世界のウェーハ接合装置市場予測 2023年-2029年

◆英語タイトル：Global Wafer Bonding Equipment Market Growth 2023-2029

◆商品コード：LP23JU0987
◆発行会社（リサーチ会社）：LP Information
◆発行日：2023年5月（※2025年版があります。お問い合わせください。）
◆ページ数：104
◆レポート形式：英語 / PDF
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◆調査対象地域：グローバル、日本、アメリカ、ヨーロッパ、アジア、中国など
◆産業分野：電子＆半導体

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❖ レポートの概要 ❖

LPインフォメーションの最新刊調査レポート「世界のウェーハ接合装置市場」は、過去の販売実績から2022年の世界のウェーハ接合装置の総販売量を検討し、2023年から2029年の予測されるウェーハ接合装置の販売量を地域別・市場分野別に包括的に分析しています。本調査レポートでは、地域別、市場分野別、サブセクター別のウェーハ接合装置の市場規模を掲載し、XXX百万米ドル規模の世界のウェーハ接合装置市場の詳細な分析を提供します。本インサイトレポートは、世界のウェーハ接合装置業界を包括的に分析し、製品セグメント、企業情報、売上、市場シェア、最新動向、M&A活動に関する主要トレンドを明らかにしています。
また、本レポートでは、加速する世界のウェーハ接合装置市場における各社の独自のポジションをより深く理解するために、ウェーハ接合装置製品ポートフォリオ、能力、市場参入戦略、市場でのポジション、海外展開に焦点を当て、主要なグローバル企業の戦略を分析しています。

世界のウェーハ接合装置市場規模は、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに成長すると予測され、2023年から2029年までの年平均成長率は000%と予測されます。ウェーハ接合装置の米国市場は、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに増加し、2023年から2029年までのCAGRは000％と予測されています。ウェーハ接合装置の中国市場は、2023年から2029年までの年平均000％成長率で、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに増加すると推定されます。ウェーハ接合装置のヨーロッパ市場は、2023年から2029年にかけて年平均000％成長率で、2022年のXXX百万米ドルから2029年にはXXX百万米ドルに増加すると推定されています。

ウェーハ接合装置の世界主要メーカーとしては、EV Group、 SUSS MicroTec、 Tokyo Electron、 Applied Microengineering、 Nidec Machinetool、 Ayumi Industry、 Shanghai Micro Electronics、 U-Precision Tech、 Hutem、 Canon、 Bondtech、 TAZMO、 TOKなどを掲載しており、売上の面では、世界の2大企業が2022年にほぼ000％のシェアを占めています。

本レポートでは、製品タイプ、用途、主要メーカー、主要地域、国別のウェーハ接合装置市場の包括的な概要、市場シェア、成長機会などの情報を提供しています。

【市場細分化】

この調査ではウェーハ接合装置市場をセグメンテーションし、種類別 (全自動、半自動)、用途別 (MEMS、アドバンストパッケージング、CIS、その他)、および地域別 (アジア太平洋、南北アメリカ、ヨーロッパ、および中東・アフリカ) の市場規模を予測しています。

・種類別区分：全自動、半自動

・用途別区分：MEMS、アドバンストパッケージング、CIS、その他

・地域別区分
南北アメリカ（アメリカ、カナダ、メキシコ、ブラジル）
アジア太平洋（中国、日本、韓国、東南アジア、インド、オーストラリア）
ヨーロッパ（ドイツ、フランス、イギリス、イタリア、ロシア）
中東・アフリカ（エジプト、南アフリカ、イスラエル、トルコ、GCC諸国）

【本レポートで扱う主な質問】

・世界のウェーハ接合装置市場の10年間の市場状況・展望は？
・世界および地域別に見たウェーハ接合装置市場成長の要因は何か？
・ウェーハ接合装置の市場機会はエンドマーケットの規模によってどのように変化するのか？
・ウェーハ接合装置のタイプ別、用途別の内訳は？
・新型コロナウイルス感染症とロシア・ウクライナ戦争の影響は？

********* 目次 *********

レポートの範囲
・市場の紹介
・分析対象期間
・調査の目的
・調査手法
・調査プロセスおよびデータソース
・経済指標
・通貨

エグゼクティブサマリー
・世界市場の概要：ウェーハ接合装置の年間販売量2018-2029、地域別現状・将来分析
・ウェーハ接合装置の種類別セグメント：全自動、半自動
・ウェーハ接合装置の種類別販売量：2018-2023年の販売量、売上、市場シェア、販売価格
・ウェーハ接合装置の用途別セグメント：MEMS、アドバンストパッケージング、CIS、その他
・ウェーハ接合装置の用途別販売量：2018-2023年の販売量、売上、市場シェア、販売価格

企業別世界のウェーハ接合装置市場
・企業別のグローバルウェーハ接合装置市場データ：2018-2023年の年間販売量、市場シェア
・企業別のウェーハ接合装置の年間売上：2018-2023年の売上、市場シェア
・企業別のウェーハ接合装置販売価格
・主要企業のウェーハ接合装置生産地域、販売地域、製品タイプ
・市場集中度分析
・新製品および潜在的な参加者
・合併と買収、拡大

ウェーハ接合装置の地域別レビュー
・地域別のウェーハ接合装置市場規模2018-2023：年間販売量、売上
・主要国別のウェーハ接合装置市場規模2018-2023：年間販売量、売上
・南北アメリカのウェーハ接合装置販売の成長
・アジア太平洋のウェーハ接合装置販売の成長
・ヨーロッパのウェーハ接合装置販売の成長
・中東・アフリカのウェーハ接合装置販売の成長

南北アメリカ市場
・南北アメリカの国別のウェーハ接合装置販売量、売上（2018-2023）
・南北アメリカのウェーハ接合装置の種類別販売量
・南北アメリカのウェーハ接合装置の用途別販売量
・アメリカ市場
・カナダ市場
・メキシコ市場
・ブラジル市場

アジア太平洋市場
・アジア太平洋の国別のウェーハ接合装置販売量、売上（2018-2023）
・アジア太平洋のウェーハ接合装置の種類別販売量
・アジア太平洋のウェーハ接合装置の用途別販売量
・中国市場
・日本市場
・韓国市場
・東南アジア市場
・インド市場
・オーストラリア市場
・台湾市場

ヨーロッパ市場
・ヨーロッパの国別のウェーハ接合装置販売量、売上（2018-2023）
・ヨーロッパのウェーハ接合装置の種類別販売量
・ヨーロッパのウェーハ接合装置の用途別販売量
・ドイツ市場
・フランス市場
・イギリス市場
・イタリア市場
・ロシア市場

中東・アフリカ市場
・中東・アフリカの国別のウェーハ接合装置販売量、売上（2018-2023）
・中東・アフリカのウェーハ接合装置の種類別販売量
・中東・アフリカのウェーハ接合装置の用途別販売量
・エジプト市場
・南アフリカ市場
・イスラエル市場
・トルコ市場
・GCC諸国市場

市場の成長要因、課題、動向
・市場の成長要因および成長機会分析
・市場の課題およびリスク
・市場動向

製造コスト構造分析
・原材料とサプライヤー
・ウェーハ接合装置の製造コスト構造分析
・ウェーハ接合装置の製造プロセス分析
・ウェーハ接合装置の産業チェーン構造

マーケティング、販売業者および顧客
・販売チャンネル：直接販売チャンネル、間接販売チャンネル
・ウェーハ接合装置の主要なグローバル販売業者
・ウェーハ接合装置の主要なグローバル顧客

地域別のウェーハ接合装置市場予測レビュー
・地域別のウェーハ接合装置市場規模予測（2024-2029）
・南北アメリカの国別予測
・アジア太平洋の国別予測
・ヨーロッパの国別予測
・ウェーハ接合装置の種類別市場規模予測
・ウェーハ接合装置の用途別市場規模予測

主要企業分析
EV Group、 SUSS MicroTec、 Tokyo Electron、 Applied Microengineering、 Nidec Machinetool、 Ayumi Industry、 Shanghai Micro Electronics、 U-Precision Tech、 Hutem、 Canon、 Bondtech、 TAZMO、 TOK
・企業情報
・ウェーハ接合装置製品
・ウェーハ接合装置販売量、売上、価格、粗利益（2018-2023）
・主要ビジネス概要
・最新動向

調査結果および結論

LPI (LP Information)’ newest research report, the “Wafer Bonding Equipment Industry Forecast” looks at past sales and reviews total world Wafer Bonding Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected Wafer Bonding Equipment sales for 2023 through 2029. With Wafer Bonding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Bonding Equipment industry.
This Insight Report provides a comprehensive analysis of the global Wafer Bonding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Bonding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Bonding Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Bonding Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Bonding Equipment.
The global Wafer Bonding Equipment market size is projected to grow from US$ 301.1 million in 2022 to US$ 452 million in 2029; it is expected to grow at a CAGR of 452 from 2023 to 2029.
Global key players of wafer bonding equipment include EV Group, SUSS MicroTec, Tokyo Electron, etc. Asia-Pacific is the largest producer of wafer bonding equipment, holds a share over 60%, followed by Europe, and North America. In terms of product, fully automatic is the largest segment, with a share over 80%. And in terms of application, the largest segment is MEMS, with a share about 40%.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Bonding Equipment market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Fully Automatic
Semi Automatic
Segmentation by application
MEMS
Advanced Packaging
CIS
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company’s coverage, product portfolio, its market penetration.
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Ayumi Industry
Shanghai Micro Electronics
U-Precision Tech
Hutem
Canon
Bondtech
TAZMO
TOK
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Bonding Equipment market?
What factors are driving Wafer Bonding Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Bonding Equipment market opportunities vary by end market size?
How does Wafer Bonding Equipment break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

❖ レポートの目次 ❖

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Wafer Bonding Equipment Annual Sales 2018-2029
2.1.2 World Current & Future Analysis for Wafer Bonding Equipment by Geographic Region, 2018, 2022 & 2029
2.1.3 World Current & Future Analysis for Wafer Bonding Equipment by Country/Region, 2018, 2022 & 2029
2.2 Wafer Bonding Equipment Segment by Type
2.2.1 Fully Automatic
2.2.2 Semi Automatic
2.3 Wafer Bonding Equipment Sales by Type
2.3.1 Global Wafer Bonding Equipment Sales Market Share by Type (2018-2023)
2.3.2 Global Wafer Bonding Equipment Revenue and Market Share by Type (2018-2023)
2.3.3 Global Wafer Bonding Equipment Sale Price by Type (2018-2023)
2.4 Wafer Bonding Equipment Segment by Application
2.4.1 MEMS
2.4.2 Advanced Packaging
2.4.3 CIS
2.4.4 Others
2.5 Wafer Bonding Equipment Sales by Application
2.5.1 Global Wafer Bonding Equipment Sale Market Share by Application (2018-2023)
2.5.2 Global Wafer Bonding Equipment Revenue and Market Share by Application (2018-2023)
2.5.3 Global Wafer Bonding Equipment Sale Price by Application (2018-2023)
3 Global Wafer Bonding Equipment by Company
3.1 Global Wafer Bonding Equipment Breakdown Data by Company
3.1.1 Global Wafer Bonding Equipment Annual Sales by Company (2018-2023)
3.1.2 Global Wafer Bonding Equipment Sales Market Share by Company (2018-2023)
3.2 Global Wafer Bonding Equipment Annual Revenue by Company (2018-2023)
3.2.1 Global Wafer Bonding Equipment Revenue by Company (2018-2023)
3.2.2 Global Wafer Bonding Equipment Revenue Market Share by Company (2018-2023)
3.3 Global Wafer Bonding Equipment Sale Price by Company
3.4 Key Manufacturers Wafer Bonding Equipment Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Wafer Bonding Equipment Product Location Distribution
3.4.2 Players Wafer Bonding Equipment Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2018-2023)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for Wafer Bonding Equipment by Geographic Region
4.1 World Historic Wafer Bonding Equipment Market Size by Geographic Region (2018-2023)
4.1.1 Global Wafer Bonding Equipment Annual Sales by Geographic Region (2018-2023)
4.1.2 Global Wafer Bonding Equipment Annual Revenue by Geographic Region (2018-2023)
4.2 World Historic Wafer Bonding Equipment Market Size by Country/Region (2018-2023)
4.2.1 Global Wafer Bonding Equipment Annual Sales by Country/Region (2018-2023)
4.2.2 Global Wafer Bonding Equipment Annual Revenue by Country/Region (2018-2023)
4.3 Americas Wafer Bonding Equipment Sales Growth
4.4 APAC Wafer Bonding Equipment Sales Growth
4.5 Europe Wafer Bonding Equipment Sales Growth
4.6 Middle East & Africa Wafer Bonding Equipment Sales Growth
5 Americas
5.1 Americas Wafer Bonding Equipment Sales by Country
5.1.1 Americas Wafer Bonding Equipment Sales by Country (2018-2023)
5.1.2 Americas Wafer Bonding Equipment Revenue by Country (2018-2023)
5.2 Americas Wafer Bonding Equipment Sales by Type
5.3 Americas Wafer Bonding Equipment Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Wafer Bonding Equipment Sales by Region
6.1.1 APAC Wafer Bonding Equipment Sales by Region (2018-2023)
6.1.2 APAC Wafer Bonding Equipment Revenue by Region (2018-2023)
6.2 APAC Wafer Bonding Equipment Sales by Type
6.3 APAC Wafer Bonding Equipment Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Wafer Bonding Equipment by Country
7.1.1 Europe Wafer Bonding Equipment Sales by Country (2018-2023)
7.1.2 Europe Wafer Bonding Equipment Revenue by Country (2018-2023)
7.2 Europe Wafer Bonding Equipment Sales by Type
7.3 Europe Wafer Bonding Equipment Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Wafer Bonding Equipment by Country
8.1.1 Middle East & Africa Wafer Bonding Equipment Sales by Country (2018-2023)
8.1.2 Middle East & Africa Wafer Bonding Equipment Revenue by Country (2018-2023)
8.2 Middle East & Africa Wafer Bonding Equipment Sales by Type
8.3 Middle East & Africa Wafer Bonding Equipment Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Wafer Bonding Equipment
10.3 Manufacturing Process Analysis of Wafer Bonding Equipment
10.4 Industry Chain Structure of Wafer Bonding Equipment
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Wafer Bonding Equipment Distributors
11.3 Wafer Bonding Equipment Customer
12 World Forecast Review for Wafer Bonding Equipment by Geographic Region
12.1 Global Wafer Bonding Equipment Market Size Forecast by Region
12.1.1 Global Wafer Bonding Equipment Forecast by Region (2024-2029)
12.1.2 Global Wafer Bonding Equipment Annual Revenue Forecast by Region (2024-2029)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global Wafer Bonding Equipment Forecast by Type
12.7 Global Wafer Bonding Equipment Forecast by Application
13 Key Players Analysis
13.1 EV Group
13.1.1 EV Group Company Information
13.1.2 EV Group Wafer Bonding Equipment Product Portfolios and Specifications
13.1.3 EV Group Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.1.4 EV Group Main Business Overview
13.1.5 EV Group Latest Developments
13.2 SUSS MicroTec
13.2.1 SUSS MicroTec Company Information
13.2.2 SUSS MicroTec Wafer Bonding Equipment Product Portfolios and Specifications
13.2.3 SUSS MicroTec Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.2.4 SUSS MicroTec Main Business Overview
13.2.5 SUSS MicroTec Latest Developments
13.3 Tokyo Electron
13.3.1 Tokyo Electron Company Information
13.3.2 Tokyo Electron Wafer Bonding Equipment Product Portfolios and Specifications
13.3.3 Tokyo Electron Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.3.4 Tokyo Electron Main Business Overview
13.3.5 Tokyo Electron Latest Developments
13.4 Applied Microengineering
13.4.1 Applied Microengineering Company Information
13.4.2 Applied Microengineering Wafer Bonding Equipment Product Portfolios and Specifications
13.4.3 Applied Microengineering Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.4.4 Applied Microengineering Main Business Overview
13.4.5 Applied Microengineering Latest Developments
13.5 Nidec Machinetool
13.5.1 Nidec Machinetool Company Information
13.5.2 Nidec Machinetool Wafer Bonding Equipment Product Portfolios and Specifications
13.5.3 Nidec Machinetool Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.5.4 Nidec Machinetool Main Business Overview
13.5.5 Nidec Machinetool Latest Developments
13.6 Ayumi Industry
13.6.1 Ayumi Industry Company Information
13.6.2 Ayumi Industry Wafer Bonding Equipment Product Portfolios and Specifications
13.6.3 Ayumi Industry Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.6.4 Ayumi Industry Main Business Overview
13.6.5 Ayumi Industry Latest Developments
13.7 Shanghai Micro Electronics
13.7.1 Shanghai Micro Electronics Company Information
13.7.2 Shanghai Micro Electronics Wafer Bonding Equipment Product Portfolios and Specifications
13.7.3 Shanghai Micro Electronics Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.7.4 Shanghai Micro Electronics Main Business Overview
13.7.5 Shanghai Micro Electronics Latest Developments
13.8 U-Precision Tech
13.8.1 U-Precision Tech Company Information
13.8.2 U-Precision Tech Wafer Bonding Equipment Product Portfolios and Specifications
13.8.3 U-Precision Tech Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.8.4 U-Precision Tech Main Business Overview
13.8.5 U-Precision Tech Latest Developments
13.9 Hutem
13.9.1 Hutem Company Information
13.9.2 Hutem Wafer Bonding Equipment Product Portfolios and Specifications
13.9.3 Hutem Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.9.4 Hutem Main Business Overview
13.9.5 Hutem Latest Developments
13.10 Canon
13.10.1 Canon Company Information
13.10.2 Canon Wafer Bonding Equipment Product Portfolios and Specifications
13.10.3 Canon Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.10.4 Canon Main Business Overview
13.10.5 Canon Latest Developments
13.11 Bondtech
13.11.1 Bondtech Company Information
13.11.2 Bondtech Wafer Bonding Equipment Product Portfolios and Specifications
13.11.3 Bondtech Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.11.4 Bondtech Main Business Overview
13.11.5 Bondtech Latest Developments
13.12 TAZMO
13.12.1 TAZMO Company Information
13.12.2 TAZMO Wafer Bonding Equipment Product Portfolios and Specifications
13.12.3 TAZMO Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.12.4 TAZMO Main Business Overview
13.12.5 TAZMO Latest Developments
13.13 TOK
13.13.1 TOK Company Information
13.13.2 TOK Wafer Bonding Equipment Product Portfolios and Specifications
13.13.3 TOK Wafer Bonding Equipment Sales, Revenue, Price and Gross Margin (2018-2023)
13.13.4 TOK Main Business Overview
13.13.5 TOK Latest Developments
14 Research Findings and Conclusion

List of Tables
Table 1. Wafer Bonding Equipment Annual Sales CAGR by Geographic Region (2018, 2022 & 2029) & ($ millions)
Table 2. Wafer Bonding Equipment Annual Sales CAGR by Country/Region (2018, 2022 & 2029) & ($ millions)
Table 3. Major Players of Fully Automatic
Table 4. Major Players of Semi Automatic
Table 5. Global Wafer Bonding Equipment Sales by Type (2018-2023) & (Units)
Table 6. Global Wafer Bonding Equipment Sales Market Share by Type (2018-2023)
Table 7. Global Wafer Bonding Equipment Revenue by Type (2018-2023) & ($ million)
Table 8. Global Wafer Bonding Equipment Revenue Market Share by Type (2018-2023)
Table 9. Global Wafer Bonding Equipment Sale Price by Type (2018-2023) & (K USD/Unit)
Table 10. Global Wafer Bonding Equipment Sales by Application (2018-2023) & (Units)
Table 11. Global Wafer Bonding Equipment Sales Market Share by Application (2018-2023)
Table 12. Global Wafer Bonding Equipment Revenue by Application (2018-2023)
Table 13. Global Wafer Bonding Equipment Revenue Market Share by Application (2018-2023)
Table 14. Global Wafer Bonding Equipment Sale Price by Application (2018-2023) & (K USD/Unit)
Table 15. Global Wafer Bonding Equipment Sales by Company (2018-2023) & (Units)
Table 16. Global Wafer Bonding Equipment Sales Market Share by Company (2018-2023)
Table 17. Global Wafer Bonding Equipment Revenue by Company (2018-2023) ($ Millions)
Table 18. Global Wafer Bonding Equipment Revenue Market Share by Company (2018-2023)
Table 19. Global Wafer Bonding Equipment Sale Price by Company (2018-2023) & (K USD/Unit)
Table 20. Key Manufacturers Wafer Bonding Equipment Producing Area Distribution and Sales Area
Table 21. Players Wafer Bonding Equipment Products Offered
Table 22. Wafer Bonding Equipment Concentration Ratio (CR3, CR5 and CR10) & (2018-2023)
Table 23. New Products and Potential Entrants
Table 24. Mergers & Acquisitions, Expansion
Table 25. Global Wafer Bonding Equipment Sales by Geographic Region (2018-2023) & (Units)
Table 26. Global Wafer Bonding Equipment Sales Market Share Geographic Region (2018-2023)
Table 27. Global Wafer Bonding Equipment Revenue by Geographic Region (2018-2023) & ($ millions)
Table 28. Global Wafer Bonding Equipment Revenue Market Share by Geographic Region (2018-2023)
Table 29. Global Wafer Bonding Equipment Sales by Country/Region (2018-2023) & (Units)
Table 30. Global Wafer Bonding Equipment Sales Market Share by Country/Region (2018-2023)
Table 31. Global Wafer Bonding Equipment Revenue by Country/Region (2018-2023) & ($ millions)
Table 32. Global Wafer Bonding Equipment Revenue Market Share by Country/Region (2018-2023)
Table 33. Americas Wafer Bonding Equipment Sales by Country (2018-2023) & (Units)
Table 34. Americas Wafer Bonding Equipment Sales Market Share by Country (2018-2023)
Table 35. Americas Wafer Bonding Equipment Revenue by Country (2018-2023) & ($ Millions)
Table 36. Americas Wafer Bonding Equipment Revenue Market Share by Country (2018-2023)
Table 37. Americas Wafer Bonding Equipment Sales by Type (2018-2023) & (Units)
Table 38. Americas Wafer Bonding Equipment Sales by Application (2018-2023) & (Units)
Table 39. APAC Wafer Bonding Equipment Sales by Region (2018-2023) & (Units)
Table 40. APAC Wafer Bonding Equipment Sales Market Share by Region (2018-2023)
Table 41. APAC Wafer Bonding Equipment Revenue by Region (2018-2023) & ($ Millions)
Table 42. APAC Wafer Bonding Equipment Revenue Market Share by Region (2018-2023)
Table 43. APAC Wafer Bonding Equipment Sales by Type (2018-2023) & (Units)
Table 44. APAC Wafer Bonding Equipment Sales by Application (2018-2023) & (Units)
Table 45. Europe Wafer Bonding Equipment Sales by Country (2018-2023) & (Units)
Table 46. Europe Wafer Bonding Equipment Sales Market Share by Country (2018-2023)
Table 47. Europe Wafer Bonding Equipment Revenue by Country (2018-2023) & ($ Millions)
Table 48. Europe Wafer Bonding Equipment Revenue Market Share by Country (2018-2023)
Table 49. Europe Wafer Bonding Equipment Sales by Type (2018-2023) & (Units)
Table 50. Europe Wafer Bonding Equipment Sales by Application (2018-2023) & (Units)
Table 51. Middle East & Africa Wafer Bonding Equipment Sales by Country (2018-2023) & (Units)
Table 52. Middle East & Africa Wafer Bonding Equipment Sales Market Share by Country (2018-2023)
Table 53. Middle East & Africa Wafer Bonding Equipment Revenue by Country (2018-2023) & ($ Millions)
Table 54. Middle East & Africa Wafer Bonding Equipment Revenue Market Share by Country (2018-2023)
Table 55. Middle East & Africa Wafer Bonding Equipment Sales by Type (2018-2023) & (Units)
Table 56. Middle East & Africa Wafer Bonding Equipment Sales by Application (2018-2023) & (Units)
Table 57. Key Market Drivers & Growth Opportunities of Wafer Bonding Equipment
Table 58. Key Market Challenges & Risks of Wafer Bonding Equipment
Table 59. Key Industry Trends of Wafer Bonding Equipment
Table 60. Wafer Bonding Equipment Raw Material
Table 61. Key Suppliers of Raw Materials
Table 62. Wafer Bonding Equipment Distributors List
Table 63. Wafer Bonding Equipment Customer List
Table 64. Global Wafer Bonding Equipment Sales Forecast by Region (2024-2029) & (Units)
Table 65. Global Wafer Bonding Equipment Revenue Forecast by Region (2024-2029) & ($ millions)
Table 66. Americas Wafer Bonding Equipment Sales Forecast by Country (2024-2029) & (Units)
Table 67. Americas Wafer Bonding Equipment Revenue Forecast by Country (2024-2029) & ($ millions)
Table 68. APAC Wafer Bonding Equipment Sales Forecast by Region (2024-2029) & (Units)
Table 69. APAC Wafer Bonding Equipment Revenue Forecast by Region (2024-2029) & ($ millions)
Table 70. Europe Wafer Bonding Equipment Sales Forecast by Country (2024-2029) & (Units)
Table 71. Europe Wafer Bonding Equipment Revenue Forecast by Country (2024-2029) & ($ millions)
Table 72. Middle East & Africa Wafer Bonding Equipment Sales Forecast by Country (2024-2029) & (Units)
Table 73. Middle East & Africa Wafer Bonding Equipment Revenue Forecast by Country (2024-2029) & ($ millions)
Table 74. Global Wafer Bonding Equipment Sales Forecast by Type (2024-2029) & (Units)
Table 75. Global Wafer Bonding Equipment Revenue Forecast by Type (2024-2029) & ($ Millions)
Table 76. Global Wafer Bonding Equipment Sales Forecast by Application (2024-2029) & (Units)
Table 77. Global Wafer Bonding Equipment Revenue Forecast by Application (2024-2029) & ($ Millions)
Table 78. EV Group Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 79. EV Group Wafer Bonding Equipment Product Portfolios and Specifications
Table 80. EV Group Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 81. EV Group Main Business
Table 82. EV Group Latest Developments
Table 83. SUSS MicroTec Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 84. SUSS MicroTec Wafer Bonding Equipment Product Portfolios and Specifications
Table 85. SUSS MicroTec Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 86. SUSS MicroTec Main Business
Table 87. SUSS MicroTec Latest Developments
Table 88. Tokyo Electron Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 89. Tokyo Electron Wafer Bonding Equipment Product Portfolios and Specifications
Table 90. Tokyo Electron Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 91. Tokyo Electron Main Business
Table 92. Tokyo Electron Latest Developments
Table 93. Applied Microengineering Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 94. Applied Microengineering Wafer Bonding Equipment Product Portfolios and Specifications
Table 95. Applied Microengineering Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 96. Applied Microengineering Main Business
Table 97. Applied Microengineering Latest Developments
Table 98. Nidec Machinetool Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 99. Nidec Machinetool Wafer Bonding Equipment Product Portfolios and Specifications
Table 100. Nidec Machinetool Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 101. Nidec Machinetool Main Business
Table 102. Nidec Machinetool Latest Developments
Table 103. Ayumi Industry Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 104. Ayumi Industry Wafer Bonding Equipment Product Portfolios and Specifications
Table 105. Ayumi Industry Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 106. Ayumi Industry Main Business
Table 107. Ayumi Industry Latest Developments
Table 108. Shanghai Micro Electronics Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 109. Shanghai Micro Electronics Wafer Bonding Equipment Product Portfolios and Specifications
Table 110. Shanghai Micro Electronics Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 111. Shanghai Micro Electronics Main Business
Table 112. Shanghai Micro Electronics Latest Developments
Table 113. U-Precision Tech Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 114. U-Precision Tech Wafer Bonding Equipment Product Portfolios and Specifications
Table 115. U-Precision Tech Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 116. U-Precision Tech Main Business
Table 117. U-Precision Tech Latest Developments
Table 118. Hutem Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 119. Hutem Wafer Bonding Equipment Product Portfolios and Specifications
Table 120. Hutem Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 121. Hutem Main Business
Table 122. Hutem Latest Developments
Table 123. Canon Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 124. Canon Wafer Bonding Equipment Product Portfolios and Specifications
Table 125. Canon Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 126. Canon Main Business
Table 127. Canon Latest Developments
Table 128. Bondtech Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 129. Bondtech Wafer Bonding Equipment Product Portfolios and Specifications
Table 130. Bondtech Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 131. Bondtech Main Business
Table 132. Bondtech Latest Developments
Table 133. TAZMO Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 134. TAZMO Wafer Bonding Equipment Product Portfolios and Specifications
Table 135. TAZMO Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 136. TAZMO Main Business
Table 137. TAZMO Latest Developments
Table 138. TOK Basic Information, Wafer Bonding Equipment Manufacturing Base, Sales Area and Its Competitors
Table 139. TOK Wafer Bonding Equipment Product Portfolios and Specifications
Table 140. TOK Wafer Bonding Equipment Sales (Units), Revenue ($ Million), Price (K USD/Unit) and Gross Margin (2018-2023)
Table 141. TOK Main Business
Table 142. TOK Latest Developments
List of Figures
Figure 1. Picture of Wafer Bonding Equipment
Figure 2. Wafer Bonding Equipment Report Years Considered
Figure 3. Research Objectives
Figure 4. Research Methodology
Figure 5. Research Process and Data Source
Figure 6. Global Wafer Bonding Equipment Sales Growth Rate 2018-2029 (Units)
Figure 7. Global Wafer Bonding Equipment Revenue Growth Rate 2018-2029 ($ Millions)
Figure 8. Wafer Bonding Equipment Sales by Region (2018, 2022 & 2029) & ($ Millions)
Figure 9. Product Picture of Fully Automatic
Figure 10. Product Picture of Semi Automatic
Figure 11. Global Wafer Bonding Equipment Sales Market Share by Type in 2022
Figure 12. Global Wafer Bonding Equipment Revenue Market Share by Type (2018-2023)
Figure 13. Wafer Bonding Equipment Consumed in MEMS
Figure 14. Global Wafer Bonding Equipment Market: MEMS (2018-2023) & (Units)
Figure 15. Wafer Bonding Equipment Consumed in Advanced Packaging
Figure 16. Global Wafer Bonding Equipment Market: Advanced Packaging (2018-2023) & (Units)
Figure 17. Wafer Bonding Equipment Consumed in CIS
Figure 18. Global Wafer Bonding Equipment Market: CIS (2018-2023) & (Units)
Figure 19. Wafer Bonding Equipment Consumed in Others
Figure 20. Global Wafer Bonding Equipment Market: Others (2018-2023) & (Units)
Figure 21. Global Wafer Bonding Equipment Sales Market Share by Application (2022)
Figure 22. Global Wafer Bonding Equipment Revenue Market Share by Application in 2022
Figure 23. Wafer Bonding Equipment Sales Market by Company in 2022 (Units)
Figure 24. Global Wafer Bonding Equipment Sales Market Share by Company in 2022
Figure 25. Wafer Bonding Equipment Revenue Market by Company in 2022 ($ Million)
Figure 26. Global Wafer Bonding Equipment Revenue Market Share by Company in 2022
Figure 27. Global Wafer Bonding Equipment Sales Market Share by Geographic Region (2018-2023)
Figure 28. Global Wafer Bonding Equipment Revenue Market Share by Geographic Region in 2022
Figure 29. Americas Wafer Bonding Equipment Sales 2018-2023 (Units)
Figure 30. Americas Wafer Bonding Equipment Revenue 2018-2023 ($ Millions)
Figure 31. APAC Wafer Bonding Equipment Sales 2018-2023 (Units)
Figure 32. APAC Wafer Bonding Equipment Revenue 2018-2023 ($ Millions)
Figure 33. Europe Wafer Bonding Equipment Sales 2018-2023 (Units)
Figure 34. Europe Wafer Bonding Equipment Revenue 2018-2023 ($ Millions)
Figure 35. Middle East & Africa Wafer Bonding Equipment Sales 2018-2023 (Units)
Figure 36. Middle East & Africa Wafer Bonding Equipment Revenue 2018-2023 ($ Millions)
Figure 37. Americas Wafer Bonding Equipment Sales Market Share by Country in 2022
Figure 38. Americas Wafer Bonding Equipment Revenue Market Share by Country in 2022
Figure 39. Americas Wafer Bonding Equipment Sales Market Share by Type (2018-2023)
Figure 40. Americas Wafer Bonding Equipment Sales Market Share by Application (2018-2023)
Figure 41. United States Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 42. Canada Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 43. Mexico Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 44. Brazil Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 45. APAC Wafer Bonding Equipment Sales Market Share by Region in 2022
Figure 46. APAC Wafer Bonding Equipment Revenue Market Share by Regions in 2022
Figure 47. APAC Wafer Bonding Equipment Sales Market Share by Type (2018-2023)
Figure 48. APAC Wafer Bonding Equipment Sales Market Share by Application (2018-2023)
Figure 49. China Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 50. Japan Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 51. South Korea Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 52. Southeast Asia Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 53. India Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 54. Australia Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 55. China Taiwan Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 56. Europe Wafer Bonding Equipment Sales Market Share by Country in 2022
Figure 57. Europe Wafer Bonding Equipment Revenue Market Share by Country in 2022
Figure 58. Europe Wafer Bonding Equipment Sales Market Share by Type (2018-2023)
Figure 59. Europe Wafer Bonding Equipment Sales Market Share by Application (2018-2023)
Figure 60. Germany Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 61. France Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 62. UK Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 63. Italy Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 64. Russia Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 65. Middle East & Africa Wafer Bonding Equipment Sales Market Share by Country in 2022
Figure 66. Middle East & Africa Wafer Bonding Equipment Revenue Market Share by Country in 2022
Figure 67. Middle East & Africa Wafer Bonding Equipment Sales Market Share by Type (2018-2023)
Figure 68. Middle East & Africa Wafer Bonding Equipment Sales Market Share by Application (2018-2023)
Figure 69. Egypt Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 70. South Africa Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 71. Israel Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 72. Turkey Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 73. GCC Country Wafer Bonding Equipment Revenue Growth 2018-2023 ($ Millions)
Figure 74. Manufacturing Cost Structure Analysis of Wafer Bonding Equipment in 2022
Figure 75. Manufacturing Process Analysis of Wafer Bonding Equipment
Figure 76. Industry Chain Structure of Wafer Bonding Equipment
Figure 77. Channels of Distribution
Figure 78. Global Wafer Bonding Equipment Sales Market Forecast by Region (2024-2029)
Figure 79. Global Wafer Bonding Equipment Revenue Market Share Forecast by Region (2024-2029)
Figure 80. Global Wafer Bonding Equipment Sales Market Share Forecast by Type (2024-2029)
Figure 81. Global Wafer Bonding Equipment Revenue Market Share Forecast by Type (2024-2029)
Figure 82. Global Wafer Bonding Equipment Sales Market Share Forecast by Application (2024-2029)
Figure 83. Global Wafer Bonding Equipment Revenue Market Share Forecast by Application (2024-2029)

※参考情報

ウェーハ接合装置は、半導体製造プロセスにおいて重要な役割を果たす機器です。これらの装置は、複数のウェーハを高い精度と強度で接合するために用いられます。半導体デバイスの性能向上や小型化が求められる現代において、ウェーハ接合技術はますます重要性を増しています。

ウェーハ接合装置の概念は、主に異なる材料または同一材料のウェーハ同士を接合し、その後の加工プロセスに進むことを目的としています。この接合プロセスは、電子デバイスの性能を向上させるために不可欠です。特に、3D積層技術や多層構造デバイスの発展により、ウェーハ接合技術の重要性は高まっています。

ウェーハ接合装置の特徴には、高精度な位置決めや高度な温度管理、均一な接合面利得などが挙げられます。これらの特徴は、デバイスの性能や信頼性を保証するために必要不可欠です。また、ウェーハ接合装置は通常、真空環境下で稼働し、外部からの汚染や異物混入を避けるための設計が施されています。そのため、装置は高度な清浄度を維持することが求められます。

ウェーハ接合にはさまざまな方法が存在し、それぞれの方法が特徴的な用途と利点を持っています。主な種類としては、接着剤を用いた接合、熱接合、圧力接合、そして分子間力を利用した接合（例えば、バンピング技術）などがあります。これらの方法は、接合する材料の種類や要求される性質によって選択されます。

たとえば、接着剤を用いた接合は、比較的低温で行うことができるため、熱に敏感な材料に適しています。また、熱接合は、高温での長時間処理が求められる場合に効果的です。この場合、高温での接合により、接合面での結晶構造を整え、より高い電気的特性を持つデバイスを形成することが可能です。

また、圧力接合では、物理的な圧力を加えることで接合を行います。これにより、密着度が増し、接合部の強度が向上します。分子間力を利用した接合方法は、極めて薄いウェーハ間でも強力な結合を実現できるため、超小型デバイスの製造において重要です。

ウェーハ接合装置の用途は広範囲にわたります。これには、集積回路、MEMS（Micro-Electro-Mechanical Systems）、光電子デバイス、さらにはパワーデバイスなどが含まれます。集積回路分野では、異なる機能を持つチップを積層し、一つのパッケージ内にまとめる“システム・オン・チップ（SoC）”の製造に欠かせない技術です。また、MEMSデバイスには、センサやアクチュエータが含まれており、これらの製造には高い精度が要求されます。

近年のトレンドとしては、3D積層技術やチップレットアーキテクチャが挙げられます。これらの技術は、異なる機能を持つチップを垂直に重ねることで、デバイスの性能を向上させ、面積を削減することを目的としています。このような新たなデバイス構造は、ウェーハ接合技術の進展によって実現可能となりました。

関連技術としては、ウエハーマッピング技術や測定技術があります。ウエハーマッピングでは、接合するウェーハの表面を正確に測定し、接合面を均一に保つことが重要です。また、接合後の検査技術も重要であり、接合部の品質を評価するための非破壊検査技術が用いられます。これにより、不良品を早期に検出し、製品の信頼性を高めることができます。

さらに、ウェーハ接合装置は、環境に優しい製造プロセスを実現するためにも進化しています。無害な接着剤の開発や、エネルギー効率の高い加熱プロセスが求められています。これにより、製造過程での環境負荷を軽減する取り組みが進められています。

ウェーハ接合技術は今後ますます発展し、半導体業界における重要な要素であり続けるでしょう。新材料の開発、さらなるプロセスの革新、更には新しいアーキテクチャの提案などにより、ウェーハ接合装置は未来の製造技術においても中心的な役割を果たします。これにより、私たちの生活をより便利にする革新的な製品の実現が期待されます。

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