61. Korea Circuit Key News & Latest Developments
Table 62. SAMSUNG ELECTRO-MECHANICS Company Summary
Table 63. SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Product Offerings
Table 64. SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 65. SAMSUNG ELECTRO-MECHANICS Key News & Latest Developments
Table 66. SEP Co ., Ltd Company Summary
Table 67. SEP Co ., Ltd BGA Package Substrate Product Offerings
Table 68. SEP Co ., Ltd BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 69. SEP Co ., Ltd Key News & Latest Developments
Table 70. Nan Ya PCB Corporation Company Summary
Table 71. Nan Ya PCB Corporation BGA Package Substrate Product Offerings
Table 72. Nan Ya PCB Corporation BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 73. Nan Ya PCB Corporation Key News & Latest Developments
Table 74. Siliconware Precision Industries Company Summary
Table 75. Siliconware Precision Industries BGA Package Substrate Product Offerings
Table 76. Siliconware Precision Industries BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 77. Siliconware Precision Industries Key News & Latest Developments
Table 78. LG Innotek Company Summary
Table 79. LG Innotek BGA Package Substrate Product Offerings
Table 80. LG Innotek BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 81. LG Innotek Key News & Latest Developments
Table 82. TOPPAN INC Company Summary
Table 83. TOPPAN INC BGA Package Substrate Product Offerings
Table 84. TOPPAN INC BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 85. TOPPAN INC Key News & Latest Developments
Table 86. Kyocera Company Summary
Table 87. Kyocera BGA Package Substrate Product Offerings
Table 88. Kyocera BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 89. Kyocera Key News & Latest Developments
Table 90. QP Technologies Company Summary
Table 91. QP Technologies BGA Package Substrate Product Offerings
Table 92. QP Technologies BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 93. QP Technologies Key News & Latest Developments
Table 94. FICT Limited Company Summary
Table 95. FICT Limited BGA Package Substrate Product Offerings
Table 96. FICT Limited BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 97. FICT Limited Key News & Latest Developments
Table 98. Shenzhen Hemeijingyi Company Summary
Table 99. Shenzhen Hemeijingyi BGA Package Substrate Product Offerings
Table 100. Shenzhen Hemeijingyi BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 101. Shenzhen Hemeijingyi Key News & Latest Developments
Table 102. Zhen Ding Technology Company Summary
Table 103. Zhen Ding Technology BGA Package Substrate Product Offerings
Table 104. Zhen Ding Technology BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 105. Zhen Ding Technology Key News & Latest Developments
Table 106. AT&S Company Summary
Table 107. AT&S BGA Package Substrate Product Offerings
Table 108. AT&S BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 109. AT&S Key News & Latest Developments
Table 110. KINSUS Company Summary
Table 111. KINSUS BGA Package Substrate Product Offerings
Table 112. KINSUS BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 113. KINSUS Key News & Latest Developments
Table 114. Daeduck Electronics Company Summary
Table 115. Daeduck Electronics BGA Package Substrate Product Offerings
Table 116. Daeduck Electronics BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 117. Daeduck Electronics Key News & Latest Developments
Table 118. ASE Technology Company Summary
Table 119. ASE Technology BGA Package Substrate Product Offerings
Table 120. ASE Technology BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 121. ASE Technology Key News & Latest Developments
Table 122. ACCESS Company Summary
Table 123. ACCESS BGA Package Substrate Product Offerings
Table 124. ACCESS BGA Package Substrate Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 125. ACCESS Key News & Latest Developments
Table 126. BGA Package Substrate Production Capacity (K Sqm) of Key Manufacturers in Global Market, 2021-2023 (K Sqm)
Table 127. Global BGA Package Substrate Capacity Market Share of Key Manufacturers, 2021-2023
Table 128. Global BGA Package Substrate Production by Region, 2018-2023 (K Sqm)
Table 129. Global BGA Package Substrate Production by Region, 2024-2029 (K Sqm)
Table 130. BGA Package Substrate Market Opportunities & Trends in Global Market
Table 131. BGA Package Substrate Market Drivers in Global Market
Table 132. BGA Package Substrate Market Restraints in Global Market
Table 133. BGA Package Substrate Raw Materials
Table 134. BGA Package Substrate Raw Materials Suppliers in Global Market
Table 135. Typical BGA Package Substrate Downstream
Table 136. BGA Package Substrate Downstream Clients in Global Market
Table 137. BGA Package Substrate Distributors and Sales Agents in Global Market
List of Figures
Figure 1. BGA Package Substrate Segment by Type in 2022
Figure 2. BGA Package Substrate Segment by Application in 2022
Figure 3. Global BGA Package Substrate Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global BGA Package Substrate Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global BGA Package Substrate Revenue, 2018-2029 (US$, Mn)
Figure 7. BGA Package Substrate Sales in Global Market: 2018-2029 (K Sqm)
Figure 8. The Top 3 and 5 Players Market Share by BGA Package Substrate Revenue in 2022
Figure 9. By Type - Global BGA Package Substrate Revenue, (US$, Mn), 2022 & 2029
Figure 10. By Type - Global BGA Package Substrate Revenue Market Share, 2018-2029
Figure 11. By Type - Global BGA Package Substrate Sales Market Share, 2018-2029
Figure 12. By Type - Global BGA Package Substrate Price (US$/Sqm), 2018-2029
Figure 13. By Application - Global BGA Package Substrate Revenue, (US$, Mn), 2022 & 2029
Figure 14. By Application - Global BGA Package Substrate Revenue Market Share, 2018-2029
Figure 15. By Application - Global BGA Package Substrate Sales Market Share, 2018-2029
Figure 16. By Application - Global BGA Package Substrate Price (US$/Sqm), 2018-2029
Figure 17. By Region - Global BGA Package Substrate Revenue, (US$, Mn), 2022 & 2029
Figure 18. By Region - Global BGA Package Substrate Revenue Market Share, 2018 VS 2022 VS 2029
Figure 19. By Region - Global BGA Package Substrate Revenue Market Share, 2018-2029
Figure 20. By Region - Global BGA Package Substrate Sales Market Share, 2018-2029
Figure 21. By Country - North America BGA Package Substrate Revenue Market Share, 2018-2029
Figure 22. By Country - North America BGA Package Substrate Sales Market Share, 2018-2029
Figure 23. US BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 24. Canada BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 25. Mexico BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 26. By Country - Europe BGA Package Substrate Revenue Market Share, 2018-2029
Figure 27. By Country - Europe BGA Package Substrate Sales Market Share, 2018-2029
Figure 28. Germany BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 29. France BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 30. U.K. BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 31. Italy BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 32. Russia BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 33. Nordic Countries BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 34. Benelux BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 35. By Region - Asia BGA Package Substrate Revenue Market Share, 2018-2029
Figure 36. By Region - Asia BGA Package Substrate Sales Market Share, 2018-2029
Figure 37. China BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 38. Japan BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 39. South Korea BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 40. Southeast Asia BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 41. India BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 42. By Country - South America BGA Package Substrate Revenue Market Share, 2018-2029
Figure 43. By Country - South America BGA Package Substrate Sales Market Share, 2018-2029
Figure 44. Brazil BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 45. Argentina BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 46. By Country - Middle East & Africa BGA Package Substrate Revenue Market Share, 2018-2029
Figure 47. By Country - Middle East & Africa BGA Package Substrate Sales Market Share, 2018-2029
Figure 48. Turkey BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 49. Israel BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 50. Saudi Arabia BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 51. UAE BGA Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 52. Global BGA Package Substrate Production Capacity (K Sqm), 2018-2029
Figure 53. The Percentage of Production BGA Package Substrate by Region, 2022 VS 2029
Figure 54. BGA Package Substrate Industry Value Chain
Figure 55. Marketing Channels

※参考情報

BGAパッケージ基板（BGA Package Substrate）は、電子機器において極めて重要な役割を果たすコンポーネントです。この基板は、ボールグリッドアレイ（BGA）パッケージを支えるための基盤として機能し、特に高密度実装や高性能用途において広く使用されています。BGAパッケージは、製品の性能や信号の伝送効率を向上させるために設計されており、特にパソコンやスマートフォン、通信機器などの先端技術製品において不可欠です。

BGAパッケージ基板の定義は、BGAパッケージを取り扱うための基板であり、通常は多層構造で構成されています。この構造によって、信号の伝送、電源の供給、熱管理など、複数の機能が同時に実現されます。一般的にはフレキシブルプリント基板（FPCB）やPCB（プリント基板）と連携し、相互接続が行われます。これにより、ボード間の接続が効率的に行えるとともに、パッケージ間の寄生インダクタンスやキャパシタンスを低減させることができます。

BGAパッケージ基板の特徴としては、以下の点が挙げられます。まず、配線密度が高く、複雑な回路設計が可能です。これにより、コンパクトで多機能なデバイスの設計が進むことが実現されています。また、高速信号伝送に対応できる設計が可能で、特にデータ転送速度が求められる用途において優れた性能を発揮します。さらに、熱管理機能も優れており、熱を効率的に分散させることができるため、高性能なIC（集積回路）と組み合わせることが可能です。

BGAパッケージ基板には、いくつかの種類が存在します。最も一般的なものはFR-4材料を使用した基板ですが、信号の高速伝送や特定の環境条件に対応するために、PTFE（ポリテトラフルオロエチレン）や陶磁器を使用することもあります。また、基板の層数に応じて単層基板から多層基板までの様々なバリエーションが存在し、それぞれ特定の用途に応じた設計が求められます。例えば、高層数の多層基板は、電子回路の高度な集積を目的とし、ミニチュア化が進んでいる現在のエレクトロニクス市場において特に需要が高まっています。

用途に関しては、BGAパッケージ基板は、コンピュータのCPUやGPU、さまざまな通信機器、家電製品、さらには自動車産業においても重要な役割を果たしています。これらのデバイスでは、BGAパッケージ基板が耐熱性、高密度、性能の一体化を実現するための重要な要素となっています。また、IoT（モノのインターネット）やAI（人工知能）など、新しい技術分野においても、その利便性や性能を活かした製品が次々と登場しています。

関連技術としては、BGAパッケージ基板は、配線設計、フィニッシング技術、多層基板製造技術、自動化された実装技術など、数多くの先端技術に依存しています。特に、配線設計においては、信号損失やクロストークを最小限に抑えるための配慮がなされており、これが製品の全体的な性能に影響を与えることになります。また、はんだ付け技術やリフロー技術もBGAパッケージの自動取り付けを実現するためには欠かせません。

さらに、環境への配慮も重要な観点です。BGAパッケージ基板は、リサイクル可能な材料を使用することや、環境負荷を低減するための技術開発が進められています。特に、電子機器の廃棄物問題が取り上げられる中、持続可能なエレクトロニクス設計が求められるようになっています。

BGAパッケージ基板の設計及び製造においては、高度な専門知識と技術力が求められます。これにより、BGAパッケージ基板が持つ特性を最大限引き出すことが可能となります。エレクトロニクスの進化とともに、BGAパッケージ基板の役割と重要性は今後も増していくと考えられます。

総じて、BGAパッケージ基板は、現代の電子機器において不可欠な要素であり、今後の技術革新においても重要な位置を占めることでしょう。その性能や特徴は、次世代のエレクトロニクス製品において新たな可能性を切り開く鍵となるでしょう。

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