カテゴリー： Market Monitor Global, 世界, 産業機械/建設

3D成形相互接続デバイス（MID）の世界市場見通し2023年-2029年

◆英語タイトル：3D Molded Interconnect Device (MID) Market, Global Outlook and Forecast 2023-2029
	◆商品コード：MMG23LY6982 ◆発行会社（リサーチ会社）：Market Monitor Global ◆発行日：2023年7月（※2025年版があります。お問い合わせください。） ◆ページ数：70 ◆レポート形式：英語 / PDF ◆納品方法：Eメール（受注後2-3営業日） ◆調査対象地域：グローバル ◆産業分野：機械&装置

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Enterprise User（閲覧人数制限なし）	USD4,875 ⇒換算￥702,000	見積依頼/購入/質問フォーム

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❖ レポートの概要 ❖

Global 3D Molded Interconnect Device (MID) Market 調査レポートは次の情報を含め、グローバルにおけるの3D成形相互接続デバイス（MID）市場規模と予測を収録しています。・世界の3D成形相互接続デバイス（MID）市場：売上、2018年-2023年、2024年-2029年
・世界の3D成形相互接続デバイス（MID）市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界の3D成形相互接続デバイス（MID）市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。アメリカ市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「アンテナ＆接続モジュール」セグメントは今後6年間、000%の年平均成長率で2029年までに000Mドルに成長すると予測されています。

3D成形相互接続デバイス（MID）のグローバル主要企業は、Molex、 TE Connectivity、 Amphenol Corporation、 LPKF Laser & Electronics、 Taoglas、 Harting、 Arlington Plating Company、 MID Solutions、 2E Mechatronic、 KYOCERA AVX、 Johnanなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

マーケットモニターグローバル社は、3D成形相互接続デバイス（MID）のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別マーケット分析】

世界の3D成形相互接続デバイス（MID）市場：タイプ別、2018年-2023年、2024年-2029年
世界の3D成形相互接続デバイス（MID）市場：タイプ別市場シェア、2022年
・アンテナ＆接続モジュール、センサー、コネクタ＆スイッチ、照明システム、その他

世界の3D成形相互接続デバイス（MID）市場：用途別、2018年-2023年、2024年-2029年
世界の3D成形相互接続デバイス（MID）市場：用途別市場シェア、2022年
・通信、家庭用電化製品、自動車、医療、軍事＆航空宇宙、その他

世界の3D成形相互接続デバイス（MID）市場：地域・国別、2018年-2023年、2024年-2029年
世界の3D成形相互接続デバイス（MID）市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競争分析】

また、当レポートは主要な参入企業の分析を提供します。
・主要企業における3D成形相互接続デバイス（MID）のグローバル売上、2018年-2023年
・主要企業における3D成形相互接続デバイス（MID）のグローバル売上シェア、2022年
・主要企業における3D成形相互接続デバイス（MID）のグローバル販売量、2018年-2023年
・主要企業における3D成形相互接続デバイス（MID）のグローバル販売量シェア、2022年

さらに、当レポートは主要企業の情報を提示します。
Molex、 TE Connectivity、 Amphenol Corporation、 LPKF Laser & Electronics、 Taoglas、 Harting、 Arlington Plating Company、 MID Solutions、 2E Mechatronic、 KYOCERA AVX、 Johnan

*************************************************************

・調査・分析レポートの概要
3D成形相互接続デバイス（MID）市場の定義
市場セグメント
世界の3D成形相互接続デバイス（MID）市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界の3D成形相互接続デバイス（MID）市場規模
世界の3D成形相互接続デバイス（MID）市場規模：2022年 VS 2029年
世界の3D成形相互接続デバイス（MID）市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでの3D成形相互接続デバイス（MID）の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業の3D成形相互接続デバイス（MID）製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：アンテナ＆接続モジュール、センサー、コネクタ＆スイッチ、照明システム、その他
3D成形相互接続デバイス（MID）のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：通信、家庭用電化製品、自動車、医療、軍事＆航空宇宙、その他
3D成形相互接続デバイス（MID）の用途別グローバル売上・予測

・地域別市場分析
地域別3D成形相互接続デバイス（MID）市場規模 2022年と2029年
地域別3D成形相互接続デバイス（MID）売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業の情報（企業概要、事業概要、主要製品、売上、ニュースなど）
Molex、 TE Connectivity、 Amphenol Corporation、 LPKF Laser & Electronics、 Taoglas、 Harting、 Arlington Plating Company、 MID Solutions、 2E Mechatronic、 KYOCERA AVX、 Johnan
...

Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers.
This report aims to provide a comprehensive presentation of the global market for 3D Molded Interconnect Device (MID), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D Molded Interconnect Device (MID). This report contains market size and forecasts of 3D Molded Interconnect Device (MID) in global, including the following market information:
Global 3D Molded Interconnect Device (MID) Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global 3D Molded Interconnect Device (MID) Market Sales, 2018-2023, 2024-2029, (Units)
Global top five 3D Molded Interconnect Device (MID) companies in 2022 (%)
The global 3D Molded Interconnect Device (MID) market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Antennae and Connectivity Modules Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of 3D Molded Interconnect Device (MID) include Molex, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, Taoglas, Harting, Arlington Plating Company, MID Solutions and 2E Mechatronic, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the 3D Molded Interconnect Device (MID) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D Molded Interconnect Device (MID) Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global 3D Molded Interconnect Device (MID) Market Segment Percentages, by Type, 2022 (%)
Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting Systems
Others
Global 3D Molded Interconnect Device (MID) Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global 3D Molded Interconnect Device (MID) Market Segment Percentages, by Application, 2022 (%)
Telecommunications
Consumer Electronics
Automotive
Medical
Military & Aerospace
Others
Global 3D Molded Interconnect Device (MID) Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global 3D Molded Interconnect Device (MID) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D Molded Interconnect Device (MID) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies 3D Molded Interconnect Device (MID) revenues share in global market, 2022 (%)
Key companies 3D Molded Interconnect Device (MID) sales in global market, 2018-2023 (Estimated), (Units)
Key companies 3D Molded Interconnect Device (MID) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Molex
TE Connectivity
Amphenol Corporation
LPKF Laser & Electronics
Taoglas
Harting
Arlington Plating Company
MID Solutions
2E Mechatronic
KYOCERA AVX
Johnan
Outline of Major Chapters:
Chapter 1: Introduces the definition of 3D Molded Interconnect Device (MID), market overview.
Chapter 2: Global 3D Molded Interconnect Device (MID) market size in revenue and volume.
Chapter 3: Detailed analysis of 3D Molded Interconnect Device (MID) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of 3D Molded Interconnect Device (MID) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global 3D Molded Interconnect Device (MID) capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 3D Molded Interconnect Device (MID) Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global 3D Molded Interconnect Device (MID) Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global 3D Molded Interconnect Device (MID) Overall Market Size
2.1 Global 3D Molded Interconnect Device (MID) Market Size: 2022 VS 2029
2.2 Global 3D Molded Interconnect Device (MID) Revenue, Prospects & Forecasts: 2018-2029
2.3 Global 3D Molded Interconnect Device (MID) Sales: 2018-2029
3 Company Landscape
3.1 Top 3D Molded Interconnect Device (MID) Players in Global Market
3.2 Top Global 3D Molded Interconnect Device (MID) Companies Ranked by Revenue
3.3 Global 3D Molded Interconnect Device (MID) Revenue by Companies
3.4 Global 3D Molded Interconnect Device (MID) Sales by Companies
3.5 Global 3D Molded Interconnect Device (MID) Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 3D Molded Interconnect Device (MID) Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers 3D Molded Interconnect Device (MID) Product Type
3.8 Tier 1, Tier 2 and Tier 3 3D Molded Interconnect Device (MID) Players in Global Market
3.8.1 List of Global Tier 1 3D Molded Interconnect Device (MID) Companies
3.8.2 List of Global Tier 2 and Tier 3 3D Molded Interconnect Device (MID) Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global 3D Molded Interconnect Device (MID) Market Size Markets, 2022 & 2029
4.1.2 Antennae and Connectivity Modules
4.1.3 Sensors
4.1.4 Connectors and Switches
4.1.5 Lighting Systems
4.1.6 Others
4.2 By Type – Global 3D Molded Interconnect Device (MID) Revenue & Forecasts
4.2.1 By Type – Global 3D Molded Interconnect Device (MID) Revenue, 2018-2023
4.2.2 By Type – Global 3D Molded Interconnect Device (MID) Revenue, 2024-2029
4.2.3 By Type – Global 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
4.3 By Type – Global 3D Molded Interconnect Device (MID) Sales & Forecasts
4.3.1 By Type – Global 3D Molded Interconnect Device (MID) Sales, 2018-2023
4.3.2 By Type – Global 3D Molded Interconnect Device (MID) Sales, 2024-2029
4.3.3 By Type – Global 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
4.4 By Type – Global 3D Molded Interconnect Device (MID) Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global 3D Molded Interconnect Device (MID) Market Size, 2022 & 2029
5.1.2 Telecommunications
5.1.3 Consumer Electronics
5.1.4 Automotive
5.1.5 Medical
5.1.6 Military & Aerospace
5.1.7 Others
5.2 By Application – Global 3D Molded Interconnect Device (MID) Revenue & Forecasts
5.2.1 By Application – Global 3D Molded Interconnect Device (MID) Revenue, 2018-2023
5.2.2 By Application – Global 3D Molded Interconnect Device (MID) Revenue, 2024-2029
5.2.3 By Application – Global 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
5.3 By Application – Global 3D Molded Interconnect Device (MID) Sales & Forecasts
5.3.1 By Application – Global 3D Molded Interconnect Device (MID) Sales, 2018-2023
5.3.2 By Application – Global 3D Molded Interconnect Device (MID) Sales, 2024-2029
5.3.3 By Application – Global 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
5.4 By Application – Global 3D Molded Interconnect Device (MID) Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global 3D Molded Interconnect Device (MID) Market Size, 2022 & 2029
6.2 By Region – Global 3D Molded Interconnect Device (MID) Revenue & Forecasts
6.2.1 By Region – Global 3D Molded Interconnect Device (MID) Revenue, 2018-2023
6.2.2 By Region – Global 3D Molded Interconnect Device (MID) Revenue, 2024-2029
6.2.3 By Region – Global 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
6.3 By Region – Global 3D Molded Interconnect Device (MID) Sales & Forecasts
6.3.1 By Region – Global 3D Molded Interconnect Device (MID) Sales, 2018-2023
6.3.2 By Region – Global 3D Molded Interconnect Device (MID) Sales, 2024-2029
6.3.3 By Region – Global 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America 3D Molded Interconnect Device (MID) Revenue, 2018-2029
6.4.2 By Country – North America 3D Molded Interconnect Device (MID) Sales, 2018-2029
6.4.3 US 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.4.4 Canada 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.4.5 Mexico 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe 3D Molded Interconnect Device (MID) Revenue, 2018-2029
6.5.2 By Country – Europe 3D Molded Interconnect Device (MID) Sales, 2018-2029
6.5.3 Germany 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.5.4 France 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.5.5 U.K. 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.5.6 Italy 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.5.7 Russia 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.5.8 Nordic Countries 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.5.9 Benelux 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia 3D Molded Interconnect Device (MID) Revenue, 2018-2029
6.6.2 By Region – Asia 3D Molded Interconnect Device (MID) Sales, 2018-2029
6.6.3 China 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.6.4 Japan 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.6.5 South Korea 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.6.6 Southeast Asia 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.6.7 India 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America 3D Molded Interconnect Device (MID) Revenue, 2018-2029
6.7.2 By Country – South America 3D Molded Interconnect Device (MID) Sales, 2018-2029
6.7.3 Brazil 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.7.4 Argentina 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa 3D Molded Interconnect Device (MID) Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa 3D Molded Interconnect Device (MID) Sales, 2018-2029
6.8.3 Turkey 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.8.4 Israel 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.8.5 Saudi Arabia 3D Molded Interconnect Device (MID) Market Size, 2018-2029
6.8.6 UAE 3D Molded Interconnect Device (MID) Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 Molex
7.1.1 Molex Company Summary
7.1.2 Molex Business Overview
7.1.3 Molex 3D Molded Interconnect Device (MID) Major Product Offerings
7.1.4 Molex 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.1.5 Molex Key News & Latest Developments
7.2 TE Connectivity
7.2.1 TE Connectivity Company Summary
7.2.2 TE Connectivity Business Overview
7.2.3 TE Connectivity 3D Molded Interconnect Device (MID) Major Product Offerings
7.2.4 TE Connectivity 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.2.5 TE Connectivity Key News & Latest Developments
7.3 Amphenol Corporation
7.3.1 Amphenol Corporation Company Summary
7.3.2 Amphenol Corporation Business Overview
7.3.3 Amphenol Corporation 3D Molded Interconnect Device (MID) Major Product Offerings
7.3.4 Amphenol Corporation 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.3.5 Amphenol Corporation Key News & Latest Developments
7.4 LPKF Laser & Electronics
7.4.1 LPKF Laser & Electronics Company Summary
7.4.2 LPKF Laser & Electronics Business Overview
7.4.3 LPKF Laser & Electronics 3D Molded Interconnect Device (MID) Major Product Offerings
7.4.4 LPKF Laser & Electronics 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.4.5 LPKF Laser & Electronics Key News & Latest Developments
7.5 Taoglas
7.5.1 Taoglas Company Summary
7.5.2 Taoglas Business Overview
7.5.3 Taoglas 3D Molded Interconnect Device (MID) Major Product Offerings
7.5.4 Taoglas 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.5.5 Taoglas Key News & Latest Developments
7.6 Harting
7.6.1 Harting Company Summary
7.6.2 Harting Business Overview
7.6.3 Harting 3D Molded Interconnect Device (MID) Major Product Offerings
7.6.4 Harting 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.6.5 Harting Key News & Latest Developments
7.7 Arlington Plating Company
7.7.1 Arlington Plating Company Company Summary
7.7.2 Arlington Plating Company Business Overview
7.7.3 Arlington Plating Company 3D Molded Interconnect Device (MID) Major Product Offerings
7.7.4 Arlington Plating Company 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.7.5 Arlington Plating Company Key News & Latest Developments
7.8 MID Solutions
7.8.1 MID Solutions Company Summary
7.8.2 MID Solutions Business Overview
7.8.3 MID Solutions 3D Molded Interconnect Device (MID) Major Product Offerings
7.8.4 MID Solutions 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.8.5 MID Solutions Key News & Latest Developments
7.9 2E Mechatronic
7.9.1 2E Mechatronic Company Summary
7.9.2 2E Mechatronic Business Overview
7.9.3 2E Mechatronic 3D Molded Interconnect Device (MID) Major Product Offerings
7.9.4 2E Mechatronic 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.9.5 2E Mechatronic Key News & Latest Developments
7.10 KYOCERA AVX
7.10.1 KYOCERA AVX Company Summary
7.10.2 KYOCERA AVX Business Overview
7.10.3 KYOCERA AVX 3D Molded Interconnect Device (MID) Major Product Offerings
7.10.4 KYOCERA AVX 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.10.5 KYOCERA AVX Key News & Latest Developments
7.11 Johnan
7.11.1 Johnan Company Summary
7.11.2 Johnan 3D Molded Interconnect Device (MID) Business Overview
7.11.3 Johnan 3D Molded Interconnect Device (MID) Major Product Offerings
7.11.4 Johnan 3D Molded Interconnect Device (MID) Sales and Revenue in Global (2018-2023)
7.11.5 Johnan Key News & Latest Developments
8 Global 3D Molded Interconnect Device (MID) Production Capacity, Analysis
8.1 Global 3D Molded Interconnect Device (MID) Production Capacity, 2018-2029
8.2 3D Molded Interconnect Device (MID) Production Capacity of Key Manufacturers in Global Market
8.3 Global 3D Molded Interconnect Device (MID) Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 3D Molded Interconnect Device (MID) Supply Chain Analysis
10.1 3D Molded Interconnect Device (MID) Industry Value Chain
10.2 3D Molded Interconnect Device (MID) Upstream Market
10.3 3D Molded Interconnect Device (MID) Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 3D Molded Interconnect Device (MID) Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

List of Tables
Table 1. Key Players of 3D Molded Interconnect Device (MID) in Global Market
Table 2. Top 3D Molded Interconnect Device (MID) Players in Global Market, Ranking by Revenue (2022)
Table 3. Global 3D Molded Interconnect Device (MID) Revenue by Companies, (US$, Mn), 2018-2023
Table 4. Global 3D Molded Interconnect Device (MID) Revenue Share by Companies, 2018-2023
Table 5. Global 3D Molded Interconnect Device (MID) Sales by Companies, (Units), 2018-2023
Table 6. Global 3D Molded Interconnect Device (MID) Sales Share by Companies, 2018-2023
Table 7. Key Manufacturers 3D Molded Interconnect Device (MID) Price (2018-2023) & (US$/Unit)
Table 8. Global Manufacturers 3D Molded Interconnect Device (MID) Product Type
Table 9. List of Global Tier 1 3D Molded Interconnect Device (MID) Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 3D Molded Interconnect Device (MID) Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type – Global 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Global 3D Molded Interconnect Device (MID) Revenue (US$, Mn), 2018-2023
Table 13. By Type - Global 3D Molded Interconnect Device (MID) Revenue (US$, Mn), 2024-2029
Table 14. By Type - Global 3D Molded Interconnect Device (MID) Sales (Units), 2018-2023
Table 15. By Type - Global 3D Molded Interconnect Device (MID) Sales (Units), 2024-2029
Table 16. By Application – Global 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2022 & 2029
Table 17. By Application - Global 3D Molded Interconnect Device (MID) Revenue (US$, Mn), 2018-2023
Table 18. By Application - Global 3D Molded Interconnect Device (MID) Revenue (US$, Mn), 2024-2029
Table 19. By Application - Global 3D Molded Interconnect Device (MID) Sales (Units), 2018-2023
Table 20. By Application - Global 3D Molded Interconnect Device (MID) Sales (Units), 2024-2029
Table 21. By Region – Global 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2022 VS 2029
Table 22. By Region - Global 3D Molded Interconnect Device (MID) Revenue (US$, Mn), 2018-2023
Table 23. By Region - Global 3D Molded Interconnect Device (MID) Revenue (US$, Mn), 2024-2029
Table 24. By Region - Global 3D Molded Interconnect Device (MID) Sales (Units), 2018-2023
Table 25. By Region - Global 3D Molded Interconnect Device (MID) Sales (Units), 2024-2029
Table 26. By Country - North America 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2023
Table 27. By Country - North America 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2024-2029
Table 28. By Country - North America 3D Molded Interconnect Device (MID) Sales, (Units), 2018-2023
Table 29. By Country - North America 3D Molded Interconnect Device (MID) Sales, (Units), 2024-2029
Table 30. By Country - Europe 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2023
Table 31. By Country - Europe 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2024-2029
Table 32. By Country - Europe 3D Molded Interconnect Device (MID) Sales, (Units), 2018-2023
Table 33. By Country - Europe 3D Molded Interconnect Device (MID) Sales, (Units), 2024-2029
Table 34. By Region - Asia 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2023
Table 35. By Region - Asia 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2024-2029
Table 36. By Region - Asia 3D Molded Interconnect Device (MID) Sales, (Units), 2018-2023
Table 37. By Region - Asia 3D Molded Interconnect Device (MID) Sales, (Units), 2024-2029
Table 38. By Country - South America 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2023
Table 39. By Country - South America 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2024-2029
Table 40. By Country - South America 3D Molded Interconnect Device (MID) Sales, (Units), 2018-2023
Table 41. By Country - South America 3D Molded Interconnect Device (MID) Sales, (Units), 2024-2029
Table 42. By Country - Middle East & Africa 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2023
Table 43. By Country - Middle East & Africa 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2024-2029
Table 44. By Country - Middle East & Africa 3D Molded Interconnect Device (MID) Sales, (Units), 2018-2023
Table 45. By Country - Middle East & Africa 3D Molded Interconnect Device (MID) Sales, (Units), 2024-2029
Table 46. Molex Company Summary
Table 47. Molex 3D Molded Interconnect Device (MID) Product Offerings
Table 48. Molex 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 49. Molex Key News & Latest Developments
Table 50. TE Connectivity Company Summary
Table 51. TE Connectivity 3D Molded Interconnect Device (MID) Product Offerings
Table 52. TE Connectivity 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 53. TE Connectivity Key News & Latest Developments
Table 54. Amphenol Corporation Company Summary
Table 55. Amphenol Corporation 3D Molded Interconnect Device (MID) Product Offerings
Table 56. Amphenol Corporation 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 57. Amphenol Corporation Key News & Latest Developments
Table 58. LPKF Laser & Electronics Company Summary
Table 59. LPKF Laser & Electronics 3D Molded Interconnect Device (MID) Product Offerings
Table 60. LPKF Laser & Electronics 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 61. LPKF Laser & Electronics Key News & Latest Developments
Table 62. Taoglas Company Summary
Table 63. Taoglas 3D Molded Interconnect Device (MID) Product Offerings
Table 64. Taoglas 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 65. Taoglas Key News & Latest Developments
Table 66. Harting Company Summary
Table 67. Harting 3D Molded Interconnect Device (MID) Product Offerings
Table 68. Harting 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 69. Harting Key News & Latest Developments
Table 70. Arlington Plating Company Company Summary
Table 71. Arlington Plating Company 3D Molded Interconnect Device (MID) Product Offerings
Table 72. Arlington Plating Company 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 73. Arlington Plating Company Key News & Latest Developments
Table 74. MID Solutions Company Summary
Table 75. MID Solutions 3D Molded Interconnect Device (MID) Product Offerings
Table 76. MID Solutions 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 77. MID Solutions Key News & Latest Developments
Table 78. 2E Mechatronic Company Summary
Table 79. 2E Mechatronic 3D Molded Interconnect Device (MID) Product Offerings
Table 80. 2E Mechatronic 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 81. 2E Mechatronic Key News & Latest Developments
Table 82. KYOCERA AVX Company Summary
Table 83. KYOCERA AVX 3D Molded Interconnect Device (MID) Product Offerings
Table 84. KYOCERA AVX 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 85. KYOCERA AVX Key News & Latest Developments
Table 86. Johnan Company Summary
Table 87. Johnan 3D Molded Interconnect Device (MID) Product Offerings
Table 88. Johnan 3D Molded Interconnect Device (MID) Sales (Units), Revenue (US$, Mn) and Average Price (US$/Unit) (2018-2023)
Table 89. Johnan Key News & Latest Developments
Table 90. 3D Molded Interconnect Device (MID) Production Capacity (Units) of Key Manufacturers in Global Market, 2021-2023 (Units)
Table 91. Global 3D Molded Interconnect Device (MID) Capacity Market Share of Key Manufacturers, 2021-2023
Table 92. Global 3D Molded Interconnect Device (MID) Production by Region, 2018-2023 (Units)
Table 93. Global 3D Molded Interconnect Device (MID) Production by Region, 2024-2029 (Units)
Table 94. 3D Molded Interconnect Device (MID) Market Opportunities & Trends in Global Market
Table 95. 3D Molded Interconnect Device (MID) Market Drivers in Global Market
Table 96. 3D Molded Interconnect Device (MID) Market Restraints in Global Market
Table 97. 3D Molded Interconnect Device (MID) Raw Materials
Table 98. 3D Molded Interconnect Device (MID) Raw Materials Suppliers in Global Market
Table 99. Typical 3D Molded Interconnect Device (MID) Downstream
Table 100. 3D Molded Interconnect Device (MID) Downstream Clients in Global Market
Table 101. 3D Molded Interconnect Device (MID) Distributors and Sales Agents in Global Market
List of Figures
Figure 1. 3D Molded Interconnect Device (MID) Segment by Type in 2022
Figure 2. 3D Molded Interconnect Device (MID) Segment by Application in 2022
Figure 3. Global 3D Molded Interconnect Device (MID) Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global 3D Molded Interconnect Device (MID) Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global 3D Molded Interconnect Device (MID) Revenue, 2018-2029 (US$, Mn)
Figure 7. 3D Molded Interconnect Device (MID) Sales in Global Market: 2018-2029 (Units)
Figure 8. The Top 3 and 5 Players Market Share by 3D Molded Interconnect Device (MID) Revenue in 2022
Figure 9. By Type - Global 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2022 & 2029
Figure 10. By Type - Global 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 11. By Type - Global 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 12. By Type - Global 3D Molded Interconnect Device (MID) Price (US$/Unit), 2018-2029
Figure 13. By Application - Global 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2022 & 2029
Figure 14. By Application - Global 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 15. By Application - Global 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 16. By Application - Global 3D Molded Interconnect Device (MID) Price (US$/Unit), 2018-2029
Figure 17. By Region - Global 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2022 & 2029
Figure 18. By Region - Global 3D Molded Interconnect Device (MID) Revenue Market Share, 2018 VS 2022 VS 2029
Figure 19. By Region - Global 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 20. By Region - Global 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 21. By Country - North America 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 22. By Country - North America 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 23. US 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 24. Canada 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 25. Mexico 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 26. By Country - Europe 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 27. By Country - Europe 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 28. Germany 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 29. France 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 30. U.K. 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 31. Italy 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 32. Russia 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 33. Nordic Countries 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 34. Benelux 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 35. By Region - Asia 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 36. By Region - Asia 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 37. China 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 38. Japan 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 39. South Korea 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 40. Southeast Asia 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 41. India 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 42. By Country - South America 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 43. By Country - South America 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 44. Brazil 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 45. Argentina 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 46. By Country - Middle East & Africa 3D Molded Interconnect Device (MID) Revenue Market Share, 2018-2029
Figure 47. By Country - Middle East & Africa 3D Molded Interconnect Device (MID) Sales Market Share, 2018-2029
Figure 48. Turkey 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 49. Israel 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 50. Saudi Arabia 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 51. UAE 3D Molded Interconnect Device (MID) Revenue, (US$, Mn), 2018-2029
Figure 52. Global 3D Molded Interconnect Device (MID) Production Capacity (Units), 2018-2029
Figure 53. The Percentage of Production 3D Molded Interconnect Device (MID) by Region, 2022 VS 2029
Figure 54. 3D Molded Interconnect Device (MID) Industry Value Chain
Figure 55. Marketing Channels

※参考情報

3D成形相互接続デバイス（MID）は、電子部品の接続を行う新しい技術の一つであり、従来の配線技術に代わる効率的な手法を提供します。MIDの技術は、3D成形プロセスを用いることで、高度な機能性とコンパクトなデザインを実現します。この技術は、特に狭小スペースでの電子機器の設計において重要な意味を持っています。

MIDの基本的な定義としては、3D成形技術を用いて、基板上に導体パターンを形成することで、複数の電子コンポーネントが直接接続されるデバイスです。MIDは、通常のプリント基板（PCB）と異なり、3次元の形状を持つため、より自由なデザインが可能です。この自由度により、製品のコンパクト化や軽量化が進み、設計の柔軟性が向上します。

MIDの特徴として、一つ目には高い集積度があります。従来のPCBは、表面実装技術（SMT）に基づいており、部品同士の接続には導体パターンを広く配置する必要がありました。しかし、MID技術を利用することで、立体的な形状による接続が可能になり、デバイスの部品がより密接に配置できるようになります。この結果、デバイスのサイズが小さくなり、軽量化が実現されます。

二つ目の特徴として、製造プロセスの効率化があります。MIDは、一度の成形で基板と導体パターンが同時に作成されるため、複数の工程を経る必要が減少します。この効率化により、生産コストが低減し、製品の市場投入までの期間も短縮されます。

次に、高度な機能性もMIDの重要な特徴です。MIDは、導体パターンに加え、異なる材料を用いることができるため、多様な機能を持つデバイスを設計できます。例えば、センサーやアクチュエーター、通信モジュールなど、さまざまな電子機能を一つのデバイスに統合することが可能です。このような統合は、IoT（Internet of Things）やスマートデバイスの分野で特に重要です。

MIDにはいくつかの種類がありますが、一般的には「成形MID」と「積層MID」に分けられます。成形MIDは、プラスチック材料を用いた製造方法で、3D成形を通じて導体を埋め込む形で製造されます。一方、積層MIDは複数の層を積み重ねることで製造され、複雑な形状や機能性を実現します。さらに、3Dプリンティング技術を用いたMIDも新たな可能性を示しています。3Dプリンティングを活用すると、短納期での試作やカスタマイズが容易になるため、開発スピードが向上します。

MIDの用途は多岐にわたりますが、特に携帯電話やスマートフォン、医療機器、家電、自動車産業で注目されています。例えば、スマートフォンにおいては、コンパクトな設計が求められるため、MIDは部品の配置を最適化し、デバイス全体の厚みを削減するのに役立っています。また、医療機器やセンサーにおいては、複雑な機能が要求されるため、MIDの柔軟な設計が生かされます。

さらに、近年のIoTの普及に伴い、MIDはこれらのデバイス同士の接続にも重要な役割を果たしています。IoTデバイスは、センサーや通信機能が組み合わさった複雑な設計を必要としますが、MIDを利用することで、効率的に組み合わせることができます。これにより、各種データをリアルタイムで取得し、処理する能力が向上し、スマートホームやスマートシティの実現に寄与します。

関連技術としては、導電性プラスチックや印刷技術、表面実装技術などが挙げられます。導電性プラスチックは、MIDの導体パターン形成に利用され、軽量かつ柔軟な特性を持つため、様々な形状への対応が可能です。また、印刷技術を利用した導体パターンの形成は、コスト面での利点があり、多様な生産需要に対応できます。さらに、表面実装技術（SMT）との組み合わせによって、より高度な電子デバイスを実現することが期待されています。

総じて、3D成形相互接続デバイス（MID）は、高度な電子機器の設計や製造において革新的な技術と言えるでしょう。これまで以上に小型化、多機能化が求められる現代の電子機器において、MIDは非常に有用なソリューションを提供し、今後もその利用が拡大していくと考えられます。技術革新の進展とともに、MIDのさらなる可能性が期待されており、様々な分野での応用が進むことでしょう。

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