Chapter 1. Research Scope
1.1. Research Objectives
1.2. Market Definition
1.3. Analysis Period
1.4. Market Size Breakdown by Segments
1.4.1. Market size breakdown, by component
1.4.2. Market size breakdown, by material
1.4.3. Market size breakdown, by technology
1.4.4. Market size breakdown, by frequency band
1.4.5. Market size breakdown, by application
1.4.6. Market size breakdown, by region
1.4.7. Market size breakdown, by country
1.5. Market Data Reporting Unit
1.5.1. Value
1.6. Key Stakeholders
Chapter 2. Research Methodology
2.1. Secondary Research
2.1.1. Paid
2.1.2. Unpaid
2.1.3. P&S Intelligence database
2.2. Primary Research
2.3. Market Size Estimation
2.4. Data Triangulation
2.5. Currency Conversion Rates
2.6. Assumptions for the Study
2.7. Notes and Caveats
Chapter 3. Executive Summary
Chapter 4. Voice of Industry Experts/KOLs
Chapter 5. Market Indicators
Chapter 6. Industry Outlook
6.1. Market Dynamics
6.1.1. Trends
6.1.2. Drivers
6.1.3. Restraints/challenges
6.1.4. Impact analysis of drivers/restraints
6.2. Impact of COVID-19
6.3. Porter’s Five Forces Analysis
6.3.1. Bargaining power of buyers
6.3.2. Bargaining power of suppliers
6.3.3. Threat of new entrants
6.3.4. Intensity of rivalry
6.3.5. Threat of substitutes
Chapter 7. Global Market
7.1. Overview
7.2. Market Revenue, by Component (2017–2030)
7.3. Market Revenue, by Material (2017–2030)
7.4. Market Revenue, by Technology (2017–2030)
7.5. Market Revenue, by Frequency Band (2017–2030)
7.6. Market Revenue, by Application (2017–2030)
7.7. Market Revenue, by Region (2017–2030)
Chapter 8. North America Market
8.1. Overview
8.2. Market Revenue, by Component (2017–2030)
8.3. Market Revenue, by Material (2017–2030)
8.4. Market Revenue, by Technology (2017–2030)
8.5. Market Revenue, by Frequency Band (2017–2030)
8.6. Market Revenue, by Application (2017–2030)
8.7. Market Revenue, by Country (2017–2030)
Chapter 9. Europe Market
9.1. Overview
9.2. Market Revenue, by Component (2017–2030)
9.3. Market Revenue, by Material (2017–2030)
9.4. Market Revenue, by Technology (2017–2030)
9.5. Market Revenue, by Frequency Band (2017–2030)
9.6. Market Revenue, by Application (2017–2030)
9.7. Market Revenue, by Country (2017–2030)
Chapter 10. APAC Market
10.1. Overview
10.2. Market Revenue, by Component (2017–2030)
10.3. Market Revenue, by Material (2017–2030)
10.4. Market Revenue, by Technology (2017–2030)
10.5. Market Revenue, by Frequency Band (2017–2030)
10.6. Market Revenue, by Application (2017–2030)
10.7. Market Revenue, by Country (2017–2030)
Chapter 11. LATAM Market
11.1. Overview
11.2. Market Revenue, by Component (2017–2030)
11.3. Market Revenue, by Material (2017–2030)
11.4. Market Revenue, by Technology (2017–2030)
11.5. Market Revenue, by Frequency Band (2017–2030)
11.6. Market Revenue, by Application (2017–2030)
11.7. Market Revenue, by Country (2017–2030)
Chapter 12. MEA Market
12.1. Overview
12.2. Market Revenue, by Component (2017–2030)
12.3. Market Revenue, by Material (2017–2030)
12.4. Market Revenue, by Technology (2017–2030)
12.5. Market Revenue, by Frequency Band (2017–2030)
12.6. Market Revenue, by Application (2017–2030)
12.7. Market Revenue, by Country (2017–2030)
Chapter 13. U.S. Market
13.1. Overview
13.2. Market Revenue, by Component (2017–2030)
13.3. Market Revenue, by Material (2017–2030)
13.4. Market Revenue, by Technology (2017–2030)
13.5. Market Revenue, by Frequency Band (2017–2030)
13.6. Market Revenue, by Application (2017–2030)
Chapter 14. Canada Market
14.1. Overview
14.2. Market Revenue, by Component (2017–2030)
14.3. Market Revenue, by Material (2017–2030)
14.4. Market Revenue, by Technology (2017–2030)
14.5. Market Revenue, by Frequency Band (2017–2030)
14.6. Market Revenue, by Application (2017–2030)
Chapter 15. Germany Market
15.1. Overview
15.2. Market Revenue, by Component (2017–2030)
15.3. Market Revenue, by Material (2017–2030)
15.4. Market Revenue, by Technology (2017–2030)
15.5. Market Revenue, by Frequency Band (2017–2030)
15.6. Market Revenue, by Application (2017–2030)
Chapter 16. France Market
16.1. Overview
16.2. Market Revenue, by Component (2017–2030)
16.3. Market Revenue, by Material (2017–2030)
16.4. Market Revenue, by Technology (2017–2030)
16.5. Market Revenue, by Frequency Band (2017–2030)
16.6. Market Revenue, by Application (2017–2030)
Chapter 17. U.K. Market
17.1. Overview
17.2. Market Revenue, by Component (2017–2030)
17.3. Market Revenue, by Material (2017–2030)
17.4. Market Revenue, by Technology (2017–2030)
17.5. Market Revenue, by Frequency Band (2017–2030)
17.6. Market Revenue, by Application (2017–2030)
Chapter 18. Italy Market
18.1. Overview
18.2. Market Revenue, by Component (2017–2030)
18.3. Market Revenue, by Material (2017–2030)
18.4. Market Revenue, by Technology (2017–2030)
18.5. Market Revenue, by Frequency Band (2017–2030)
18.6. Market Revenue, by Application (2017–2030)
Chapter 19. Spain Market
19.1. Overview
19.2. Market Revenue, by Component (2017–2030)
19.3. Market Revenue, by Material (2017–2030)
19.4. Market Revenue, by Technology (2017–2030)
19.5. Market Revenue, by Frequency Band (2017–2030)
19.6. Market Revenue, by Application (2017–2030)
Chapter 20. Japan Market
20.1. Overview
20.2. Market Revenue, by Component (2017–2030)
20.3. Market Revenue, by Material (2017–2030)
20.4. Market Revenue, by Technology (2017–2030)
20.5. Market Revenue, by Frequency Band (2017–2030)
20.6. Market Revenue, by Application (2017–2030)
Chapter 21. China Market
21.1. Overview
21.2. Market Revenue, by Component (2017–2030)
21.3. Market Revenue, by Material (2017–2030)
21.4. Market Revenue, by Technology (2017–2030)
21.5. Market Revenue, by Frequency Band (2017–2030)
21.6. Market Revenue, by Application (2017–2030)
Chapter 22. India Market
22.1. Overview
22.2. Market Revenue, by Component (2017–2030)
22.3. Market Revenue, by Material (2017–2030)
22.4. Market Revenue, by Technology (2017–2030)
22.5. Market Revenue, by Frequency Band (2017–2030)
22.6. Market Revenue, by Application (2017–2030)
Chapter 23. Australia Market
23.1. Overview
23.2. Market Revenue, by Component (2017–2030)
23.3. Market Revenue, by Material (2017–2030)
23.4. Market Revenue, by Technology (2017–2030)
23.5. Market Revenue, by Frequency Band (2017–2030)
23.6. Market Revenue, by Application (2017–2030)
Chapter 24. South Korea Market
24.1. Overview
24.2. Market Revenue, by Component (2017–2030)
24.3. Market Revenue, by Material (2017–2030)
24.4. Market Revenue, by Technology (2017–2030)
24.5. Market Revenue, by Frequency Band (2017–2030)
24.6. Market Revenue, by Application (2017–2030)
Chapter 25. Brazil Market
25.1. Overview
25.2. Market Revenue, by Component (2017–2030)
25.3. Market Revenue, by Material (2017–2030)
25.4. Market Revenue, by Technology (2017–2030)
25.5. Market Revenue, by Frequency Band (2017–2030)
25.6. Market Revenue, by Application (2017–2030)
Chapter 26. Mexico Market
26.1. Overview
26.2. Market Revenue, by Component (2017–2030)
26.3. Market Revenue, by Material (2017–2030)
26.4. Market Revenue, by Technology (2017–2030)
26.5. Market Revenue, by Frequency Band (2017–2030)
26.6. Market Revenue, by Application (2017–2030)
Chapter 27. Saudi Arabia Market
27.1. Overview
27.2. Market Revenue, by Component (2017–2030)
27.3. Market Revenue, by Material (2017–2030)
27.4. Market Revenue, by Technology (2017–2030)
27.5. Market Revenue, by Frequency Band (2017–2030)
27.6. Market Revenue, by Application (2017–2030)
Chapter 28. South Africa Market
28.1. Overview
28.2. Market Revenue, by Component (2017–2030)
28.3. Market Revenue, by Material (2017–2030)
28.4. Market Revenue, by Technology (2017–2030)
28.5. Market Revenue, by Frequency Band (2017–2030)
28.6. Market Revenue, by Application (2017–2030)
Chapter 29. U.A.E. Market
29.1. Overview
29.2. Market Revenue, by Component (2017–2030)
29.3. Market Revenue, by Material (2017–2030)
29.4. Market Revenue, by Technology (2017–2030)
29.5. Market Revenue, by Frequency Band (2017–2030)
29.6. Market Revenue, by Application (2017–2030)
Chapter 30. Competitive Landscape
30.1. List of Market Players and their Offerings
30.2. Competitive Benchmarking of Key Players
30.3. Product Benchmarking of Key Players
30.4. Recent Strategic Developments
Chapter 31. Company Profiles
31.1. Qorvo Inc.
31.1.1. Business overview
31.1.2. Product and service offerings
31.1.3. Key financial summary
31.2. MACOM Technology Solutions Holdings Inc.
31.2.1. Business overview
31.2.2. Product and service offerings
31.2.3. Key financial summary
31.3. Skyworks Solutions Inc.
31.3.1. Business overview
31.3.2. Product and service offerings
31.3.3. Key financial summary
31.4. NXP Semiconductors N.V.
31.4.1. Business overview
31.4.2. Product and service offerings
31.4.3. Key financial summary
31.5. Infineon Technologies AG
31.5.1. Business overview
31.5.2. Product and service offerings
31.5.3. Key financial summary
31.6. WIN Semiconductors Corp.
31.6.1. Business overview
31.6.2. Product and service offerings
31.6.3. Key financial summary
31.7. STMicroelectronics N.V.
31.7.1. Business overview
31.7.2. Product and service offerings
31.7.3. Key financial summary
31.8. ON Semiconductor Corporation
31.8.1. Business overview
31.8.2. Product and service offerings
31.8.3. Key financial summary
31.9. Aspen Electronics Ltd.
31.9.1. Business overview
31.9.2. Product and service offerings
31.10. VectraWave
31.10.1. Business overview
31.10.2. Product and service offerings
31.11. Analog Devices Inc.
31.11.1. Business overview
31.11.2. Product and service offerings
31.11.3. Key financial summary
31.12. United Monolithic Semiconductors Group
31.12.1. Business overview
31.12.2. Product and service offerings
31.13. Mini-Circuits
31.13.1. Business overview
31.13.2. Product and service offerings
31.14. Texas Instruments Incorporated
31.14.1. Business overview
31.14.2. Product and service offerings
31.14.3. Key financial summary
31.15. Mitsubishi Electric Corporation
31.15.1. Business overview
31.15.2. Product and service offerings
31.15.3. Key financial summary
Chapter 32. Appendix
32.1. Abbreviations
32.2. Sources and References
32.3. Related Reports
| ※参考情報 モノリシックマイクロ波IC(MMIC)は、高周波数の信号を処理するための集積回路であり、主にマイクロ波域(300MHzから300GHz)の電子回路を一つの基板上に統合しています。MMICは、さまざまな分野で幅広く使用されており、その技術は日進月歩で進化しています。 MMICの基本構造は、半導体素材を用いたトランジスタ、抵抗器、キャパシタなどのパッシブおよびアクティブ素子が集積されたものです。これにより、従来のマイクロ波回路で必要とされる多くの外部部品を削減し、サイズ、重量、コスト効率を改善しています。特に、ガリウム砒素(GaAs)やインジウムリン(InP)といった高周波特性を持つ材料が用いられることが一般的です。 MMICの種類には、大きく分けてアナログMMICとデジタルMMICがあります。アナログMMICは、信号の増幅や混合、周波数変換などの機能を持つ回路が含まれています。一方、デジタルMMICは、デジタル信号処理に特化した回路で、RF信号のデジタル変換やデジタル信号の処理を行います。また、MMICは特定の機能に特化した機能専用型と、多機能を持つ汎用型の2つのカテゴリーに分けることもできます。 MMICの主な用途は、通信、レーダー、衛星通信、センサー技術など多岐にわたります。例えば、無線通信システムにおいては、MMICは送信機や受信機の中心的な要素として働き、信号の増幅や変換を行います。さらに、レーダーシステムでは、MMICが高周波信号の生成や受信を効率的に実行することで、対象物の検知や追跡を可能にします。最近では、5G通信やIoT技術の普及に伴い、MMICの需要がますます高まっています。 関連技術としては、モノリシック集積回路の製造プロセスやテスト手法が挙げられます。MMICの製造は高精度であり、プロセス技術の向上が品質向上に直結します。特に半導体製造プロセスでは、フォトリソグラフィーやエッチング技術が重要です。また、MMICが動作する周波数帯域の特性を評価するための高周波測定技術も重要です。これには、実験室環境でのテストシステムや、電気的特性評価に必要な専用機器が含まれます。 さらに、MMICは高温や高周波数においても安定した性能を持つことが求められるため、耐環境性や信頼性に関する研究も進められています。これにより、宇宙や極限環境での利用が可能となり、さらなる応用範囲の拡大が期待されています。 最近の技術革新としては、シリコン技術の進展を背景にしたシリコンベースのMMICの開発が注目されています。シリコン技術はコスト面や製造プロセスが確立されているため、今後の市場において競争力を持つ可能性があります。ただし、ガリウム砒素やインジウムリンと比べて高周波特性が劣るため、用途によっては適切な素材の選択が重要です。 MMICは、電子通信だけでなく、医療や自動運転技術など、今後さらに多様な分野での応用が期待される重要な技術です。将来的には、さらなる高集積化や特性改善が進むことで、より多機能かつ高性能な電子機器の実現に貢献することでしょう。これにより、私たちの日常生活や産業全般において、より高度な技術が普及していくことが見込まれています。 |
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